Diodes MJD32C 100v pnp high voltage transistor in to252 Datasheet

MJD32C
100V PNP HIGH VOLTAGE TRANSISTOR IN TO252
Features
Mechanical Data










BVCEO > -100V
IC = -3A high Continuous Collector Current
ICM = -5A Peak Pulse Current
Ideal for Power Switching or Amplification Applications
Complementary NPN Type: MJD31C
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability


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Case: TO252 (DPAK)
Case Material: Molded Plastic, "Green" Molding Compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.34 grams (approximate)
C
TO252 (DPAK)
B
E
Top View
Device Schematic
Pin Out Configuration
Top view
Ordering Information (Note 4)
Product
MJD32C-13
Notes:
Compliance
AEC-Q101
Marking
MJD32C
Reel size (inches)
13
Tape width (mm)
16
Quantity per reel
2,500
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free,"Green"
and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
MJD32C = Product Type Marking Code
= Manufacturers’ code marking
YYWW = Date Code Marking
YY = Last Digit of Year (ex: 10 = 2010)
WW = Week Code (01 - 53)
MJD32C
Document number: DS31624 Rev. 6 - 2
1 of 7
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March 2014
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MJD32C
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Collector Current
Continuous Base Current
Symbol
VCBO
VCEO
VEBO
IC
Value
-100
-100
-6
-3
Unit
V
V
V
A
ICM
-5
A
IB
-1
A
Value
3.9
2.1
1.6
15
32
59
80
8.4
-55 to +150
Unit
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Leads
Operating and Storage Temperature Range
Symbol
(Note 5)
(Note 6)
(Note 7)
(Note 8)
(Note 5)
(Note 6)
(Note 7)
(Note 8)
PD
RθJA
RθJL
TJ, TSTG
W
C/W
C
ESD Ratings (Note 9)
Characteristic
Electrostatic Discharge - Human Body Model
Electrostatic Discharge - Machine Model
Notes:
Symbol
ESD HBM
ESD MM
Value
4,000
400
Unit
V
V
JEDEC Class
3A
C
5. For a device mounted with the exposed collector pad on 50mm x 50mm 2oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured
under still air conditions whilst operating in a steady-state.
6. Same as note (5), except mounted on 25mm x 25mm 1oz copper.
7. Same as note (5), except mounted on minimum recommended pad (MRP) layout.
8. Thermal resistance from junction to solder-point (on the exposed collector pad).
9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.
MJD32C
Document number: DS31624 Rev. 6 - 2
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MJD32C
Thermal Characteristics
10
VCE(sat)
-IC Collector Current (A)
-IC Collector Current (A)
10
Limited
DC
1
1s
100ms
10ms
100m
1ms
100µs
Single Pulse
T amb=25°C
10m
100m
1
10
100
-VCE Collector-Emitter Voltage (V)
VCE(sat)
Limited
10ms
1ms
0.1
0.01
0.1
60
D=0.5
40
Single Pulse
0
100µ
D=0.05
D=0.1
1m
10m 100m
1
10
100
1k
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
Minimum Copper
D=0.2
10
100
6
D=0.5
4
D=0.2
D=0.1
2
D=0.05
Single Pulse
0
100µ
1m
10m 100m
T CASE=25°C
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
Document number: DS31624 Rev. 6 - 2
1
8
Pulse Width (s)
MJD32C
Single Pulse
T CASE=25°C
Safe Operating Area
T AMB=25°C
20
100s
-VCE Collector-Emitter Voltage (V)
Safe Operating Area
80
DC
100ms
1
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Transient Thermal Impedance
March 2014
© Diodes Incorporated
MJD32C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Collector-Emitter Breakdown Voltage (Note 10)
Collector Cut-off Current
Collector Cut-off Current
Emitter Cut-off Current
Collector-Emitter Saturation Voltage (Note 10)
Base-Emitter Turn-On Voltage (Note 10)
Symbol
BVCEO
ICEO
ICES
IEBO
VCE(sat)
VBE(on)
DC Current Gain (Note 10)
hFE
Current Signal Current Gain
Current Gain-Bandwidth Product
Hfe
fT
Min
-100





25
10
20
3.0
Typ






Max

-1
-1
-1
-1.2
-1.8

50





Unit
V
μA
μA
μA
V
V


MHz
Test Condition
IC = -30mA, IB = 0
VCB = -60V, IB = 0
VCE = -100V, VEB = 0
VEB = -5V, IC = 0
IC = -3.0A, IB = -375mA
IC = -3A, VCE = -4V
VCE = -4V, IC = -1A
VCE = -4V, IC = -3A
VCE = -10V, IC = -0.5A, f = 1KHz
IC = -500mA, VCE = -10V, f = 1MHz
10. Measured under pulsed conditions. Pulse width  300μs. Duty cycle 2%.
Notes:
Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
1,000
1
IC/IB = 8
-VCE(SAT), COLLECTOR-EMITTER
SATURATION VOLTAGE (V)
hFE, DC CURRENT GAIN
VCE = -4V
TA = 150°C
T A = 85°C
T A = 25°C
100
TA = -55°C
10
VCE = -4V
1.0
0.8
TA = -55°C
0.6
TA = 25°C
0.4
TA = 85°C
T A = 150°C
0.2
0
1
10
100
1,000
10,000
-IC, COLLECTOR CURRENT (mA)
Figure 3 Typical Base-Emitter Turn-On Voltage
vs. Collector Current
MJD32C
Document number: DS31624 Rev. 6 - 2
TA = 25°C
TA = -55°C
0.01
10
100
1,000
10,000
-IC, COLLECTOR CURRENT (mA)
Figure 2 Typical Collector-Emitter Saturation Voltage
vs. Collector Current
-VBE(SAT), BASE-EMITTER SATURATION VOLTAGE (V)
-VBE(ON), BASE-EMITTER TURN-ON VOLTAGE (V)
10
100
1,000
10,000
-IC, COLLECTOR CURRENT (mA)
Figure 1 Typical DC Current Gain vs. Collector Current
1.2
T A = 85°C
0.001
1
1
1.4
TA = 150°C
0.1
1.2
IC/IB = 8
1.0
0.8
TA = -55°C
0.6
TA = 25°C
TA = 85°C
0.4
T A = 150°C
0.2
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0
1
10
100
1,000
10,000
-IC, COLLECTOR CURRENT (mA)
Figure 4 Typical Base-Emitter Saturation Voltage
vs. Collector Current
March 2014
© Diodes Incorporated
MJD32C
1,000
CAPACITANCE (pF)
f = 1MHz
Cibo
100
Cobo
10
0.1
1
10
100
VR, REVERSE VOLTAGE (V)
Figure 5 Typical Capacitance Characteristics
MJD32C
Document number: DS31624 Rev. 6 - 2
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MJD32C
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
E
A
3
b
2
c
°
1
±
°
7
3
L
4
L
H
2
A
D
x
3
b
e
︵ ︶
x
2
2
b
︵ ︶
8
0
5
.
0
e
n
a
l
P
e
g
u
a
G
e
n
a
l
P
g
n
i
t
a
e
S
1
D
1
E
L
1
A
a
F
E
R
4
7
.
2
TO252
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b
0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21


e
2.286


E 6.45 6.70 6.58
E1 4.32


H 9.40 10.41 9.91
L
1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a
0°
10°

All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
1
X
1
Y
2
Y
Dimensions
C
X
X1
Y
Y1
Y2
C
Value (in mm)
4.572
1.060
5.632
2.600
5.700
10.700
Y
X
Note:
For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances between
device Terminals and PCB tracking.
MJD32C
Document number: DS31624 Rev. 6 - 2
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© Diodes Incorporated
MJD32C
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Copyright © 2014, Diodes Incorporated
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MJD32C
Document number: DS31624 Rev. 6 - 2
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