Samsung K6T4016C3B-TB70 256kx16 bit low power cmos static ram Datasheet

CMOS SRAM
K6T4016C3B Family
Document Title
256Kx16 bit Low Power CMOS Static RAM
Revision History
History
Draft Data
Remark
0.0
Initial draft
June 28, 1996
Advance
0.1
Revise
- Die name change ; A to B
September 19, 1996
Preliminary
1.0
Finalize
December 17, 1996
Final
2.0
Revise
- Operating current update and release.
ICC(Read/Write) = 30/60 → 15/75mA
ICC1(Read/Write) = 30/60 → 15/75mA
ICC2 = 160 → 130mA
February 17, 1997
Final
3.0
Revise
- Change datasheet format
- Remove I CC write value from table.
February 17, 1998
Final
4.0
Revise
- Change test load at 55ns: 100pF → 50pF
June 22, 1998
Final
Errarta correction
August 8, 1998
Revise
- Add 55ns product for industrial temperature
May 22, 2001
Revision No.
4.01
5.0
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions about device. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
256Kx16 bit Low Power CMOS Static RAM
FEATURES
GENERAL DESCRIPTION
•
•
•
•
•
•
The K6T4016C3B families are fabricated by SAMSUNG′s
advanced CMOS process technology. The families support
various operating temperature ranges and small package
types for user flexibility of system design. The families also
support low data retention voltage for battery back-up operation with low data retention current.
Process Technology: TFT
Organization: 256Kx16
Power Supply Voltage: 4.5~5.5V
Low Data Retention Voltage: 2V(Min)
Three state output and TTL Compatible
Package Type: 44-TSOP2-400F/R
PRODUCT FAMILY
Power Dissipation
Product Family
Operating Temperature Vcc Range
K6T4016C3B-B
Commercial(0~70°C)
K6T4016C3B-F
Industrial(-40~85°C)
4.5~5.5V
Speed
Standby
(ISB1, Max)
551)/70ns
20µA
551)/70/100ns
50µA
Operating
(ICC2, Max)
PKG Type
130mA
44-TSOP2-400F/R
1. The parameter is measured with 50pF test load.
PIN DESCRIPTION
A4
A3
A2
A1
A0
CS
I/OI
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A17
A16
A15
A14
A13
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44-TSOP2
Forward
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A5
A6
A7
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
A12
FUNCTIONAL BLOCK DIAGRAM
A5
A6
A7
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
Vss
Vcc
I/O12
I/O11
I/O10
I/O9
NC
A8
A9
A10
A11
A12
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
44-TSOP2
Reverse
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
A4
A3
A2
A1
A0
CS
I/OI
I/O2
I/O3
I/O4
Vcc
Vss
I/O5
I/O6
I/O7
I/O8
WE
A17
A16
A15
A14
A13
Clk gen.
Precharge circuit.
A13
Vcc
Vss
A14
A0
A1
A15
A16
Row
select
Memory array
1024 rows
256×16 columns
A17
A2
A3
A4
I/O1~I/O8
Data
cont
I/O Circuit
Column select
Data
cont
I/O9~I/O16
Data
cont
Name
Function
Name
A8 A9 A10 A5 A6 A7 A4 A12
Function
CS
Chip Select Input
Vcc
Power
OE
Output Enable Input
Vss
Ground
WE
Write Enable Input
UB
Upper Byte(I/O9~16)
Address Inputs
LB
Lower Byte (I/O1~8 )
Data Inputs/Outputs
NC
No Connection
WE
OE
A0 ~A17
I/O1 ~I/O16
UB
Control
logic
LB
CS
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
2
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
PRODUCT LIST
Commercial Temperature Product(0~70°C)
Part Name
Industrial Temperature Products(-40~85°C)
Function
Part Name
K6T4016C3B-TF55
K6T4016C3B-TF70
K6T4016C3B-TF10
K6T4016C3B-RF55
K6T4016C3B-RF70
K6T4016C3B-RF10
44-TSOP2-F, 55ns, LL-pwr
44-TSOP2-F, 70ns, LL-pwr
44-TSOP2-R, 55ns, LL-pwr
44-TSOP2-R, 70ns, LL-pwr
K6T4016C3B-TB55
K6T4016C3B-TB70
K6T4016C3B-RB55
K6T4016C3B-RB70
Function
44-TSOP2-F, 55ns, LL-pwr
44-TSOP2-F, 70ns, LL-pwr
44-TSOP2-F, 100ns, LL-pwr
44-TSOP2-R, 55ns, .LL-pwr
44-TSOP2-R, 70ns, .LL-pwr
44-TSOP2-R, 100ns, LL-pwr
FUNCTIONAL DESCRIPTION
CS
OE
WE
LB
UB
I/O1~8
I/O9~16
Mode
Power
H
X1)
X1)
X1)
X1)
High-Z
High-Z
Deselected
Standby
L
H
H
X1)
X1)
High-Z
High-Z
Output Disabled
Active
L
X1)
X1)
H
H
High-Z
High-Z
Output Disabled
Active
L
L
H
L
H
Dout
High-Z
Lower Byte Read
Active
L
L
H
H
L
High-Z
Dout
Upper Byte Read
Active
L
L
H
L
L
Dout
Dout
Word Read
Active
L
X1)
L
L
H
Din
High-Z
Lower Byte Write
Active
L
1)
L
H
L
High-Z
Din
Upper Byte Write
Active
1)
L
L
L
Din
Din
Word Write
Active
L
X
X
1. X means don′t care. (Must be in low or high state)
ABSOLUTE MAXIMUM RATINGS1)
Item
Voltage on any pin relative to Vss
Voltage on Vcc supply relative to Vss
Power Dissipation
Storage temperature
Operating Temperature
Soldering temperature and time
Symbol
Ratings
Unit
Remark
VIN,VOUT
-0.5 to 7.0
V
-
VCC
-0.5 to7.0
V
-
PD
1.0
W
-
TSTG
-65 to 150
°C
-
0 to 70
°C
K6T4016C3B-B
-40 to 85
°C
K6T4016C3B-F
260°C, 10sec(Lead Only)
-
-
TA
TSOLDER
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
3
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
RECOMMENDED DC OPERATING CONDITIONS1)
Symbol
Min
Typ
Max
Unit
Supply voltage
Item
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
Input high voltage
VIH
2.2
-
Vcc+0.5
Input low voltage
VIL
-0.5 3)
-
0.8
V
V
2)
V
Note:
1. Commercial Product: TA=0 to 70°C, otherwise specified
Industrial Product: TA=-40 to 85°C, otherwise specified
2. Overshoot: VCC+3.0V in case of pulse width ≤ 30ns
3. Undershoot: -3.0V in case of pulse width ≤ 30ns
4. Overshoot and undershoot are sampled, not 100% tested.
CAPACITANCE1) (f=1MHz, TA=25°C)
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
CIN
VIN=0V
-
8
pF
Input/Output capacitance
CIO
VIO=0V
-
10
pF
1. Capacitance is sampled, not 100% tested
DC AND OPERATING CHARACTERISTICS
Item
Input leakage current
Symbol
Test Conditions
Min
Typ
Max
Unit
1
µA
ILI
VIN=Vss to Vcc
-1
-
Output leakage current
ILO
CS=VIH or OE=VIH or WE=VIL, VIO=Vss to Vcc
-1
-
1
µA
Operating power supply
ICC
IIO=0mA, CS=VIL, VIN=VIL or VIH, Read
-
-
15
mA
ICC1
Cycle time=1µs, 100% duty, IIO=0mA
CS≤0.2V, VIN≤0.2V or VIN≥Vcc-0.2V
Average operating current
Read
-
-
15
Write
-
-
75
mA
ICC2
Cycle time=Min, 100% duty, IIO=0mA, CS=VIL, VIN=VIH or VIL
-
-
130
mA
Output low voltage
VOL
IOL=2.1mA
-
-
0.4
V
Output high voltage
VOH
IOH=-1.0mA
2.4
-
-
V
Standby Current (TTL)
ISB
CS=VIH, Other inputs=VIL or VIH
-
-
3
mA
Standby Current(CMOS)
ISB1
CS≥Vcc-0.2V, Other inputs=0~Vcc
-
-
201)
µA
1. Industrial Product = 50µA
4
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
AC OPERATING CONDITIONS
TEST CONDITIONS (Test Load and Test Input/Output Reference)
Input pulse level: 0.8 to 2.4V
Input rising and falling time: 5ns
Input and output reference voltage: 1.5V
Output load (See right): CL=100pF+1TTL
CL=50pF+1TTL
CL1)
1. Including scope and jig capacitance
AC CHARACTERISTICS (Vcc=4.5~5.5V, Commercial product: TA=0 to 70°C, Industrial product: TA=-40 to 85°C)
Speed Bins
Parameter List
Read
Write
Symbol
55ns
70ns
Units
100ns
Min
Max
Min
Max
Min
Max
Read cycle time
tRC
55
-
70
-
100
-
ns
Address access time
tAA
-
55
-
70
-
100
ns
Chip select to output
tCO
-
55
-
70
-
100
ns
Output enable to valid output
tOE
-
25
-
35
-
50
ns
Chip select to low-Z output
tLZ
10
-
10
-
10
-
ns
Output enable to low-Z output
tOLZ
5
-
5
-
5
-
ns
UB, LB enable to low-Z output
tBLZ
5
-
5
-
5
-
ns
Chip disable to high-Z output
tHZ
0
20
0
25
0
30
ns
Output Disable to High-Z Output
tOHZ
0
20
0
25
0
30
ns
UB, LB disable to high-Z output
tBHZ
0
20
0
25
0
30
ns
Output hold from address change
tOH
10
-
10
-
10
-
ns
LB, UB valid to data output
tBA
-
25
-
35
-
50
ns
Write cycle time
tWC
55
-
70
-
100
-
ns
Chip select to end of write
tCW
45
-
60
-
80
-
ns
Address set-up time
tAS
0
-
0
-
0
-
ns
Address valid to end of write
tAW
45
-
60
-
80
-
ns
Write pulse width
tWP
45
-
55
-
70
-
ns
Write recovery time
tWR
0
-
0
-
0
-
ns
Write to output high-Z
tWHZ
0
20
0
25
0
30
ns
Data to write time overlap
tDW
25
-
30
-
40
-
ns
Data hold from write time
tDH
0
-
0
-
0
-
ns
End write to output low-Z
tOW
5
-
5
-
5
-
ns
LB, UB valid to end of write
tBW
45
-
60
-
-
80
ns
DATA RETENTION CHARACTERISTICS
Item
Symbol
Test Condition
Vcc for data retention
VDR
CS≥Vcc-0.2V
Vcc=3.0V
Data retention current
IDR
Data retention set-up time
tSDR
Recovery time
tRDR
See data retention waveform
Min
Typ
Max
Unit
2.0
-
5.5
V
1)
-
-
15
0
-
-
5
-
-
µA
ms
1. Industrial Product: 20µA
5
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1) (Address Controlled, CS=OE=VIL , WE=VIH, UB or/and LB=VIL )
tRC
Address
tAA
tOH
Data Out
Data Valid
Previous Data Valid
TIMING WAVEFORM OF READ CYCLE(2) (WE=VIH)
tRC
Address
tOH
tAA
tCO
CS
tHZ
tBA
UB, LB
tBHZ
tOE
OE
tOLZ
tBLZ
Data out
High-Z
tOHZ
tLZ
Data Valid
NOTES (READ CYCLE)
1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage
levels.
2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from device to device
interconnection.
6
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
TIMING WAVEFORM OF WRITE CYCLE(1)
(WE Controlled)
tWC
Address
tWR(4)
tCW(2)
CS
tAW
tBW
UB, LB
tWP(1)
WE
tAS(3)
tDW
Data in
High-Z
tDH
tWHZ
Data out
High-Z
Data Valid
tOW
Data Undefined
TIMING WAVEFORM OF WRITE CYCLE(2)
(CS Controlled)
tWC
Address
tAS(3)
tCW(2)
tWR(4)
CS
tAW
tBW
UB, LB
tWP(1)
WE
tDW
Data Valid
Data in
Data out
tDH
High-Z
High-Z
7
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
TIMING WAVEFORM OF WRITE CYCLE(3) (UB, LB Controlled)
tWC
Address
tCW(2)
tWR(4)
CS
tAW
tBW
UB, LB
tAS(3)
tWP(1)
WE
tDW
Data Valid
Data in
Data out
tDH
High-Z
High-Z
NOTES (WRITE CYCLE)
1. A write occurs during the overlap(tWP) of low CS and low WE. A write begins when CS goes low and WE goes low with asserting UB
or LB for single byte operation or simultaneously asserting UB and LB for double byte operation. A write ends at the earliest transition when CS goes high and WE goes high. The tWP is measured from the beginning of write to the end of write.
2. tCW is measured from the CS going low to the end of write.
3. tAS is measured from the address valid to the beginning of write.
4. t WR is measured from the end of write to the address change. tWR applied in case a write ends as CS or WE going high.
DATA RETENTION WAVE FORM
CS controlled
VCC
tSDR
Data Retention Mode
tRDR
4.5V
2.2V
VDR
CS≥VCC - 0.2V
CS
GND
8
Revision 5.0
May 2001
CMOS SRAM
K6T4016C3B Family
Units: millimeter(inch)
PACKAGE DIMENSIONS
44 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400F)
0~8°
0.25
(
)
0.010
#44
#23
10.16
0.400
0.45 ~0.75
0.018 ~ 0.030
11.76±0.20
0.463±0.008
( 0.50 )
0.020
#1
#22
1.00±0.10
0.039±0.004
1.20
MAX.
0.047
( 0.805 )
0.032
0.35±0.10
0.014±0.004
0.80
0.0315
0
0.10
0.004 MAX
0.05
MIN.
0.002
18.81
MAX.
0.741
18.41±0.10
0.725±0.004
0
+ 0.1
5
- 0.0
04
+ 0.0
02
.006 - 0.0
0.15
44 PIN THIN SMALL OUTLINE PACKAGE TYPE II (400R)
0~8°
0.25
(
)
0.010
#1
#22
10.16
0.400
0.45 ~0.75
0.018 ~ 0.030
11.76±0.20
0.463±0.008
( 0.50 )
0.020
#44
#23
1.00±0.10
0.039±0.004
1.20
MAX.
0.047
( 0.805 )
0.032
0.35±0.10
0.014±0.004
0.05
MIN.
0.002
18.81
MAX.
0.741
18.41±0.10
0.725±0.004
0.80
0.0315
9
0
+ 0.1
5
- 0.0
04
+ 0.0
02
.006 - 0.0
0.15
0
0.10
0.004 MAX
Revision 5.0
May 2001
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