PL
IA
NT
Features
CO
M
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*R
oH
S
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Industry standard SMT package
Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
6 A output current
Up to 92 % efficiency
Small size, low profile
Cost-efficient
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Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Sequencing function
MXT6A-12SA SMT Non-Isolated Power Module
Description
Bourns® MXT6A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features
such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
Min.
Nom.
Max.
Units
8.3
12
14
4.5
Vdc
Adc
2.4
0.4
Vin
Vdc
Vdc
0.75
5.5
Current
0.0
6.0
Vdc
Adc
Voltage Setpoint Accuracy
-2.0
Notes
INPUT
Voltage
Current
Remote ON/OFF:
Low or Open =
High =
Standard
On
Off
-P Option
Off
On
10 µA max.
1 mA max.
OUTPUT
Voltage Adjustment Range
Line Regulation
2.0
0.3
Load Regulation
0.4
Temperature Regulation
0.4
Ripple (pk-pk) (20 MHz Bandwidth)
50
Ripple (rms)
15
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
% Vo,set
% Vo,set
% Vo,set
% Vo,set
0 to +85 °C
75
mVpk-pk
1 µF ceramic//10 µF tantalum capacitors
30
mVrms
1 µF ceramic//10 µF tantalum capacitors
200
25
mV
µs
1 µF ceramic//10 µF tantalum capacitors
50
50
mV
µs
10,000
kHrs
2 x 150 µF polymer capacitors
GENERAL
MTBF
Operating Temperature
-40
+85
°C
Storage Temperature
-55
+125
°C
Switching Frequency
300
Efficiency
81.0
%
84.0
%
86.0
%
88.0
%
90.0
%
92.0
%
(Vin = 12 Vdc, TA= 25 °C, Full Load)
kHz
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Applications
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Intermediate Bus architecture
Distributed power applications
Workstations and servers
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Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Voltage Programming
Via external trim resistor between Trim and GND:
[
Rtrim =
Via application of external voltage between Trim and GND:
]
10.5
- 1.0 kΩ
Vo - 0.7525
Vtrim = (0.7 - 0.0667 x {Vo - 0.7525})
MXT6A-12SA SMT Non-Isolated Power Module
Product Dimensions
Recommended Pad Layout
27.9
(1.100)
17.53
(0.690)
BOTTOM VIEW
27.9
(1.100)
4.06
(0.160)
4.06
(0.160)
4.57
(0.180)
4.83
(0.190)
SEQ
GND
TRIM
VOUT
8.89
(0.350)
8.64
(0.340)
4.83
(0.190)
11.43
(0.450)
VOUT
8.64
(0.340)
ON/OFF
TRIM
GND
1.5
(0.06)
1.5
(0.06)
2.29
(0.090)
SIDE VIEW
RECOMMENDED PAD SIZE:
3.05
2.41
X
MIN.
(0.120) (0.095)
3.43
2.79
X
MAX.
(0.135) (0.110)
Pick and Place Location
6.84
(0.270)
MAX.
DIMENSIONS:
MM
(INCHES)
8.89
(0.350)
VIN
1.5
(0.06)
3.8
(0.150)
SEQ
0.25
(0.010)
ON/OFF
VIN
1.57
(0.062)
4.06
(0.160)
4.06
(0.160)
4.57
(0.180)
6.56
(0.258)
REF.
11.43
(0.450)
6.22
(0.235)
TOLERANCES:
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
12.2
(0.480)
L1 (REF.)
27.9
(1.100)
How to Order
1.57
(0.062)
M X T 6A - 12 S A (-P)
Pinout Detail
Configuration
• M = Surface Mount Device
PIN
1
2
3
4
5
6
FUNCTION
ON/OFF
VIN
SEQ
GND
TRIM
VOUT
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
Derating Output Current vs. Local Ambient Temp & Airflow
Output Voltage (V)*
• A = Adjustable
Optional Positive On/Off Logic
(Vin = 12 Vdc, Vo = 3.3 Vdc)
*Fixed output voltage parts and optional features available; contact factory.
7
Output Current (A)
6
2.0 m/s
(400 LFM)
NC (0 LFM)
5
1.5 m/s
(300 LFM)
4
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
3
2
1
0
25
30
35
40
45
50
55
60
65
Ambient Temperature (°C)
70
75
80
85
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. B 08/06
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.