To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding. Renesas Electronics website: http://www.renesas.com April 1st, 2010 Renesas Electronics Corporation Issued by: Renesas Electronics Corporation (http://www.renesas.com) Send any inquiries to http://www.renesas.com/inquiry. Notice 1. 2. 3. 4. 5. 6. 7. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. 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Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anticrime systems; safety equipment; and medical equipment not specifically designed for life support. “Specific”: Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life. 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Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas Electronics. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries. (Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics. HD74HC4066 Quad Analog Switches/Quad Multiplexers REJ03D0651-0200 (Previous ADE-205-538) Rev.2.00 Mar 30, 2006 Description This switch has low “on” resistance and low “off” leakage. It is a bidirectional switch, thus any analog input may be used as an output and vice-versa. Also the HD74HC4066 switch contains linearization circuitry which lowers the “on” resistance and increases switch linearity. The HD74HC4066 device allows control of up to 12 V (peak) analog signals with digital control signals of the same range. Each switch has its own control input which disables each switch when low. Features • High Speed Operation • Wide Operating Voltage: VCC = 2 to 6 V • Low Quiescent Supply Current: ICC (static) = 1 µA max (Ta = 25°C) • Ordering Information Part Name Package Type HD74HC4066P DILP-14 pin HD74HC4066FPEL SOP-14 pin (JEITA) HD74HC4066RPEL SOP-14 pin (JEDEC) HD74HC4066TELL TSSOP-14 pin Package Code (Previous Code) PRDP0014AB-B (DP-14AV) PRSP0014DF-B (FP-14DAV) PRSP0014DE-A (FP-14DNV) PTSP0014JA-B (TTP-14DV) Package Abbreviation Taping Abbreviation (Quantity) P — FP EL (2,000 pcs/reel) RP EL (2,500 pcs/reel) T ELL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Function Table Control Switch L H OFF ON GND ≤ Vin ≤ VCC GND ≤ Vout ≤ VCC Rev.2.00 Mar 30, 2006 page 1 of 9 HD74HC4066 Pin Arrangement In 1 1 Out 1 2 Out 2 3 14 VCC In C 13 Control 1 Out 12 Control 4 In In 2 4 Control 2 5 Control 3 6 GND 7 Out C 11 In 4 C Out In C In 10 Out 4 9 Out 3 8 In 3 Out (Top view) Logic Diagram In/Out Out/In Control Absolute Maximum Ratings Item Symbol Rating Unit VCC VC –0.5 to +7.0 – 0.5 to VCC + 0.5 V V VIN/OUT ICC – 0.5 to VCC + 0.5 +50 V mA Switch I/O current (per pin) IGND IIN/OUT –50 ±25 mA mA Control input diode current Switch I/O diode current IIK IIOK ±20 ±20 mA mA Power dissipation Storage temperature range PT Tstg 500 –65 to +150 mW °C Supply voltage Control input voltage Switch I/O voltage Supply current (VCC) (GND) Rev.2.00 Mar 30, 2006 page 2 of 9 HD74HC4066 Recommended Operating Conditions Item Supply voltage Control input voltage Switch I/O voltage Operating temperature Input rise/fall time VCC = 2.0 V VCC = 4.5 V Symbol Min Typ Max Unit VCC VC 2 0 — — 6 VCC V V VIN/OUT Topr 0 –40 — — VCC +85 V °C tr , tf 0 0 — — 1000 500 ns ns 0 — 400 ns VCC = 6.0 V Electrical Characteristics Ta = 25°C Item Control input voltage Symbol VCC (V) VIH VIL “ON” resistance RON Ta = –40 to+85°C 2.0 Min 1.5 Typ — Max — Min 1.5 Max — 4.5 6.0 3.15 4.2 — — — — 3.15 4.2 — — 2.0 4.5 — — — — 0.5 1.35 — — 0.5 1.35 6.0 2.0 — — — 2000 1.8 5000 — — 1.8 6250 4.5 6.0 — — 100 60 200 170 — — 250 210 2.0 4.5 — — 50 3 — — — — — — — — 2 — — ±0.1 — — Unit Test Conditions V V Ω VC = VIH Vin = 0 to VCC Iin/out = 1 mA Ω — ±1.0 VC = VIH, Iin/out = 1 mA between any two channels µA VC = VIL VIN = VCC, Vout = GND or, Vin = GND, Vout = VCC µA VC = VIH Vin = VCC or GND ∆ON resistance between any two channels ∆RON OFF channel leakage current (switch off) IS (OFF) 6.0 6.0 OFF channel leakage current (switch on) Control input current IS (ON) 6.0 — — ±0.1 — ±1.0 Iin 6.0 — — ±0.1 — ±1.0 µA Vin = VCC or GND ICC 6.0 — — 1.0 — 10.0 µA Vin = VCC or GND Quiescent supply current Rev.2.00 Mar 30, 2006 page 3 of 9 HD74HC4066 Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND) Ta = 25°C Item Symbol VCC (V) Ta = –40 to +85°C Unit 2.0 Min — Typ 25 Max 60 Min — Max 75 4.5 6.0 — — 6 5 12 10 — — 15 13 2.0 4.5 — — 25 6 60 12 — — 75 15 6.0 2.0 — — 5 — 10 50 — — 13 65 4.5 6.0 — — 4 — 10 9 — — 13 11 2.0 4.5 — — — 10 115 23 — — 145 29 6.0 2.0 — — — — 20 115 — — 25 145 4.5 6.0 — — 14 — 23 20 — — 29 25 Sine wave distortion 4.5 — 0.05 — — — Band width (–3 dB) 4.5 — 30 — — — Feed through attenuation Cross talk between control input to signal I/O 4.5 — –50 — — — dB 2.0 — 25 — — — mA 4.5 6.0 — — 60 75 — — — — — — 4.5 — –50 — — — 2.0 — 20 — — — 4.5 6.0 — — 30 30 — — — — — — Cin — 5 10 — 10 pF Cin/out — 6 — — — pF Cin/out — 0.5 — — — pF CPD — 13 — — — pF Propagation delay time tPLH tPHL Propagation delay time tPLH tPHT Output enable time tZH Output disable time tLZ tHZ Cross talk between any two switches Maximum control frequency Control input capacitance Switch I/O capacitance Feed through capacitance Power dissipation capacitance Rev.2.00 Mar 30, 2006 page 4 of 9 ns Test Conditions RL = 10 kΩ Switch input to switch output ns ns RL = 10 kΩ ns RL = 1 kΩ ns RL = 1 kΩ % RL = 10 kΩ, CL = 50 pF, fIN = 1 kHz MHz RL = 600 Ω, CL = 50 pF, 20 log10Vout/Vin = –3dB RL = 600 Ω, CL = 50 pF, fIN = 1 MHz RL = 600 Ω, CL = 50 pF, fIN = 1 MHz RL = 600 Ω, CL = 50 pF, fIN = 1 MHz MHz RL = 1 kΩ, CL = 15 pF, Vout = 1/2 (VCC) dB HD74HC4066 Test Circuit Maximum Control Frequency VCC VCC VC VC 0V VCC Vout Vin = VCC GND RL = 1 kΩ CL = 15 pF Vout Vcc/2 Cross talk (Control Input to Switch Output) VC tf tr VCC VCC VCC Vin Rin = 600 Ω RL = 600 Ω GND VCC/2 90% VC Vout 10% GND CL = 50 pF 10% (f = 1 MHz) VCC/2 tr = tr = 6 ns Feed through Attenuation VCC VC = GND Vin (Sine Wave) 0.1 µF Vin fin Rin = 600 Ω VCC (OFF) Vout RL = 600 Ω GND VCC/2 (Vin = 0 dBm, f = 1 MHz) CL = 50 pF VCC/2 Sine Wave Distortion VC = VCC VCC Vin (Sine Wave) fin Vin 10 µF VCC (ON) GND Vout RL = 10 kΩ VCC/2 Rev.2.00 Mar 30, 2006 page 5 of 9 CL = 50 pF (Vin = 4 Vp-p, f = 1 kHz) HD74HC4066 Cin, Cout, Cin–out (Input, Output, and Feed through Capacitance) Cin-out 5V VC = GND VCC Signal Input Pin Commom Pin (OFF) GND Cin Cout Switch Frequency Response Band Width (-3dB) VCC VC = VCC Vin (Sine Wave) 0.1 µF fin Vin Rin = 600 Ω VCC (ON) Vout VCC/2 (Vin = 0 dBm, f = 1 MHz) RL = 600 Ω GND CL = 50 pF VCC/2 RON: ON Resistance VC = VIH Vin VCC VCC I/O O/I (ON) Vout GND V Vin-out IS (OFF): OFF Channel Leakage Current (Switch OFF) VC = VIL Vin = VCC or GND I/O A VCC VCC (OFF) GND Rev.2.00 Mar 30, 2006 page 6 of 9 Vout = VSS or VCC HD74HC4066 IS (ON): OFF Channel Leakage Current (Switch ON) VC = VIH I/O A Vin = VCC or GND VCC VCC Vout (ON) OPEN GND tPLH, tPHL: Propagation Delay Time (Switch Input to Switch Output) VC = VIH tr tf VCC VCC VCC (ON) Vin 90% Vin Vout GND RL = 10 kΩ 50% CL = 50 pF 50% tPLH 10% GND 10% tPHL VOH 50% Vout 50% VOL tZH, tZL/tHZ, tLZ: Output Enable and Disable Time tf VCC VCC VC = Vin VINH Vin 90% 90% 50% 50% 10% GND VCC Vout GND VCC tr RL = 1 kΩ tZH GND 90% 50% VOL VCC VOH tZL tLZ 50% Vout VOL Rev.2.00 Mar 30, 2006 page 7 of 9 tHZ VOH CL = 50 pF Vout GND 10% 10% HD74HC4066 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B Previous Code DP-14AV MASS[Typ.] 0.97g D 8 E 14 7 1 b3 A Z A1 Reference Symbol L e1 D E A A1 bp b3 c θ e Z L θ bp e c e1 ( Ni/Pd/Au plating ) JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 2.39 2.54 MASS[Typ.] 0.23g D F 14 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 8 c HE *2 E bp Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 Z 7 e *3 bp x Reference Symbol M A L1 A1 θ y L Detail F Rev.2.00 Mar 30, 2006 page 8 of 9 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 1.42 0.50 0.70 0.90 1.15 HD74HC4066 JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A *1 Previous Code FP-14DNV MASS[Typ.] 0.13g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 14 8 c *2 Index mark HE E bp Terminal cross section ( Ni/Pd/Au plating ) Reference Symbol 1 7 *3 e Z bp x M A L1 A1 θ L y Detail F JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-B *1 Previous Code TTP-14DV D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 8.65 9.05 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08 MASS[Typ.] 0.05g D F 14 8 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HE c *2 E bp Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 Reference Symbol 7 *3 Z bp x M L1 A e A1 θ L y Detail F Rev.2.00 Mar 30, 2006 page 9 of 9 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 5.00 5.30 4.40 0.03 0.07 0.10 1.10 0.15 0.20 0.25 0.10 0.15 0.20 0° 8° 6.20 6.40 6.60 0.65 0.13 0.10 0.83 0.4 0.5 0.6 1.0 Sales Strategic Planning Div. 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