PANASONIC 2SB1416

Power Transistors
2SB1416
Silicon PNP epitaxial planar type
For low-frequency power amplification
Complementary to 2SD2136
Unit: mm
90˚
10.8±0.2
0.65±0.1
0.85±0.1
1.0±0.1 0.8 C
2.5±0.1
• High forward current transfer ratio hFE which has satisfactory
linearity
• Low collector-emitter saturation voltage VCE(sat)
• Allowing automatic insertion with radial taping
16.0±1.0
■ Features
4.5±0.2
3.8±0.2
7.5±0.2
0.8 C
0.7±0.1
0.7±0.1
1.15±0.2
1.15±0.2
■ Absolute Maximum Ratings Ta = 25°C
Symbol
Rating
Unit
Collector-base voltage (Emitter open)
VCBO
−60
V
Collector-emitter voltage (Base open)
VCEO
−60
V
Emitter-base voltage (Collector open)
VEBO
−5
V
Collector current
IC
−3
A
Peak collector current
ICP
−5
A
Collector power dissipation
PC
1.5
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
0.4±0.1
0.5±0.1
0.8 C
1
2
2.5±0.2
3
2.05±0.2
Parameter
2.5±0.2
1: Emitter
2: Collector
3: Base
MT-3-A1 Package
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage (Base open)
VCEO
IC = −30 mA, IB = 0
Base-emitter voltage
VBE
VCE = −4 V, IC = −3 A
−1.8
V
Collector-emitter cutoff current (E-B short)
ICES
VCE = −60 V, VBE = 0
−200
µA
Collector-emitter cutoff current (Base open)
ICEO
VCE = −30 V, IB = 0
−300
µA
Emitter-base cutoff current (Collector open)
IEBO
VEB = −5 V, IC = 0
−1
mA
Forward current transfer ratio
hFE1 *
VCE = −4 V, IC = −1 A
40
250

hFE2
VCE = −4 V, IC = −3 A
10
Collector-emitter saturation voltage
VCE(sat)
Conditions
Min
Typ
Max
−60
Unit
V
IC = −3 A, IB = − 0.375A
−1.2
V
fT
VCB = −5 V, IE = 0.1 A, f = 200 MHz
270
MHz
Turn-on time
ton
IC = −1 A, IB1 = − 0.1 A, IB2 = 0.1 A
0.5
µs
Storage time
tstg
1.2
µs
tf
0.3
µs
Transition frequency
Fall time
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank
P
Q
R
hFE1
40 to 90
70 to 150
120 to 250
Publication date: March 2003
SJD00071BED
1
2SB1416
PC  Ta
IC  VCE
IC  VBE
−1.2
−1.2
Collector current IC (A)
Collector power dissipation PC (W)
IB=–8mA
−1.0
1.6
1.2
0.8
0.4
VCE=–4V
Ta=25˚C
Without heat sink
–7mA
− 0.8
–6mA
–5mA
− 0.6
–4mA
− 0.4
–3mA
–2mA
− 0.2
25˚C
−1.0
Collector current IC (A)
2.0
–25˚C
Ta=75˚C
− 0.8
− 0.6
− 0.4
− 0.2
–1mA
0
0
40
80
120
160
−2
0
−4
− 0.1
Ta=75˚C
Ta=25˚C
Ta=–25˚C
−10
−100
200
fT  I E
25˚C
120
–25˚C
80
40
0
−1
−1 000
Ta=75˚C
160
−10
−100
t=1ms
−1
DC
− 0.1
−1
−10
100
50
0
− 0.01
−1 000
− 0.1
−1
−10
Collector current IC (A)
−100
Without heat sink
103
102
10
1
10−1
10−4
10−3
10−2
10−1
1
Time t (s)
Collector-emitter voltage VCE (V)
2
150
104
Thermal resistance Rth (°C/W)
Collector current IC (A)
ICP
− 0.01
− 0.1
200
Rth  t
−10
t=10ms
VCB=–5V
f=200MHz
TC=25˚C
250
Collector current IC (A)
Single pulse
TC=25˚C
SJD00071BED
−1.2
Base-emitter voltage VBE (V)
300
Safe operation area
IC
− 0.2 − 0.4 − 0.6 − 0.8 −1.0
0
VCE=–4V
Collector current IC (A)
−100
0
−12
hFE  IC
−1
− 0.001
−1
−10
240
IC/IB=8
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
VCE(sat)  IC
− 0.01
−8
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
−10
−6
Transition frequency fT (MHz)
0
10
102
103
104
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
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(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
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2002 JUL