LIGITEK LY3331-PF-TBS-X Tape and box type led lamp Datasheet

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
Pb
Lead-Free Parts
LY3331-PF/TBS-X
DATA SHEET
DOC. NO :
QW0905- LY3331-PF/TBS-X-08
REV.
:
A
DATE
:
20 - Feb. - 2008
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/6
PART NO. LY3331-PF/TBS-X
Package Dimensions
P2
ΔH
H2
W2
H1
L W0
W1 W3
D
- +
P1
F
P
T
LY3331-PF
5.0
5.9
7.6
8.6
1.5MAX
25.0MIN
0.5
TYP
2.54TYP
1.0MIN
+ Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LY3331-PF/TBS-X
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
Yellow
Forward Current
IF
15
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
50
mA
Power Dissipation
PD
50
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 10mA(V)
λPnm
@10mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Typ. Min. Typ.
Lens
LY3331-PF/TBS-X GaAsP/GaP Yellow Yellow Transparent
Luminous
intensity
585
35
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The radiant intensity data did not including ±15% testing tolerance.
1.7
2.1
65
150
20
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LY3331-PF/TBS-X
Page 3/6
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TBS-1
17.5
0.69
18.5
0.73
TBS-2
21.5
0.85
22.5
0.89
TBS-3
25.5
1.0
26.5
1.04
TBS-5
22.5
0.89
23.5
0.93
TBS-6
19.9
0.78
20.9
0.82
24.0
0.94
25.0
0.98
24.5
0.96
25.5
1.0
TBS-9
19.0
0.75
20.0
0.79
TBS-10
18.4
0.72
19.4
0.76
TBS-11
21.0
0.83
22.0
0.87
TBS-12
20.5
0.81
21.5
0.85
TBS-13
18.0
0.71
19.0
0.75
-------
36
1.42
11
0.43
TBS-7
Feed Hole To Bottom Of Component
H1
TBS-8
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
-------
W0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2000PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LY3331-PF/TBS-X
Page4/6
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.2 Relative Intensity vs. Forward Current
Relative Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
Forward Current(mA)
Forward Voltage(V)
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
0°
1.0
-30°
30 °
-60°
0.5
60 °
0.0
500
550
600
650
Wavelength (nm)
700
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LY3331-PF/TBS-X
Page 5/6
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 ° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5° C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
60 Seconds Max
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LY3331-PF/TBS-X
Page 6/6
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95 %
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11
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