Applications ■ RoHS compliant* ■ Personal Digital Assistants (PDAs) ■ Low capacitance ~ 2.5 pF ■ Mobile phones & accessories ■ ESD protection ■ Memory card protection ■ Surge protection ■ SIM card port protection *R oH S CO M PL IA N T Features ■ Portable electronics CDSOT23-SLVU2.8 - Surface Mount TVS Diode General Information The CDSOT23-SLVU2.8 device provides ESD, EFT and Surge protection for high speed data ports meeting IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC 610004-5 (Surge) requirements. The Transient Voltage Suppressor Array offers a Working Peak Reverse Voltage of 2.8 V and Minimum Breakdown Voltage of 3 V. 1 The SOT23 packaged device will mount directly onto the industry standard SOT23 footprint. Bourns® Chip Diodes conform to JEDEC standards, are easy to handle with standard pick and place equipment and the flat configuration minimizes roll away. 3 2 Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Peak Pulse Power (tp= 8/20 μs)1 Symbol Value Unit PPK 600 W Peak Pulse Current (t = 8/20 μs) p IPPM 30 A Storage Temperature TSTG -55 to +150 ºC Operating Temperature TOPR -55 to +150 ºC Minimum Breakdown Voltage @ 1 mA VBR 3.0 V Minimum Snap Back Voltage @ 50 mA VBR 2.8 V Maximum Working Peak Voltage VWM 2.8 V Maximum Leakage Current @ VWM (Pin 3 to Pin 1) or (Pin 2 to Pin 1) ID 1.0 μA Maximum Clamping Voltage @ IP= 2 A VC 5.5 V Maximum Clamping Voltage @ IP= 5 A (Pin 2 to Pin 1) VC 7.0 8.5 V Maximum Clamping Voltage @ IP= 30 A VC 21.0 V Typical Junction Capacitance @ 0 V, 1 MHz (Pin 3 to Pin 1 & Pin 2) (Pin 2 to Pin 1 with Pin 3 NC) CD 20 2.5 pF CD 3 pF Maximum Peak Reverse Voltage @ I = 10 μA VRRM 40 V Maximum Reverse Leakage Current @ VWM IDR 0.1 μA Maximum Forward Voltage @ IF= 1 A, 120 μS VF 2 V Maximum Junction Capacitance @ 0 V, 1 MHz Note: 1.See Peak Pulse Power vs. Pulse Time. *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOT23-SLVU2.8 - Surface Mount TVS Diode Product Dimensions Recommended Footprint This is a molded JEDEC SOT-323 package with 100 % Matte Sn plating on the lead frame. It weighs approximately 8 mg and has a flammability rating of UL 94V-0. A B A DIMENSIONS = MILLIMETERS (INCHES) B 3 C 1 C SEE DETAIL D A 2 E E F DETAIL A GAUGE PLANE D L H G SEATING PLANE DIMENSIONS = MILLIMETERS (INCHES) I 0 ° TO 8 ° Dimensions J Dimensions A 2.80 - 3.00 (0.110 - 0.118) B 0.95 BSC (0.037)........... C 1.20 - 1.40 (0.047 - 0.055) D 2.10 - 2.49 (0.083 - 0.098) E 1.90 BSC (0.075)........... F 0.30 - 0.50 (0.012 - 0.019) G 0.89 - 1.17 (0.035 - 0.046) H 0.05 - 0.015 (0.002 - 0.006) I 0.25 BSC (0.010)........... J 0.46 - 0.64 (0.018 - 0.025) K 0.40 - 0.58 (0.016 - 0.023) L 0.08 - 0.20 (0.003 - 0.008) K A 0.95 (0.037) B 0.95 (0.037) C 2.00 (0.079) D 0.85 (0.033) E 0.85 (0.033) How to Order CD SOT23 - SLVU 2.8 Common Code Chip Diode Package • SOT23 = SOT23 Package Model SLVU = Special Model Working Peak Reverse Voltage 2.8 = 2.8 VRWM (Volts) Typical Part Marking CDSOT23-SLVU2.8 ....................................................................SLA Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CDSOT23-SLVU2.8 - Surface Mount TVS Diode Performance Graphs Pulse Waveform IPP – Peak Pulse Current (% of IPP) Peak Pulse Power vs. Pulse Time PPP – Peak Pulse Power (W) 10,000 600 W, 8/20 µs Waveform 1,000 100 10 0.1 1 10 100 1,000 120 Test Waveform Parameters tt = 8 µs td = 20 µs tt 100 80 et 60 40 td = t|IPP/2 20 0 10,000 5 0 10 td – Pulse Duration (µs) 15 20 25 30 t – Time (µs) Power Derating Curve Overshoot & Clamping Voltage 35 100 Peak Pulse Power 8/20 µs 15 0.2 5 % of Rated Power 5 Volts per Division 25 80 60 40 20 2 Average Power 0 -5 -72.000 ns 28.000 ns 20.0 ns/div 128.000 ns real time 0 25 50 75 100 TL = Lead Temperature - °C ESD Test Pulse: 25 kilovolt, 1/30 ns (waveshape) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 125 150 CDSOT23-SLVU2.8 - Surface Mount TVS Diode Packaging Information The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard. P 0 P 1 Index Hole d E T 120 ° F D2 W B D1 P A Trailer ....... ....... End C Device ....... ....... 10 pitches (min.) ....... ....... Leader ....... ....... Symbol A 2.25 ± 0.10 (0.088 ± 0.004) Carrier Length B 2.34 ± 0.10 (0.092 ± 0.004) Carrier Depth C 1.22 ± 0.10 (0.048 ± 0.004) Sprocket Hole d 1.55 ± 0.05 (0.061 ± 0.002) Reel Outside Diameter D 178 (7.008) Reel Inner Diameter D1 50.0 MIN. (1.969) D2 13.0 ± 0.20 (0.512 ± 0.008) Sprocket Hole Position E 1.75 ± 0.10 (0.069 ± 0.004) Punch Hole Position F 3.50 ± 0.05 (0.138 ± 0.002) Punch Hole Pitch P 4.00 ± 0.10 (0.157 ± 0.004) Sprocket Hole Pitch P0 4.00 ± 0.10 (0.157 ± 0.004) Embossment Center P1 2.00 ± 0.05 (0.079 ± 0.002) Overall Tape Thickness T 0.20 ± 0.10 (0.008 ± 0.004) Tape Width W 8.00 ± 0.20 (0.315 ± 0.008) Reel Width W1 Quantity per Reel DIMENSIONS: MM (INCHES) -- Devices are packed in accordance with EIA standard RS-481-A. SOT23 Carrier Width Feed Hole Diameter W1 Start 10 pitches (min.) Direction of Feed Item D 14.4 MAX. (0.567) 3,000 Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com REV. 11/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.