MATERIAL DECLARATION SHEET Material Number P850-G120-WH Product Line TBU Compliance Date January-2008 RoHS Compliant Yes No. 1 Construction Element(subpart) Semiconductor Device MSL Homogeneous Material Silicon Chip 2 Lead Frame Copper alloy with silver plating 3 Bond wire Gold wire Die Attach Adhesive 5 Mold compound (halogen-free) Epoxy resin Matte tin plating 3.75 41.48 0.79 matte tin 40.11 2.78 Total weight This Document was updated on: Material weight [mg] 0.43 4 6 3 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. (%) 4.2 Doped silicon 7440-21-3 100 4.2 Copper Iron Tin Zinc Silver (plating) Gold Di-ester resin Functionalized ester Polymeric compound Silver Silica fused Epoxy resin Phenolic resin Carbon black Tin 7440-50-8 7439-89-6 7440-31-5 7440-66-6 7440-22-4 95.645 2.185 0.034 0.135 2.0 100 3 7 3 87 90.5 4.7 4.7 0.1 100 44.41 1.01 0.02 0.06 0.93 0.48 0.03 0.06 0.03 0.76 40.63 2.11 2.11 0.05 3.11 7440-57-5 proprietary proprietary proprietary 7440-22-4 60676-86-0 proprietary proprietary 1333-86-4 7440-31-5 46.43 0.48 0.88 44.9 3.11 89.34 January 12, 2010 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1