CALMIRCO CM1230-04 2, 4 and 8-channel low capacitance esd protection array Datasheet

PRELIMINARY
CM1230
2, 4 and 8-Channel Low Capacitance ESD Protection Array
Features
Product Description
•
•
The CM1230 is a family of 2, 4 and 8 channel, very low
capacitance ESD protection diode arrays in CSP form
factor. This device is ideal for protecting systems with
high data and clock rates or for circuits that require low
capacitive loading. Each channel consists of a pair of
ESD diodes that act as clamp diodes that steer positive
or negative ESD current pulses to either the positive or
negative supply rail. A zener diode is integrated into
the array between the positive and negative supply
rails. The VCC rail is thus protected from ESD strikes
and eliminates the need for a bypass capacitor to
absorb positive ESD strikes to ground. Each channel
of the CM1230 can safely dissipate ESD strikes of
±8kV, meeting the Level 4 requirement of the
IEC61000-4-2 international standard for contact discharges as well as ±15kV air discharges per the
IEC61000-4-2 specification. Using the MIL-STD-883
(Method 3015) specification for Human Body Model
(HBM) ESD, the pins are protected for contact discharges at greater than ±15kV.
•
•
•
•
•
•
•
•
•
2, 4 and 8 channels of ESD protection
Provides ESD protection to IEC61000-4-2 Level 4
• ±8kV contact discharge
• ±15kV air discharge
Low loading capacitance of 0.8pF typical
Minimal capacitance change with temperature and
voltage
Channel I/O to GND capacitance difference of
0.02pF typical is ideal for differential signals
Channel I/O to I/O capacitance 0.15pF typical
Zener diode protects supply rail and eliminates the
need for external by-pass capacitors
Each I/O pin can withstand over 1000 ESD strikes
Available in 4, 6 and 10 bump Chip Scale Packages (CSP)
OptiGuard™ coated for improved reliability at
assembly
Lead-free version available
Applications
•
•
•
•
•
LCD and Camera data lines in wireless handsets
that use high-speed serial interfaces.
I/O port protection for mobile handsets, notebook
computers, DSCs, MP3 players, PDAs, etc. including USB, 1394 and Serial ATA
Wireless handsets
Handheld PCs/PDAs
LCD and camera modules
This device is particularly well-suited for next generation wireless handsets that implement high-speed
serial interface solutions for the LCD display and camera interfaces. In these wireless handset designs, a
tolerance above 1.5pF cannot be tolerated due to the
high data rates that are transferred between the baseband chipset and the LCD driver/controller ICs
because a higher capacitive loading will cause the rise
and fall times to slow which in turn hampers the functionality of circuit and operation of the wireless handset.
The CM1230 incorporates OptiGuard™ which results
in improved reliability at assembly. The CM1230 is
available in a space-saving, low profile Chip Scale
Package with optional lead-free finishing.
Electrical Schematic
VP
CH4
VP
CH3
CH8
CH1
VN
CH2
CH1
CH7
CH6
VP
CH5
CH2
CH1
VN
CM1230-02CS/CP
CM1230-04CS/CP
CH2
VN
CH3
CH4
CM1230-08CS/CP
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
1
PRELIMINARY
CM1230
PACKAGE / PINOUT DIAGRAMS
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
Orientation
Marking
1
2
(see note 2)
A1
A
A1
B2
B1
Orientation
Marking
L
CM1230-02
4-Bump CSP Package
B
Orientation
Marking
A2
1
2
3
(see note 2)
A1
A
A2
A1
B3
B2
B1
A5
A4
A3
A2
A1
B5
B4
B3
B2
B1
L30
B
Orientation
Marking
Orientation
Marking
A3
CM1230-04
6-Bump CSP Package
1
2
3
4
5
(see note 2)
A1
A
L308
B
Orientation
Marking
CM1230-08
10-Bump CSP Package
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish2
Standard Finish
# of Channels
Bumps
Package
Ordering Part
Number1
Part Marking
Ordering Part
Number1
2
4
CSP-4
CM1230-02CS
Part Marking
L
CM1230-02CP
L
4
6
CSP-6
CM1230-04CS
L30
CM1230-04CP
L30
8
10
CSP-10
CM1230-08CS
L308
CM1230-08CP
L308
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
© 2006 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
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Tel: 408.263.3214
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03/15/06
PRELIMINARY
CM1230
Pin Descriptions
PIN DESCRIPTIONS
PIN DESCRIPTIONS (CONT’D)
2-CHANNEL, 4-BUMP CSP
8-CHANNEL, 10-BUMP CSP
PIN
NAME
TYPE
DESCRIPTION
PIN
NAME
TYPE
A1
VN
GND
Negative voltage supply rail
A1
CH1
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
A2
CH1
I/O
ESD Channel
A2
CH3
I/O
ESD Channel
B2
VP
PWR
Positive voltage supply rail
B2
CH4
I/O
ESD Channel
A3
VP
PWR
Positive voltage supply rail
DESCRIPTION
B3
VN
GND
Negative voltage supply rail
4-CHANNEL, 6-BUMP CSP
DESCRIPTION
PIN
NAME
TYPE
A1
CH1
I/O
ESD Channel
A4
CH5
I/O
ESD Channel
B1
CH2
I/O
ESD Channel
B4
CH6
I/O
ESD Channel
A2
VP
PWR
Positive voltage supply rail
A5
CH7
I/O
ESD Channel
B2
VN
GND
Negative voltage supply rail
B5
CH8
I/O
ESD Channel
A3
CH3
I/O
ESD Channel
B3
CH4
I/O
ESD Channel
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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3
PRELIMINARY
CM1230
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
6.0
V
Operating Temperature Range
-40 to +85
°C
Storage Temperature Range
-65 to +150
°C
(VN - 0.5) to (VP + 0.5)
V
Operating Supply Voltage (VP - VN)
DC Voltage at any channel input
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
UNITS
-40 to +85
°C
ELECTRICAL OPERATING CHARACTERISTICS(SEE NOTE 1)
SYMBOL PARAMETER
VP
Operating Supply Voltage (VP-VN)
CONDITIONS
IP
Operating Supply Current
(VP-VN)=3.3V
VF
Diode Forward Voltage
Top Diode
Bottom Diode
Channel Leakage Current
IF = 8mA; TA=25°C
ILEAK
MIN
0.60
0.60
TA=25°C; VP=5V, VN=0V,
VIN = 0V to 5V
TYP
3.3
MAX
5.5
UNITS
V
8.0
μA
0.80
0.80
±0.1
0.95
0.95
±1.0
V
V
μA
1.20
pF
Channel Input Capacitance
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V; Note 2 applies
0.8
Channel Input Capacitance Matching
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V; Note 2 applies
0.02
pF
CMUTUAL
Mutual Capacitance between signal
pin and adjacent signal pin
At 1 MHz, VP=3.3V, VN=0V,
VIN=1.65V; Note 2 applies
0.15
pF
VESD
In-system ESD Protection
Peak Discharge Voltage at any
channel input, in system
a) Contact discharge per
IEC 61000-4-2 standard
b) Human Body Model, MILSTD-883, Method 3015
Channel Clamp Voltage
Positive Transients
Negative Transients
CIN
ΔCIN
VCL
RDYN
Dynamic Resistance
Positive Transients
Negative Transients
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Notes 2, 4 & 5; TA=25°C
±8
kV
Notes 2, 3 & 5; TA=25°C
±15
kV
TA=25°C, IPP = 1A, tP = 8/20μS;
Notes 2, & 5
IPP = 1A, tP = 8/20μS
Any I/O pin to Ground; Note 2 and 5
+9.8
-1.8
V
V
0.76
0.56
Ω
Ω
All parameters specified at TA = -40°C to +85°C unless otherwise noted.
These parameters guaranteed by design and characterization.
Human Body Model per MIL-STD-883, Method 3015, CDischarge = 100pF, RDischarge = 1.5KΩ, VP = 3.3V, VN grounded.
Standard IEC 61000-4-2 with CDischarge = 150pF, RDischarge = 330Ω, VP = 3.3V, VN grounded.
These measurements performed with no external capacitor on VP.
Measured under pulsed conditions, pulse width = 0.7ms, maximum current = 1.5A.
© 2006 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
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Fax: 408.263.7846
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03/15/06
PRELIMINARY
CM1230
Performance Information
Input Channel Capacitance Performance Curves
2.000
1.800
Capacitance (pF)
1.600
1.400
1.200
1.000
0.800
0.600
0.400
0.200
0.000
0
0.5
1
1.5
2
2.5
3
Bias Voltage (V)
Typical Variation of CIN vs. VIN
(f=1MHz, VP = 3.3V, VN = 0V, 0.1 μF chip capacitor between VP and VN,
TA = 25°C)
Capacitance [pF]
0.90
0V DC Input Bias
1.65 DC Input Bias
0.85
0.80
0.75
0.70
0.65
0.60
-50
-25
0
25
50
75
100
Temperature ['C]
Typical Variation of CIN vs. Temp
(f=1MHz, VIN=30mV, VP = 3.3V, VN = 0V,
0.1 μF chip capacitor between VP and VN)
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
5
PRELIMINARY
CM1230
Performance Information (Cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Insertion Loss VS. Frequency (0V DC Bias, VP=3.3V)
Insertion Loss VS. Frequency (2.5V DC Bias, VP=3.3V)
© 2006 California Micro Devices Corp. All rights reserved.
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490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/15/06
PRELIMINARY
CM1230
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
240°C
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Temperature (°C)
250
200
150
100
50
0
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
7
PRELIMINARY
CM1230
Mechanical Details
CSP-4 Mechanical Specifications
The CM1230-02CS/CP is supplied in a 4 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the California Micro Devices CSP Package Information document.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
PACKAGE DIMENSIONS
B2
B1
Custom CSP
B
Bumps
4
A
Min
Nom
Max
Inches
Min
Nom
Max
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
0.915 0.960 1.005 0.0360 0.0378 0.0396
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
1
2
C2
Dim
Millimeters
A2
Package
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1230-02 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/15/06
PRELIMINARY
CM1230
Mechanical Details (cont’d)
CSP-6 Mechanical Specifications
The CM1230-04CS/CP is supplied in a 6 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the California Micro Devices CSP Package Information document.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
PACKAGE DIMENSIONS
Custom CSP
Bumps
6
Dim
Millimeters
Nom
Max
2
1
Inches
Min
Nom
A1
0.915 0.960 1.005 0.0360 0.0378 0.0396
A2
1.415 1.460 1.505 0.0557 0.0575 0.0593
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.495 0.500 0.505 0.0195 0.0197 0.0199
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
B
Max
A
C2
Min
3
A2
Package
B3
B2
B1
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
Package Dimensions for
CM1230-04 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
9
PRELIMINARY
CM1230
Mechanical Details (cont’d)
CSP-10 Mechanical Specifications
The CM1230-08CS/CP is supplied in a 10 bump Chip
Scale Package (CSP). Dimensions are shown below.
For complete information on the CSP, see the California Micro Devices CSP Package Information document.
Mechanical Package Diagrams
BOTTOM VIEW
OptiGuardTM
Coating
A1
C1
B2
B1
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Millimeters
4
Inches
Nom
Max
0.915
0.960
1.005
0.0360 0.0378 0.0396
Nom
Max
A2
2.415
2.460
2.505
0.0951 0.0969 0.0986
B1
0.495
0.500
0.505
0.0195 0.0197 0.0199
B2
0.495
0.500
0.505
0.0195 0.0197 0.0199
C1
0.180
0.230
0.280
0.0071 0.0091 0.0110
C2
0.180
0.230
0.280
0.0071 0.0091 0.0110
D1
0.575
0.644
0.714
0.0226 0.0254 0.0281
D2
0.368
0.419
0.470
0.0145 0.0165 0.0185
2
B
A
B
A
C2
Min
A1
# per tape and
reel
Min
3
A2
Dim
5
1
D1
0.30 DIA.
D2
63/37 Sn/Pb (Eutectic) or
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
NOTE: DIMENSIONS IN MILLIMETERS
3500 pieces
Package Dimensions for
CM1230-08 Chip Scale Package
Controlling dimension: millimeters
© 2006 California Micro Devices Corp. All rights reserved.
10
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
03/15/06
PRELIMINARY
CM1230
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1230-02
0.96 x 0.96 x 0.644
1.14 x 1.00 x 0.70
8mm
178mm (7")
3500
4mm
4mm
CM1230-04
1.46 x 0.96 x 0.644
1.72 x 1.17 x 0.73
8mm
178mm (7")
3500
4mm
4mm
CM1230-08
2.46 x 0.96 x 0.644
2.62 x 1.12 x 0.76
8mm
178mm (7")
3500
4mm
4mm
Po
Top
Cover
Tape
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
Ao
W
Bo
Ko
For Tape Feeder Reference
Only including Draft.
Concentric Around B.
Embossment
P1
Center Lines
of Cavity
User Direction of Feed
Figure 4. Tape and Reel Mechanical Data
© 2006 California Micro Devices Corp. All rights reserved.
03/15/06
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
●
Tel: 408.263.3214
●
Fax: 408.263.7846
●
www.cmd.com
11
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