Maxim MAX2207EBS Rf power detectors in ucsp Datasheet

19-2015; Rev 2; 8/02
KIT
ATION
EVALU
E
L
B
A
AVAIL
RF Power Detectors in UCSP
Features
♦ Space-Saving 2
✕2
UCSP Occupies Only 1mm2
♦ Internal Temperature Compensation Gives ±0.3dB
Detection Accuracy
♦ No External Filter or Op Amp Required
♦ Power-Detection Range
40dB (MAX2206)
25dB (MAX2205/MAX2207/2208)
Ordering Information
PART
TEMP RANGE
BUMP-PACKAGE
MAX2205EBS
-40°C to +85°C
2 × 2 UCSP*
MAX2206EBS
-40°C to +85°C
2 × 2 UCSP*
MAX2207EBS
-40°C to +85°C
2 × 2 UCSP*
MAX2208EBS
-40°C to +85°C
2 × 2 UCSP*
*Requires solder temperature profile described in the Absolute
Maximum Ratings section.
2 ✕ 2 UCSP
Applications
1.01 mm ✕ 1.01 mm
Dual-Band GSM/EDGE Handsets
Dual-Band CDMA/TDMA Handsets
UCSP is a trademark of Maxim Integrated Products, Inc.
WCDMA Handsets
PA Modules
Pin Configuration/Functional Diagram/Typical Operating Circuit
TOP VIEW
SHDN LOGIC INPUT
10kΩ (MAX2205)
240Ω (MAX2206/MAX2207/MAX2208)
FROM PA OUTPUT
(MAX2205)
680Ω (MAX2205)
10Ω (MAX2206)
0Ω (MAX2207/MAX2208)
FROM COUPLER/TAP
(MAX2206/MAX2207/MAX2208)
47pF
VCC
RFIN/SHDN
(A1)
TEMPERATURECOMPENSATED
PEAK
DETECTOR
VCC
(A2)
27pF
MAX2205
MAX2206
MAX2207
MAX2208
SHUTDOWN
LOGIC
GND
(B1)
OUT
(B2)
TO ADC
CFILTER
(OPTIONAL)
UCSP
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX2205–MAX2208
General Description
The MAX2205–MAX2208 wideband (800MHz to 2GHz)
power detectors are ideal for GSM/EDGE (MAX2206),
TDMA (MAX2207), and CDMA (MAX2205/MAX2208)
applications. The MAX2206/MAX2207/MAX2208 take an
RF signal from a directional coupler at the input, and output a highly repeatable voltage. The output voltage
increases monotonically with increasing input power. The
output is compensated for temperature and process
shifts, reducing the worst-case variation to less than
±1dB at full power and ±2.5dB at the lowest power.
The MAX2206 features 40dB dynamic range, making
it ideally suited to GSM/EDGE applications. The
MAX2207 offers reduced current consumption for TDMA
applications. The MAX2205/MAX2208 each have an integrated filter to allow for average power detection of
CDMA signals over a 25dB dynamic range. The
MAX2206/MAX2207/MAX2208 offer internal 50Ω termination for interfacing with a directional coupler. The
MAX2205 has a high-impedance input to provide a lowloss resistive tap in CDMA applications. All devices allow
the user to control the averaging time constant externally.
The MAX2205–MAX2208 come in a space-saving 2 ✕ 2,
0.5mm-pitch UCSP™ and require only three external
components.
MAX2205–MAX2208
RF Power Detectors in UCSP
ABSOLUTE MAXIMUM RATINGS
VCC to GND ...........................................................-0.3V to +6.5V
RFIN/SHDN to GND....................................-0.3V to (VCC + 0.3V)
RF Input Power (800MHz)
(MAX2206/MAX2207/MAX2208) .................................+20dBm
RF Input Power (2GHz)
(MAX2206/MAX2207/MAX2208) .................................+17dBm
RF Input Voltage (800MHz) (MAX2205) ..............................1.5VP
RF Input Voltage (2GHz) (MAX2205) ..................................0.8VP
Continuous Power Dissipation (TA = +70°C)
2 ✕ 2 UCSP (derate 3.8mW/°C above +70°C) ............303mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +160°C
Bump Temperature (soldering) (Note 1)
Infrared (15s) ..............................................................+220°C
Vapor Phase (60s) ......................................................+215°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (MAX2205–MAX2208)
(VCC = +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied, TA = -40°C to +85°C. Typical values are at VCC = +2.85V and
TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
Supply Voltage
SYMBOL
CONDITIONS
VCC
MAX2206
IIDLE
Shutdown Supply Current
I SHDN
SHDN = 0V
OUT Voltage During Shutdown
VOUT
SHDN = 0V
VH
Logic-Low Threshold
VL
TYP
2.7
Idle Supply Current
Logic-High Threshold
MIN
MAX
UNITS
5.0
V
3.5
5.5
2
3.5
0.5
10
µA
0.01
V
MAX2205/MAX2207/MAX2208
2.0
mA
V
0.6
V
IIH
SHDN = +2.0V
-1
+10
IIL
-1
+1
Output Current Source Capability
SHDN = +0.6V
MAX2206/MAX2207, VOUT = +2.5V
400
µA
Output Current Sink Capability
MAX2206/MAX2207, VOUT = 0V
300
µA
SHDN Input Current
µA
AC ELECTRICAL CHARACTERISTICS (MAX2205)
(MAX2205 EV kit, VCC = +2.7V to +5.0V, SHDN = +2.0V, fRF = 800MHz to 2GHz, 50Ω system, TA = -40°C to +85°C. Typical values
are at VCC = +2.85V and TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
fRF
Turn-On Time
tON
Response Time
Variation Due to Temperature
2
SYMBOL
RF Input Frequency
tR
CONDITIONS
MIN
TYP
800
(Note 3)
VCC = +2.85V,
TA = -40°C to +85°C
MAX
UNITS
2000
MHz
2
µs
15
µs
High input power
(Note 4)
±0.3
±1
Low input power
(Note 5)
±1.3
±2.5
dB
_______________________________________________________________________________________
RF Power Detectors in UCSP
(MAX2206/MAX2207/MAX2208 EV kit, VCC = +2.7V to +5.0V, SHDN = 2.0V, fRF = 800MHz to 2GHz, 50Ω system, TA = -40°C to
+85°C. Typical values are at VCC = +2.85V and TA = +25°C, unless otherwise noted.) (Note 2)
PARAMETER
SYMBOL
RF Input Frequency
CONDITIONS
MIN
fRF
RF Input VSWR
TYP
800
VSWR
Turn-On Time
UNITS
2000
MHz
2:1
tON
Response Time (Note 3)
MAX
MAX2206/MAX2207
tR
2
µs
300
ns
MAX2208
15
High input power (Note 6)
VCC = +2.85V,
TA = -40°C to +85°C Low input power (Note 7)
Variation Due to Temperature
µs
±0.3
±1
±1.3
±2.5
dB
Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recommended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
Note 2: Specifications over TA = -40°C to +85°C are guaranteed by design. Production tests are performed at TA = +25°C.
Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of VOUT.
Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from
+31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation
from +28dBm is specified.
Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than specified in Note 4.
Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is
specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm
is specified.
Note 7: For MAX2206, output voltage is held 40dB lower than specified in Note 7; for MAX2207/MAX2208, output voltage is held 25dB
lower than specified in Note 7.
Typical Operating Characteristics
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
1.2
1.0
VCC = +3.5V
TA = +85°C
0.8
0.6
VCC = +2.7V to +3.5V
fRF = 2GHz
TA = -40°C TO +85°C
1.4
1.2
1.0
0.8
0.6
VCC = +3.5V
TA = +85°C
0.4
320
MAX2205/06/07/08 toc03
1.4
MAX2205/06/07/08 toc02
1.6
1.6
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 800MHz
TA = -40°C TO +85°C
1.8
OUTPUT VOLTAGE (V)
MAX2205/06/07/08 toc01
2.0
MAX2206
RESPONSE TIME vs. TEMPERATURE
fRF = 900MHz
PIN = +15dBm
315
310
RESPONSE TIME (ns)
MAX2206
OUTPUT VOLTAGE vs. INPUT POWER
305
300
295
VCC = +2.7V
290
285
280
0.4
275
0.2
VCC = +2.7V
TA = -40°C
0.2
0
-25
-20
-15
-10
-5
0
POWER (dBm)
5
10
VCC = +2.7V
TA = -40°C
0
15
-25
-20
-15
-10
-5
0
POWER (dBm)
5
10
15
VCC = +3.5V
270
VCC = +3.0V
265
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
3
MAX2205–MAX2208
AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)
Typical Operating Characteristics (continued)
(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)
0.5
1.0
0.8
VCC = +3.5V
TA = +85°C
0.6
0
0
-10
-5
0
5
10
-10
15
-5
0
5
10
VCC = +2.7V
15
VCC = +3.0V
14
13
VCC = +3.5V
12
-40
1.5
VCC = +3.5V
TA = +85°C
1.0
VCC = +2.7V
TA = -40°C
11
-15
10
35
60
TEMPERATURE (°C)
85
35
0.8
60
85
VCC = +2.7V to +3.5V
fRF = 1880MHz
TA = -40°C to +85°C
MAX2205 EV KIT
0.7
0.6
0.5
VCC = +3.5V
TA = +85°C
0.4
0.3
VCC = +2.7V
TA = -40°C
0.1
0
0
-40
10
0.2
0.5
10
-15
MAX2205
OUTPUT VOLTAGE vs. INPUT POWER
MAX2205/06/07/08 toc08
16
VCC = +2.7V to +3.5V
fRF = 836MHz
TA = -40°C to +85°C
MAX2205 EV KIT
2.0
OUTPUT VOLTAGE (V)
17
MAX2205/06/07/08 toc07
MAX2205
OUTPUT VOLTAGE vs. INPUT POWER
2.5
VCC = +3.5V
TEMPERATURE (°C)
MAX2205/MAX2208
RESPONSE TIME vs. TEMPERATURE
fRF = 900MHz
PIN = +15dBm (MAX2208)
PIN = +31dBm (MAX2205)
VCC = +3.0V
285
275
POWER (dBm)
18
290
15
POWER (dBm)
19
VCC = +2.7V
295
280
VCC = +2.7V
TA = -40°C
0.2
300
MAX2205/06/07/08 toc06
1.2
0.4
VCC = +2.7V
TA = -40°C
MAX2205/06/07/08 toc05
1.4
fRF = 900MHz
PIN = +15dBm
305
MAX2205/06/07/08 toc09
VCC = +3.5V
TA = +85°C
1.6
310
RESPONSE TIME (ns)
1.0
VCC = +2.7V to +3.5V
fRF = 2GHz
TA = -40°C TO +85°C
OUTPUT VOLTAGE (V)
1.5
1.8
OUTPUT VOLTAGE (V)
VCC = +2.7V to +3.5V
fRF = 800MHz
TA = -40°C TO +85°C
2.0
OUTPUT VOLTAGE (V)
MAX2205/06/07/08 toc04
2.5
MAX2207
RESPONSE TIME vs. TEMPERATURE
MAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
MAX2207/MAX2208
OUTPUT VOLTAGE vs. INPUT POWER
RESPONSE TIME (µs)
MAX2205–MAX2208
RF Power Detectors in UCSP
6
11
16
21
26
31
6
10
14
18
22
26
INPUT POWER (dBm)
INPUT POWER (dBm)
Pin Description
4
PIN
NAME
A1
RFIN/SHDN
A2
VCC
B1
GND
B2
OUT
FUNCTION
RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic
input through a resistor. Drive low to turn the part off, drive high, or connect to VCC to turn the part on.
Power-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible.
Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to
connect the ground pin to the ground plane. Connect to PC board ground plane with as low
inductance as possible.
Detector Output
_______________________________________________________________________________________
RF Power Detectors in UCSP
The MAX2205 has high-input impedance for use with
high-value resistive tapping from a CDMA power amplifier. This coupling method is the lowest cost and lowest
loss when used with an isolator. The application circuit
is shown in Figure 2. Connect C FILTER from the
MAX2205 output to GND to reduce residual amplitude
ripple. For IS98A reverse channel signal with peak-toavg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-P ripple at 28dBm PA output and 390µs response time. For
CDMA2000 (pilot + DCCH) with peak-to-avg ratio of
5.4dB, the ripple is about 65mVP-P at 26dBm PA output.
The MAX2205 input impedance is listed in Table 1.
Layout
As with any RF circuit, the layout of the MAX2205–
MAX2208 circuits affects performance. Use a short
50Ω line at the input with multiple ground vias along the
length of the line. The input capacitor and resistor
should be placed as close to the IC as possible. The
VCC input should be bypassed as close as possible to
the IC with multiple vias connecting the capacitor to
ground. Refer to the MAX2205–MAX2208 EV kit data
sheet for a sample layout and details.
PA
UCSP Reliability
The UCSP is a unique package that greatly reduces
board space compared to other packages. UCSP reliability is integrally linked to the user’s assembly methods,
circuit board material, and usage environment. The user
should closely review these areas when considering
using a UCSP. This form factor might not perform equally
to a packaged product through traditional mechanical
reliability tests. Performance through operating life test
and moisture resistance remains uncompromised, as it
is determined primarily by the wafer-fabrication process.
Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must
be considered because the package is attached through
direct solder contact to the user’s PC board. Testing
done to characterize the UCSP reliability performance
shows that it is capable of performing reliably through
environmental stresses. Results of environmental stress
tests and additional usage data and recommendations
are detailed in the UCSP application note, which can be
found on Maxim’s website, www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 344
ISOLATOR/
CIRCULATOR
COUPLER
TO ANT
PA
50Ω
TO ANT
680Ω
TO ADC
OR OP AMP
MAX2206
MAX2207
MAX2208
PEAK
DETECTOR
Figure 1. MAX2206/MAX2207/MAX2208 Typical Application
Circuit
47pF
TO ADC
MAX2205
PEAK
DETECTOR
CFILTER
Figure 2. MAX2205 Typical Application Circuit
_______________________________________________________________________________________
5
MAX2205–MAX2208
Applications Information
The MAX2205–MAX2208 have internal termination
resistors for use with directional couplers. The application circuit is shown in Figure 1. The output of the
detector goes to an op amp in an analog GSM powercontrol scheme, or to an ADC in other systems such as
TDMA or discrete-time GSM power control.
MAX2205–MAX2208
RF Power Detectors in UCSP
Table 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded)
FREQUENCY (GHz)
PIN = -30dBm
PIN = +5dBm
REAL
IMAG
REAL
IMAG
0.8
189.9
-51.7
199.4
-54.0
0.9
177.3
-47.4
185.5
-49.4
1.0
165.8
-43.6
175.2
-45.7
1.1
155.2
-40.3
167.0
-42.5
1.2
146.4
-37.6
158.8
-39.8
1.3
138.8
-35.0
150.9
-37.3
1.4
131.5
-32.9
144.0
-35.1
1.5
123.3
-30.7
139.4
-33.3
1.6
115.0
-29.1
131.6
-31.8
1.7
107.2
-27.5
132.0
-30.9
1.8
110.7
-26.7
126.6
-29.3
1.9
105.3
-25.2
120.3
-27.9
2.0
94.7
-23.6
111.4
-26.7
Table 2. MAX2205–MAX2208 Device
Marking Codes
DEVICE
6
CODE
MAX2205EBS
AFR
MAX2206EBS
AFO
MAX2207EBS
AFP
MAX2208EBS
AFQ
_______________________________________________________________________________________
RF Power Detectors in UCSP
4L, UCSP 2x2.EPS
PACKAGE OUTLINE, 2x2 UCSP
21-0117
G
1
1
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
7 _____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2002 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX2205–MAX2208
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,
go to www.maxim-ic.com/packages.)
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