Infineon BFQ19S Npn silicon rf transistor Datasheet

BFQ19S
NPN Silicon RF Transistor*
• For low noise, low distortion broadband
1
amplifiers in antenna and
2
3
telecommunications systems up to 1.5 GHz
2
at collector currents from 10 mA to 70 mA
• Pb-free (RoHS compliant) package 1)
• Qualified according AEC Q101
* Short term description
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
BFQ19S
Marking
FG
Pin Configuration
1=B
2=C
3=E
Package
SOT89
Maximum Ratings
Parameter
Symbol
Value
Unit
Collector-emitter voltage
VCEO
15
Collector-emitter voltage
VCES
20
Collector-base voltage
VCBO
20
Emitter-base voltage
VEBO
3
Collector current
IC
210
Base current
IB
21
Total power dissipation2)
Ptot
1
W
V
mA
TS ≤ 85°C
Junction temperature
Tj
150
°C
Operation junction temperature range
T jo
- ... -
-
Ambient temperature
TA
-65 ... 150
Storage temperature
T stg
-65 ... 150
°C
Thermal Resistance
Parameter
Symbol
Junction - soldering point 3)
RthJS
Value
Unit
≤ 65
K/W
1Pb-containing
2T
package may be available upon special request
is
measured
on the collector lead at the soldering point to the pcb
S
3For
calculation of RthJA please refer to Application Note Thermal Resistance
1
2010-03-12
BFQ19S
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Parameter
Values
Unit
min.
typ.
max.
15
-
-
V
ICES
-
-
10
µA
ICBO
-
-
100
nA
IEBO
-
-
100
µA
hFE
70
100
140
-
DC Characteristics
Collector-emitter breakdown voltage
V(BR)CEO
IC = 1 mA, I B = 0
Collector-emitter cutoff current
VCE = 20 V, VBE = 0
Collector-base cutoff current
VCB = 10 V, I E = 0
Emitter-base cutoff current
VEB = 2 V, IC = 0
DC current gainIC = 70 mA, VCE = 8 V, pulse measured
2
2010-03-12
BFQ19S
Electrical Characteristics at TA = 25°C, unless otherwise specified
Symbol
Values
Unit
Parameter
min.
typ. max.
AC Characteristics (verified by random sampling)
Transition frequency
fT
4
5.5
-
Ccb
-
1.05
1.35
Cce
-
0.4
-
Ceb
-
3.9
-
GHz
IC = 70 mA, VCE = 8 V, f = 500 MHz
Collector-base capacitance
pF
VCB = 10 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Collector emitter capacitance
VCE = 10 V, f = 1 MHz, VBE = 0 ,
base grounded
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Noise figure
dB
F
IC = 20 mA, VCE = 6 V, Z S = ZSopt,
f = 900 MHz
-
1.8
-
f = 1.8 GHz
-
3
-
f = 900 MHz
-
11.5
-
f = 1.8 GHz
-
7
-
Power gain, maximum available1)
G ma
IC = 70 mA, VCE = 8 V, Z S = ZSopt, ZL = ZLopt,
|S 21e|2
Transducer gain
dB
IC = 30 mA, VCE = 8 V, Z S = Z L = 50Ω,
f = 900 MHz
-
9.5
-
f = 1.8 GHz
-
4
-
-
32
-
Third order intercept point at output
IP 3
dBm
VCE = 8 V, I C = 70 mA, Z S = ZSopt, Z L = ZLopt,
f = 1.8 GHz
2 1/2
ma = |S21/S 12| (k-(k -1) )
1G
3
2010-03-12
BFQ19S
Total power dissipation Ptot = ƒ(TS)
Permissible Pulse Load RthJS = ƒ(t p)
10 2
1200
mW
1000
K/W
RthJS
Ptot
900
800
700
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D=0
10 1
600
500
400
300
200
100
0
0
20
40
60
80
100
120 °C
10 0 -7
10
150
TS
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
Permissible Pulse Load
Ptotmax/P totDC = ƒ(tp)
Ptotmax /PtotDC
10 2
-
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
10 1
10 0 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
4
2010-03-12
Package SOT89
BFQ19S
Package Outline
4.5 ±0.1
45˚
B
1.5 ±0.1
1)
1.6 ±0.2
0.2 MAX.
2
2.75 +0.1
-0.15
10˚ MAX.
1 ±0.2
1
0.15
4 ±0.25
1 ±0.1
1)
2.5 ±0.1
0.25 ±0.05
3
1.5
0.35 ±0.1
0.45 +0.2
-0.1
3
0.15
M
B x3
0.2 B
1) Ejector pin markings possible
Foot Print
1.2
1.0
2.5
2.0
0.8
0.8
0.7
Marking Layout (Example)
BAW78D
Type code
Pin 1
2005, June
Date code (YM)
Manufacturer
Standard Packing
Reel ø180 mm = 1.000 Pieces/Reel
Reel ø330 mm = 4.000 Pieces/Reel
0.2
4.6
12
8
Pin 1
4.3
5
1.6
2010-03-12
BFQ19S
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
6
2010-03-12
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