PANASONIC 2SB1699

Transistors
2SB1699
Silicon PNP epitaxial planar type
Unit: mm
For power amplification
4.5±0.1
1.6±0.2
1.5±0.1
3˚
0.4±0.04
Unit
Collector-base voltage (Emitter open)
VCBO
−60
V
Collector-emitter voltage (Base open)
VCEO
−60
V
Emitter-base voltage (Collector open)
VEBO
−6
V
Collector current
IC
−2
A
Peak collector current
ICP
−4
A
Collector power dissipation *
PC
1
W
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
45˚
0.4 max.
Rating
2.6±0.1
Symbol
3
2
0.5±0.08
3˚
■ Absolute Maximum Ratings Ta = 25°C
Parameter
1
0.4±0.08
1.0+0.1
–0.2
• Low collector-emitter saturation voltage VCE(sat)
• Mini Power type package, allowing downsizing of the equipment
and automatic insertion through the tape packing and the magazine packing.
4.0+0.25
–0.20
■ Features
2.5±0.1
1.5±0.1
3.0±0.15
1: Base
2: Collector
3: Emitter
MiniP3-F1 Package
Marking Symbol: 3A
cm2
Note) *: Print circuit board: Copper foil area of 1
or more, and the board
thickness of 1.7 mm for the collector portion
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-emitter voltage (Base open)
VCEO
IC = −1 mA, IB = 0
Collector-base cutoff current (Emitter open)
ICBO
VCB = −60 V, IE = 0
Collector-emitter cut-off current (Base open)
ICEO
VCE = −60 V, IB = 0
Forward current transfer ratio *
hFE1
VCE = −4 V, IC = −1 A
hFE2
VCE = −4 V, IC = − 0.2 A
60
hFE3
VCE = −4 V, IC = −2 A
30
Collector-emitter saturation voltage *
VCE(sat)
Conditions
Min
Typ
Max
Unit
−100
µA
−100
µA
250

−60
V
80
IC = −2 A, IB = −250 mA
− 0.5
V
Turn-on time
ton
IC = −1 A, IB1 = 0.1 A
0.2
µs
Storage time
tstg
IB2 = − 0.1 A, VCC = −50 V
0.4
µs
Fall time
tf
0.1
µs
Transition frequency
fT
180
MHz
VCB = −10 V, IE = 50 mA, f = 200 MHz
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: April 2004
SJC00304AED
1
2SB1699
IC  VCE
−1.6
IB = −10 mA
−1.4
1
Collector current IC (A)
0.8
−9 mA
−7 mA
−1
−6 mA
0.2
0
0
20
40
60
0
80 100 120 140 160
−2
0
−4
−6
−8
−1
Ta = 85°C
−25°C
25°C
−1
−10
−102
0
−12
0
− 0.2
−103
Collector current IC (mA)
−104
VCE = −4 V
25°C
200
−25°C
100
50
0
− 0.001
− 0.01
− 0.1
−1
Collector current IC (A)
SJC00304AED
− 0.6
− 0.8
−1
Cob  VCB
250
150
− 0.4
Base-emitter voltage VBE (V)
hFE  IC
Ta = 85°C
−10−3
− 0.1
−10
− 0.01
300
IC/IB = 8
Forward current transfer ratio hFE
Collector-emitter saturation voltage VCE(sat) (V)
VCE(sat)  IC
−10
−10−2
− 0.02
−1 mA
Collector-emitter voltage VCE (V)
Ambient temperature Ta (°C)
−10−1
− 0.03
−2 mA
− 0.2
25°C
− 0.04
−3 mA
− 0.4
−25°C
Ta = 85°C
− 0.05
−4 mA
− 0.6
0.4
− 0.07
− 0.06
−5 mA
− 0.8
0.6
− 0.08
−8 mA
−1.2
VCE = −4 V
− 0.09
−10
Collector output capacitance
C (pF)
(Common base, input open circuited) ob
Collector power dissipation PC (W)
Ta = 25°C
2
IC  VBE
− 0.1
Collector current IC (A)
PC  Ta
1.2
100
10
f = 1 MHz
Ta = 25°C
0
−10
−20
−30
Collector-base voltage VCB (V)
−40
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2003 SEP