TOREX XCM517AC06DR

XCM517 Series
ETR2425-007
600mA Synchronous Dual Output Step-Down DC/DC Converters
■GENERAL DESCRIPTION
The XCM517 series is a multi combination module IC which comprises of two 600mA driver transistor built-in synchronous
step–down DC/DC converter. The XCM517 series is available in an ultra small package USP-12B01 suited for space
conscious applications.
The XCM517 series is a group of synchronous-rectification type DC/DC converters with a built-in 0.42ΩP-channel driver
transistor and 0.52ΩN-channel switching transistor, designed to allow the use of ceramic capacitors. The ICs enable a high
efficiency, stable power supply with an output current of 600mA to be configured using only a coil and two capacitors connected
externally. Operating voltage range is from 2.7V to 6.0V. With the built-in oscillator, either 1.2MHz or 3.0MHz can be selected
for suiting to your particular application. As for operation mode, the XCM517xA / XCM517xB series are PWM control, the
XCM517xC / XCM517xD series are automatic PWM/PFM switching control, allowing fast response, low ripple and high
efficiency over the full range of loads (from light load to heavy load).
The soft start and current control functions are internally optimized. During stand-by, all circuits are shutdown to reduce
current consumption to as low as 1.0μA or less. With the built-in UVLO (Under Voltage Lock Out) function, the internal
P-channel driver transistor is forced OFF when input voltage becomes 1.4V or lower.
■FEATURES
■APPLICATIONS
●Mobile phones, Smart phones
●Bluetooth equipment
●Personal Device Assistances
●Portable games
●Digital still cameras, camcorders
■TYPICAL APPLICATION CIRCUIT
P-ch Driver Transistor Built-In
N-ch Driver Transistor Built-In
Input Voltage Range
High Efficiency
Output Current
Oscillation Frequency
Maximum Duty Cycle
Soft-Start Circuit Built-In
Current Limiter Circuit Built-In
Ceramic Capacitor Compatible
Control Methods
: ON resistance 0.42Ω
: ON resistance 0.52Ω
: 2.7V ~ 6.0V
: 92% (TYP.)
: 600mA
: 1.2MHz, 3.0MHz (+15%)
: 100%
(Constant Current & Latching)
: PWM (XCM517xA / XCM517xB)
PWM/PFM Auto (XCM517xC / XCM517xD)
*Performance depends on external components and wiring on the PCB.
Combination of voltage
1 ch
2ch
XCM517xx01D
1.2V
1.8V
XCM517xx02D
1.2V
3.3V
XCM517xx03D
1.8V
3.3V
XCM517xx06D
1.5V
1.8V
XCM517xx07D
1.5V
3.3V
*The other combination of voltage is semi-custom.
* The dotted lines in the circuit indicates the connection using through-holes at the
backside of the PC board
VOUT1
1
12
Lx1
PGND
11
PGND1
VIN1
Lx
VOUT
XC9235/XC9236
AGND1
2
AGND
EN1
3
CE
VIN
10
VIN2
4
VIN
CE
9
PGND2
5
XC9235/XC9236
Lx2
6
Lx
VOUT
EN2
8
AGND2
7
VOUT2
(TOP VIEW)
1/28
XCM517 Series
■PIN CONFIGURATIOIN
1 VOUT1
LX112
PGND1 11
*1
2 AGND1
3 EN1
VIN1 10
4 VIN2
EN2 9
AGND2 8
5 PGND2
*2
6 Lx2
VOUT2 7
USP-12B01
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
USP-12B01
XCM517
PIN NAME
XC9235/XC9236
XC9235/XC9236
1
VOUT1
VOUT
―
2
AGND1
AGND
―
3
EN1
CE
―
4
VIN2
―
VIN
5
PGND2
―
PGND
6
Lx2
―
Lx
7
VOUT2
―
VOUT
8
AGND2
―
AGND
9
EN2
―
CE
10
VIN1
VIN
―
11
PGND1
PGND
―
12
Lx1
Lx
―
FUNCTIONS
DC/DC-1 Channel Block:
Output Voltage sense
DC/DC-1 Channel Block:
Analog Ground
DC/DC-1 Channel Block:
ON/OFF Control
DC/DC-2 Channel Block:
Power Input
DC/DC-2 Channel Block :
Power Ground
DC/DC-2 Channel Block :
Switching
DC/DC-2 Channel Block :
Output Voltage sense
DC/DC-2 Channel Block :
Analog Ground
DC/DC-2 Channel Block :
ON/OFF Control
DC/DC-1 Channel Block :
Power Input
DC/DC-1 Channel Block :
Power Ground
DC/DC-1 Channel Block :
Switching
NOTE:
* A dissipation pad on the reverse side of the package should be electrically isolated.
*1: Electrical potential of the DC/DC 1 channels’ dissipation pad should be VSS level.
*2: Electrical potential of the DC/DC 2 channels’ dissipation pad should be VSS level.
Care must be taken for an electrical potential of each dissipation pad so as to enhance mounting strength and heat release when the pad
needs to be connected to the circuit.
2/28
XCM517
Series
■PRODUCT CLASSIFICATION
●Ordering Information
XCM517①②③④⑤⑥
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
①②
Control, Oscillation
Frequency and Options
-
: See the chart below
③④
Output Voltage
-
: Internally set sequential number relating to output voltage
(See the chart below)
⑤
Package
D
: USP-12B01
⑥
Device Orientation
R
: Embossed tape, standard feed
DESIGNATOR ①②
①②
CONTROL
OCSILLATION
FREQUENCY
CL DISCHARGE
HIGH SPEED
SOFT-START
EN INPUT LOGIC
AA
AB
AC
AD
BA
BB
BC
BD
PWM Control
PWM Control
PWM/PFM Auto
PWM/PFM Auto
PWM Control
PWM Control
PWM/PFM Auto
PWM/PFM Auto
1.2M
3.0M
1.2M
3.0M
1.2M
3.0M
1.2M
3.0M
Not Available
Not Available
Not Available
Not Available
Available
Available
Available
Available
Not Available
Not Available
Not Available
Not Available
Available
Available
Available
Available
High Active
High Active
High Active
High Active
High Active
High Active
High Active
High Active
DESIGNATOR ③④
Output Voltage
③④
VOUT1
VOUT2
01
02
03
06
07
1.2
1.2
1.8
1.5
1.5
1.8
3.3
3.3
1.8
3.3
*This series are semi-custom products.
For other combinations, output voltages and etc., please ask Torex sales contacts.
3/28
XCM517 Series
■BLOCK DIAGRAMS
XC9235A / XC9236A Series
XC9235B / XC9236B Series
XC9235A/XC9236A
XC9235B/XC9236B
Available
with CL Discharge,
High Speed Soft-Start
(CL放電機能有
、 高速ソフトスタート
）
Phase
Compensation
R2
Logic
Synch
Buffer
Drive
Lx
Logic
VIN
Synch
Buffer
Drive
Lx
VSHORT
Vref with
Soft Start,
CE
PWM/PFM
Selector
PWM/PFM
Selector
CE/
UVLO Cmp
Ramp Wave
Generator
OSC
UVLO Cmp
UVLO
VSS
PWM
Comparator
R1
VSHORT
Vref with
Soft Start,
CE
Error Amp.
PWM
Comparator
R1
Current Feedback
Current Limit
VOUT
R2
Error Amp.
VIN
Phase
Compensation
Current Feedback
Current Limit
VOUT
VSS
R3
CE/MODE
Control
Logic
R4
CE
Ramp Wave
Generator
OSC
UVLO
R3
CE/MODE
Control
Logic
R4
CE
NOTE: The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "L" level inside,
and XC9235 series chooses only PWM control.
The signal from CE/MODE Control Logic to PWM/PFM Selector is being fixed to "H" level inside,
and XC9236 series chooses only PWM/PFM automatic switching control.
Diodes inside the circuit are ESD protection diodes and parasitic diodes.
*Diodes inside the circuit are an ESD protection diode and a parasitic diode.
■MAXIMUM ABSOLUTE RATINGS
PARAMETER
VIN1 / VIN2 Voltage
Lx1 / Lx2 Voltage
VOUT1 / VOUT2 Voltage
EN1 / EN2 Voltage
Lx1 / Lx2 Current
Power Dissipation (Ta=25℃)
USP-12B01
4/28
SYMBOL
RATINGS
UNITS
VIN1 / VIN2
VLx1 / VLx2
VOUT1 / VOUT2
VEN1 / VEN2
ILx1 / ILx2
Pd
- 0.3 ∼ 6.5
- 0.3 ∼ VIN1 + 0.3 or 6.5
- 0.3 ∼ 6.5
- 0.3 ∼ 6.5
±1500
150
V
V
V
V
mA
mW
Junction Temperature
Tj
125
℃
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
- 40 ∼ + 85
- 55 ∼ + 125
℃
℃
XCM517
Series
■ELECTRICAL CHARACTERISTICS
●XCM517Ax, 1ch Block /2ch Block
PARAMETER
SYMBOL
Output Voltage
VOUT
Operating Voltage Range
VIN
VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
CONDITIONS
When connected to external components,
VIN=VEN=5.0V, IOUT1=30mA
Maximum Output Current
IOUTMAX
When connected to external components,
(*8)
VIN=VOUT(E)+2.0V, VEN=1.0V
UVLO Voltage
VUVLO
VEN=VIN,VOUT=0V,
(*1, *10)
Voltage which Lx pin holding “L” level
Supply Current
IDD
Stand-by Current
ISTB
VIN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V
Oscillation Frequency
fOSC
When connected to external components,
VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA
PFM Switching Current
IPFM
When connected to external components,
(*11)
VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA
VIN=VEN=5.0V, VOUT=VOUT(E)×1.1V
IENH
EN "L" Current
IENL
-
6.0
V
①
600
-
-
mA
①
1.00
1.40
1.78
V
③
μA
②
0
1.0
μA
②
1020
1200
1380
kHz
①
120
160
200
mA
①
(*11)
IOUT=30mA
-40℃≦Topr≦85℃
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “H” level
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “L” level
VIN=VEN=5.0V, VOUT=0V
2.7
-
VIN=VEN5.0V, VOUT=VOUT (E)×1.1V
When connected to external components,
(*7)
VEN=VIN＝VOUT (E)+1.2V , IOUT =100mA
(*3)
VIN=VEN=5.0V, VOUT=0V,ILX =100mA
(*3)
VIN=VEN=3.6V, VOUT=0V,ILX =100mA
(*4)
VIN=VEN=5.0V
(*4)
VIN=VEN=3.6V,
VIN=VOUT =5.0V, VEN=0V, LX=0V
VIN=VOUT =5.0V, VEN=0V, LX=5.0V
(*7)
VIN=VEN=5.0V, VOUT=VOUT (E)×0.9V
EN "H" Current
①
50
MINDTY
VENL
V
33
Minimum Duty Ratio
EN "L" Level Voltage
1.836
22
VIN=VEN5.0V, VOUT=VOUT (E)×0.9V
VENH
1.800
15
VEN=VIN=(C-1) IOUT=1mA
EN "H" Level Voltage
1.764
-
MAX IPFM
Lx SW "H" ON Resistance 1
RLｘH
Lx SW "H" ON Resistance 2
RLｘH
Lx SW "L" ON Resistance 1
RLｘL
Lx SW "L" ON Resistance 2
RLｘL
(*5)
Lx SW "H" Leak Current
ILeakH
(*5)
Lx SW "L" Leak Current
ILeakL
(*9)
Current Limit
ILIM
Output Voltage
△VOUT
Temperature
VOUT・△topr
Characteristics
UNITS CIRCUIT
-
MAXDTY
EFFI
MAX.
(XCM517AA)
Maximum IPFM Limit
Efficiency
TYP.
(XCM517AC)
Maximum Duty Ratio
(*2)
MIN.
%
①
100
200
-
-
%
②
-
-
0
%
②
-
92
-
%
①
900
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.66
0.77
1.0
1.0
1350
Ω
Ω
Ω
Ω
μA
μA
mA
④
④
⑤
⑤
⑥
-
±100
-
ppm/ ℃
①
0.65
-
6.0
V
③
VSS
-
0.25
V
③
0.
μA
⑤
- 0.1
VIN=5.0V, VEN=0V, VOUT=0V
- 0.1
0.1
μA
⑤
When connected to external components,
0.5
1.0
2.5
ms
①
Soft Start Time
tSS
VEN=0V → VIN , IOUT=1mA
VIN= VEN=5.0V, VOUT=0.8× VOUT(E),
Latch Time
tLAT
1.0
20.0
ms
⑦
(*6)
Short Lx at 1Ω resistance
Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at
Short Protection
VSHORT
1Ω resistance, VOUT voltage which Lx becomes “L”
0.675
0.900
1.125
V
⑦
Threshold Voltage
level within 1ms
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage
NOTE:
*1: Including hysteresis width of operating voltage.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: Design value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: Time until it short-circuits DCOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse
generating.
*7: When VOUT(E)+1.2V<2.7V, VIN=2.7V
*8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*9: Current limit denotes the level of detection at peak of coil current.
*10: "H"＝VIN∼VIN - 1.2V, "L"＝+ 0.1V ∼ - 0.1V
*11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions.
*12: The electrical characteristics shows 1 channel values when the other channel is stopped.
5/28
XCM517 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCM517Ax, 1ch Block / 2ch Block
PARAMETER
SYMBOL
Output Voltage
VOUT
Operating Voltage Range
VIN
VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
CONDITIONS
When connected to external components,
VIN=VEN=5.0V, IOUT1=30mA
Maximum Output Current
IOUTMAX
When connected to external components,
(*8)
VIN=VOUT(E)+2.0V, VEN=1.0V
UVLO Voltage
VUVLO
VEN=VIN,VOUT=0V,
(*1, *10)
Voltage which Lx pin holding “L” level
Supply Current
IDD
Stand-by Current
ISTB
VIN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V
Oscillation Frequency
fOSC
When connected to external components,
VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA
PFM Switching Current
IPFM
When connected to external components,
(*11)
VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA
VIN=VEN=5.0V, VOUT=VOUT(E)×1.1V
EN "L" Level Voltage
VENL
EN "H" Current
IENH
EN "L" Current
IENL
-
6.0
V
①
600
-
-
mA
①
1.00
1.40
1.78
V
③
μA
②
0
1.0
μA
②
2550
3000
3450
kHz
①
170
220
270
mA
①
(*11)
IOUT=30mA
-40℃≦Topr≦85℃
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “H” level
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “L” level
VIN=VEN=5.0V, VOUT=0V
2.7
-
VIN=VEN5.0V, VOUT=VOUT (E)×1.1V
When connected to external components,
(*7)
VEN=VIN＝VOUT (E)+1.2V , IOUT =100mA
(*3)
VIN=VEN=5.0V, VOUT=0V,ILX =100mA
(*3)
VIN=VEN=3.6V, VOUT=0V,ILX =100mA
(*4)
VIN=VEN=5.0V
(*4)
VIN=VEN=3.6V,
VIN=VOUT =5.0V, VEN=0V, LX=0V
VIN=VOUT =5.0V, VEN=0V, LX=5.0V
(*7)
VIN=VEN=5.0V, VOUT=VOUT (E)×0.9V
VENH
①
65
MINDTY
EN "H" Level Voltage
V
35
Minimum Duty Ratio
△VOUT
1.836
46
VIN=VEN5.0V, VOUT=VOUT (E)×0.9V
VOUT・△topr
1.800
21
VEN=VIN=(C-1) IOUT=1mA
RLｘH
RLｘH
RLｘL
RLｘL
ILeakH
ILeakL
ILIM
1.764
-
MAX IPFM
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
(*5)
Lx SW "H" Leak Current
(*5)
Lx SW "L" Leak Current
(*9)
Current Limit
Output Voltage
Temperature
Characteristics
UNITS CIRCUIT
-
MAXDTY
EFFI
MAX.
(XCM517AB)
Maximum IPFM Limit
Efficiency
TYP.
(XCM517AD)
Maximum Duty Ratio
(*2)
MIN.
200
300
%
①
100
-
-
%
②
-
-
0
%
②
-
86
-
%
①
900
0.35
0.42
0.45
0.52
0.01
0.01
1050
0.55
0.67
0.66
0.77
1.0
1.0
1350
Ω
Ω
Ω
Ω
μA
μA
mA
④
④
⑤
⑤
⑥
-
±100
-
ppm/ ℃
①
0.65
-
6.0
V
③
VSS
-
0.25
V
③
0.
μA
⑤
- 0.1
VIN=5.0V, VEN=0V, VOUT=0V
- 0.1
0.1
μA
⑤
When connected to external components,
0.5
1.0
2.5
ms
①
Soft Start Time
tSS
VEN=0V → VIN , IOUT=1mA
VIN= VEN=5.0V, VOUT=0.8× VOUT(E),
Latch Time
tLAT
1.0
20.0
ms
⑦
(*6)
Short Lx at 1Ω resistance
Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at
Short Protection
0.675
0.900
1.125
V
⑦
VSHORT
1Ω resistance, VOUT voltage which Lx becomes “L”
Threshold Voltage
level within 1ms
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage
NOTE:
*1: Including hysteresis width of operating voltage.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: Design value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: Time until it short-circuits DCOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse
generating.
*7: When VOUT(E)+1.2V<2.7V, VIN=2.7V
*8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*9: Current limit denotes the level of detection at peak of coil current.
*10: "H"＝VIN∼VIN - 1.2V, "L"＝+ 0.1V ∼ - 0.1V
*11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions.
*12: The electrical characteristics shows 1 channel values when the other channel is stopped.
6/28
XCM517
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCM517Bx, 1ch Block / 2ch Block
PARAMETER
SYMBOL
Output Voltage
VOUT
Operating Voltage Range
VIN
VOUT=1.8V, fOSC=1.2MHz, Ta=25℃
CONDITIONS
When connected to external components,
VIN=VEN=5.0V, IOUT1=30mA
Maximum Output Current
IOUTMAX
When connected to external components,
(*8)
VIN=VOUT(E)+2.0V, VEN=1.0V
UVLO Voltage
VUVLO
VEN=VIN,VOUT=0V,
(*1, *10)
Voltage which Lx pin holding “L” level
Supply Current
IDD
Stand-by Current
ISTB
VIN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V
Oscillation Frequency
fOSC
When connected to external components,
VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA
PFM Switching Current
IPFM
When connected to external components,
(*11)
VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA
VIN=VEN=5.0V, VOUT=VOUT(E)×1.1V
V
①
2.7
-
6.0
V
①
600
-
-
mA
①
1.00
1.40
1.78
V
②
μA
③
50
33
-
0
1.0
μA
③
1020
1200
1380
kHz
①
120
160
200
mA
①
%
①
(*11)
VIN=VEN5.0V, VOUT=VOUT (E)×0.9V
VIN=VEN5.0V, VOUT=VOUT (E)×1.1V
When connected to external components,
(*7)
VEN=VIN＝VOUT (E)+1.2V , IOUT =100mA
(*3)
VIN=VEN=5.0V, VOUT=0V,ILX =100mA
(*3)
VIN=VEN=3.6V, VOUT=0V,ILX =100mA
(*4)
VIN=VEN=5.0V
(*4)
VIN=VEN=3.6V,
VIN=VOUT =5.0V, VEN=0V, LX=0V
(*7)
VIN=VEN=5.0V, VOUT=VOUT (E)×0.9V
△VOUT
1.836
22
MINDTY
VOUT・△topr
1.800
15
MAXDTY
RLｘH
RLｘH
RLｘL
RLｘL
ILeakH
ILIM
1.764
-
Minimum Duty Ratio
EFFI
UNITS CIRCUIT
-
Maximum Duty Ratio
Efficiency
MAX.
(XCM517BA)
MAX IPFM
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
(*5)
Lx SW "H" Leak Current
(*9)
Current Limit
Output Voltage
Temperature
Characteristics
TYP.
(XCM517BC)
Maximum IPFM Limit
(*2)
VEN=VIN=(C-1) IOUT=1mA
MIN.
IOUT=30mA
-40℃≦Topr≦85℃
200
100
-
-
%
②
-
-
0
%
②
-
92
-
%
①
900
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.66
0.77
1.0
1350
Ω
Ω
Ω
Ω
μA
mA
④
④
⑨
⑥
-
±100
-
ppm/ ℃
①
0.65
-
6.0
V
③
VSS
-
0.25
V
③
IENH
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “H” level
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “L” level
VIN=VEN=5.0V, VOUT=0V
- 0.1
0.
μA
⑤
IENL
VIN=5.0V, VEN=0V, VOUT=0V
- 0.1
-
0.1
μA
⑤
-
0.25
0.4
ms
①
1.0
-
20.0
ms
⑦
0.675
0.900
1.125
V
⑦
200
300
450
Ω
⑧
EN "H" Level Voltage
VENH
EN "L" Level Voltage
VENL
EN "H" Current
EN "L" Current
Soft Start Time
tSS
Latch Time
tLAT
Short Protection
Threshold Voltage
VSHORT
ＣＬDischarge
Rdischg
When connected to external components,
VEN=0V → VIN , IOUT=1mA
VIN= VEN=5.0V, VOUT=0.8× VOUT(E),
(*6)
Short Lx at 1Ω resistance
Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes “L”
level within 1ms
VIN = 5.0V LX = 5.0V VEN = 0V VOUT = open
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage
NOTE:
*1: Including hysteresis width of operating voltage.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: Design value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: Time until it short-circuits DCOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse
generating.
*7: When VOUT(E)+1.2V<2.7V, VIN=2.7V
*8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*9: Current limit denotes the level of detection at peak of coil current.
*10: "H"＝VIN∼VIN - 1.2V, "L"＝+ 0.1V ∼ - 0.1V
*11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions.
*12: The electrical characteristics shows 1 channel values when the other channel is stopped.
7/28
XCM517 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XCM517Bx, 1ch Block /2ch Block
PARAMETER
SYMBOL
Output Voltage
VOUT
Operating Voltage Range
VIN
VOUT=1.8V, fOSC=3.0MHz, Ta=25℃
CONDITIONS
When connected to external components,
VIN=VEN=5.0V, IOUT1=30mA
Maximum Output Current
IOUTMAX
When connected to external components,
(*8)
VIN=VOUT(E)+2.0V, VEN=1.0V
UVLO Voltage
VUVLO
VEN=VIN,VOUT=0V,
(*1, *10)
Voltage which Lx pin holding “L” level
Supply Current
IDD
Stand-by Current
ISTB
VIN=5.0V, VEN=0V, VOUT=VOUT(E)×1.1V
Oscillation Frequency
fOSC
When connected to external components,
VIN=VOUT(E)+2.0V,VEN=1.0V, IOUT=100mA
PFM Switching Current
IPFM
When connected to external components,
(*11)
VIN=VOUT(E)+2.0V, VEN=VIN , IOUT=1mA
VIN=VEN=5.0V, VOUT=VOUT(E)×1.1V
V
①
2.7
-
6.0
V
①
600
-
-
mA
①
1.00
1.40
1.78
V
②
μA
③
65
35
-
0
1.0
μA
③
2550
3000
3450
kHz
①
170
220
270
mA
①
(*11)
Minimum Duty Ratio
MINDTY
VIN=VEN5.0V, VOUT=VOUT (E)×1.1V
When connected to external components,
(*7)
VEN=VIN＝VOUT (E)+1.2V , IOUT =100mA
(*3)
VIN=VEN=5.0V, VOUT=0V,ILX =100mA
(*3)
VIN=VEN=3.6V, VOUT=0V,ILX =100mA
(*4)
VIN=VEN=5.0V
(*4)
VIN=VEN=3.6V,
VIN=VOUT =5.0V, VEN=0V, LX=0V
(*7)
VIN=VEN=5.0V, VOUT=VOUT (E)×0.9V
△VOUT
1.836
46
VIN=VEN5.0V, VOUT=VOUT (E)×0.9V
VOUT・△topr
1.800
21
VEN=VIN=(C-1) IOUT=1mA
RLｘH
RLｘH
RLｘL
RLｘL
ILeakH
ILIM
1.764
-
MAX IPFM
Lx SW "H" ON Resistance 1
Lx SW "H" ON Resistance 2
Lx SW "L" ON Resistance 1
Lx SW "L" ON Resistance 2
(*5)
Lx SW "H" Leak Current
(*9)
Current Limit
Output Voltage
Temperature
Characteristics
UNITS CIRCUIT
-
MAXDTY
EFFI
MAX.
(XCM517BB)
Maximum IPFM Limit
Efficiency
TYP.
(XCM517BD)
Maximum Duty Ratio
(*2)
MIN.
IOUT=30mA
-40℃≦Topr≦85℃
-
200
300
%
①
100
-
-
%
②
-
-
0
%
②
-
92
-
%
①
900
0.35
0.42
0.45
0.52
0.01
1050
0.55
0.67
0.66
0.77
1.0
1350
Ω
Ω
Ω
Ω
μA
mA
④
④
⑨
⑥
-
±100
-
ppm/ ℃
①
0.65
-
6.0
V
③
VSS
-
0.25
V
③
IENH
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “H” level
VOUT =0V, Applied voltage to VEN,
(*10)
Voltage changes Lx to “L” level
VIN=VEN=5.0V, VOUT=0V
- 0.1
0.
μA
⑤
IENL
VIN=5.0V, VEN=0V, VOUT=0V
- 0.1
-
0.1
μA
⑤
-
0.32
0.5
ms
①
1.0
-
20.0
ms
⑦
0.675
0.900
1.125
V
⑦
200
300
450
Ω
⑧
EN "H" Level Voltage
VENH
EN "L" Level Voltage
VENL
EN "H" Current
EN "L" Current
Soft Start Time
tSS
Latch Time
tLAT
Short Protection
Threshold Voltage
VSHORT
ＣＬDischarge
Rdischg
When connected to external components,
VEN=0V → VIN , IOUT=1mA
VIN= VEN=5.0V, VOUT=0.8× VOUT(E),
(*6)
Short Lx at 1Ω resistance
Sweeping VOUT , VIN=VEN= 5.0V, Short Lx at
1Ω resistance, VOUT voltage which Lx becomes “L”
level within 1ms
VIN = 5.0V LX = 5.0V VEN = 0V VOUT = open
Test conditions: Unless otherwise stated, VIN = 5.0V, VOUT (E) = Setting voltage
NOTE:
*1: Including hysteresis width of operating voltage.
*2: EFFI = { ( output voltage×output current ) / ( input voltage×input current) }×100
*3: ON resistance (Ω)= (VIN - Lx pin measurement voltage) / 100mA
*4: Design value
*5: When temperature is high, a current of approximately 10μA (maximum) may leak.
*6: Time until it short-circuits DCOUT with GND via 1Ωof resistor from an operational state and is set to Lx=0V from current limit pulse
generating.
*7: When VOUT(E)+1.2V<2.7V, VIN=2.7V
*8: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*9: Current limit denotes the level of detection at peak of coil current.
*10: "H"＝VIN∼VIN - 1.2V, "L"＝+ 0.1V ∼ - 0.1V
*11: XCM517xA / XCM517xB series exclude IPFM and MAXIPFM because those are only for the PFM control’s functions.
*12: The electrical characteristics shows 1 channel values when the other channel is stopped.
8/28
XCM517
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●PFM Switching Current (IPFM) by Oscillation Frequency and Setting Voltage
(mA)
SETTING VOLTAGE
VOUT(E) ≦1.2V
1.2V＜VOUT(E) ≦1.75V
1.8V≦VOUT(E)
MIN.
1.2MHz
TYP.
MAX.
140
130
120
180
170
160
240
220
200
MIN.
3.0MHz
TYP.
MAX.
190
180
170
260
240
220
350
300
270
●Input Voltage (VIN) for Measuring Maximum PFM Switching Current (MAXIPFM) Limit
fOSC
1.2MHz
3.0MHz
(C-1)
V OUT(E)+0.5V
V OUT(E)+1.0V
Minimum operating voltage is 2.7V.
ex.) Although when V OUT(E) = 1.2V, fOSC = 1.2MHz, (C-1) = 1.7V, the (C-1) becomes 2.7V because of the minimum operating voltage 2.7V.
●Soft-start time by each setting voltage（XCM517Bx series only）
PRODUCT SERIES
fOSC
SETTING VOLTAGE
MIN.
TYP.
MAX.
1200kHz
0.8≦V OUT(E)<1.5
-
250
400μs
1200kHz
1.5≦V OUT(E)<1.8
-
320
500μs
1200kHz
1.8≦V OUT(E)<2.5
-
250
400μs
1200kHz
2.5≦V OUT(E)≦4.0
-
320
500μs
1200kHz
0.8≦V OUT(E)<2.5
-
250
400μs
1200kHz
2.5≦V OUT(E)≦4.0
-
320
500μs
XC517BB
3000kHz
0.8≦V OUT(E)<1.8
-
250
400μs
XC517BD
3000kHz
1.8≦V OUT(E) ≦4.0
-
320
500μs
XC517BA
XC517BC
9/28
XCM517 Series
■ TYPICAL APPLICATION CIRCUIT
● fOSC=3.0MHz
L1/L2:
1.5μH (NR3015 TAIYO YUDEN)
CIN1/CIN2: 4.7μF (Ceramic)
CL1/CL2 : 10μF (Ceramic)
10/28
● fOSC=1.2MHz
L1/L2:
4.7μH (NR4018 TAIYO YUDEN)
CIN1/CIN2: 4.7μF (Ceramic)
CL1/CL2 : 10μF (Ceramic)
XCM517
Series
■OPERATIONAL DESCRIPTION
The XCM517 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase
compensation circuit, output voltage adjustment resistors, P-channel MOSFET driver transistor, N-channel MOSFET switching
transistor for the synchronous switch, current limiter circuit, UVLO circuit and others. (See the block diagram above.) The
series ICs compare, using the error amplifier, the voltage of the internal voltage reference source with the feedback voltage
from the VOUT pin through split resistors, R1 and R2. Phase compensation is performed on the resulting error amplifier output,
to input a signal to the PWM comparator to determine the turn-on time during PWM operation. The PWM comparator
compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and
delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is
continuously performed to ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver
transistor current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback
signals. This enables a stable feedback loop even when a low ESR capacitor such as a ceramic capacitor is used ensuring
stable output voltage.
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.2MHz or
3.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and to
synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal split resistors, R1 and R2. When a voltage lower than the reference voltage is fed back, the
output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are fixed
internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XCM517 series monitors the current flowing through the P-channel MOS driver transistor
connected to the Lx pin, and features a combination of the current limit mode and the operation suspension mode.
① When the driver current is greater than a specific level, the current limit function operates to turn off the pulses from the Lx
pin at any given timing.
② When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
③ At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an over
current state.
④ When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps ① through ③. If an over current state continues for a
few ms and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of the
driver transistor, and goes into operation suspension mode. Once the IC is in suspension mode, operations can be
resumed by either turning the IC off via the EN pin, or by restoring power to the VIN pin. The suspension mode does not
mean a complete shutdown, but a state in which pulse output is suspended; therefore, the internal circuitry remains in
operation. The current limit of the XCM517 series can be set at 1050mA at typical. Depending on the state of the PC
Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise, the board
should be laid out so that input capacitors are placed as close to the IC as possible.
VEN
11/28
XCM517 Series
■OPERATIONAL DESCRIPTION (Continued)
<Short-Circuit Protection>
The short-circuit protection circuit monitors the internal R1 and R2 divider voltage from the VOUT pin (refer to FB point in
the block diagram shown in the previous page). In case where output is accidentally shorted to the Ground and when
the FB point voltage decreases less than half of the reference voltage (Vref) and a current more than the ILIM flows to
the driver transistor, the short-circuit protection quickly operates to turn off and to latch the driver transistor. In latch
mode, the operation can be resumed by either turning the IC off and on via the EN pin, or by restoring power supply to
the VIN pin.
When sharp load transient happens, a voltage drop at the VOUT is propagated to the FB point through CFB, as a result,
short circuit protection may operate in the voltage higher than 1/2 VOUT voltage.
< UVLO Circuit>
When the VIN pin voltage becomes 1.4V or lower, the P-channel output driver transistor is forced OFF to prevent false
pulse output caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 1.8V or higher,
switching operation takes place. By releasing the UVLO function, the IC performs the soft start function to initiate output
startup operation. The soft start function operates even when the VIN pin voltage falls momentarily below the UVLO
operating voltage. The UVLO circuit does not cause a complete shutdown of the IC, but causes pulse output to be
suspended; therefore, the internal circuitry remains in operation.
<PFM Switch Current>
In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-ch MOSFET on. In this
case, time that the P-ch MOSFET is kept on (tON) can be given by the following formula.
tON= L×IPFM / (VIN−VOUT)
→IPFM①
<Maximum IPFM Limit>
In PFM control operation, the maximum duty ratio (MAXIPFM) is set to 200% (TYP.). Therefore, under the condition that
the duty increases (e.g. the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even
when coil current doesn’t reach to IPFM.
→IPFM②
IPFM①
IPFM②
tON
Ton
FOSC
M axum um IPFM Current
Lx
Lx
I Lx
12/28
IPFM
0mA
I Lx
IPFM
0mA
XCM517
Series
■OPERATIONAL DESCRIPTION (Continued)
＜CL High Speed Discharge＞
The XCM517Bx series can quickly discharge the electric charge at the output capacitor (CL) when a low signal to the EN
pin which enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the LX pin
and the VSS pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may
avoid application malfunction. Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R)
and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [R] and an output capacitor
value (CL) as τ(τ=C x R), discharge time of the output voltage after discharge via the N channel transistor is calculated
by the following formulas.
V = VOUT(E) x e –t/τ, or t=τln (VOUT(E) / V)
V : Output voltage after discharge
VOUT(E) : Output voltage
t: Discharge time,
τ: C x R
C= Capacitance of Output capacitor (CL)
R= CL auto-discharge resistance
Output Voltage Dischage Characteristics
Rdischg = 300Ω（ TYP）
100
90
CL=10uF
80
CL=20uF
70
CL=50uF
60
50
40
30
20
10
0
0
10
20
30
40
50
60
70
80
90
100
Discharge Time t (ms)
13/28
XCM517 Series
■OPERATIONAL DESCRIPTION (Continued)
<EN Pin Function>
The operation of the XCM517 series will enter into the shut down mode when a low level signal is input to the EN pin. During the
shutdown mode, the current consumption of the IC becomes 0μA (TYP.), with a state of high impedance at the Lx pin and VOUT
pin. The IC starts its operation by inputting a high level signal to the EN pin. The input to the EN pin is a CMOS input and the
sink current is 0μA (TYP.).
●XCM517 series - Examples of how to use EN pin
(A)
SW＿EN
STATUS
ON
Stand-by
OFF
Operation
SW＿EN
STATUS
ON
Operation
OFF
Stand-by
EN
SW_EN
EN
(B)
SW_EN
(B)
(A)
＜Soft Start＞
Soft start time is available in two options via product selection.
The XCM517Ax series provide 1.0ms (TYP). The XCM517Bx series provide 0.25ms (TYP). Soft start time is defined as the time to reach 90%
of the output setting voltage when the VEN pin is turned on.
VENH
90% of setting voltage
14/28
XCM517
Series
■FUNCTION CHART
EN
VOLTAGE LEVEL
OPERATIONAL STATES
XCM517xA/XCM517xB
H Level (*1)
Synchronous
PWM Fixed Control
L Level (*2)
Stand-by
XCM517xC/XCM517xD
Synchronous
PWM/PFM
Automatic Switching
Stand-by
Note on EN pin voltage level range
(*1) H level: 0.65V < H level < VIN
(*2) L level: 0V < L level < 0.25V
■NOTE ON USE
1. The XCM517 series is designed for use with ceramic output capacitors. If, however, the potential difference is too large
between the input voltage and the output voltage, a ceramic capacitor may fail to absorb the resulting high switching energy
and oscillation could occur on the output. If the input-output potential difference is large, connect an electrolytic capacitor in
parallel to compensate for insufficient capacitance.
2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
3. Depending on the input-output voltage differential, or load current, some pulses may be skipped, and the ripple voltage may
increase.
4. When the difference between VIN and VOUT is large in PWM control, very narrow pulses will be outputted, and there is the
possibility that some cycles may be skipped completely.
5. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that some cycles may be skipped completely.
6. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when
dropout voltage or load current is high, current limit starts operation, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate the
peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x fOSC) + IOUT
L: Coil Inductance Value
fOSC: Oscillation Frequency
7. When the peak current which exceeds limit current flows within the specified time, the built-in P-ch driver transistor turns off.
During the time until it detects limit current and before the built-in transistor can be turned off, the current for limit current flows;
therefore, care must be taken when selecting the rating for the external components such as a coil.
8. Care must be taken when laying out the PC Board, in order to prevent misoperation of the current limit mode. Depending on
the state of the PC Board, latch time may become longer and latch operation may not work. In order to avoid the effect of noise,
the board should be laid out so that input capacitors are placed as close to the IC as possible.
9. Use of the IC at voltages below the recommended voltage range may lead to instability.
15/28
XCM517 Series
■NOTE ON USE (Continued)
10. This IC should be used within the stated absolute maximum ratings in order to prevent damage to the device.
11. When the IC is used in high temperature, output voltage may increase up to input voltage level at no load because of the leak
current of the driver transistor.
12. The current limit is set to 1350mA (MAX.) at typical. However, the current of 1350mA or more may flow. In case that the
current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference for
input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast, when
N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to the
GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this operation,
and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the amount of current,
which is supposed to be limited originally. Even in this case, however, after the over current state continues for several ms,
the circuit will be latched. A coil should be used within the stated absolute maximum rating in order to prevent damage to
the device.
①Current flows into P-ch MOSFET to reach the current limit (ILIM).
②The current of ILIM or more flows since the delay time of the circuit occurs during from the detection of the current limit to
OFF of P-ch MOSFET.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several ms.
⑤The circuit is latched, stopping its operation.
# ms
13. In order to stabilize VIN voltage level and oscillation frequency, we recommend that a by-pass capacitor (CIN) be connected
as close as possible to the VIN and VSS pins.
14. High step-down ratio and very light load may lead an intermittent oscillation.
15. During PWM / PFM automatic switching mode, operating may become unstable at transition to continuous mode.
Please verify with actual parts.
External Components
16/28
XCM517
Series
■NOTE ON USE (Continued)
16. Please note the inductance value of the coil. The IC may enter unstable operation if the combination of ambient
temperature, setting voltage, oscillation frequency, and L value are not adequate.
In the operation range close to the maximum duty cycle, The IC may happen to enter unstable output voltage operation even
if using the L values listed below.
<External Components>
●The Range of L Value
fOSC
VOUT
3.0MHz
0.8V＜VOUT<4.0V
1.0μH～2.2μH
VOUT≦2.5V
3.3μH～6.8μH
2.5V＜VOUT
4.7μH～6.8μH
1.2MHz
L Value
*When a coil less value of 4.7 μ H is used at
fOSC=1.2MHz or when a coil less value of 1.5μH is
used at fOSC=3.0MHz, peak coil current more easily
reach the current limit ILMI. In this case, it may
happen that the IC can not provide 600mA output
current.
17. It may happen to enter unstable operation when the IC operation mode goes into continuous operation mode under the
condition of small input-output voltage difference. Care must be taken with the actual design unit.
<External Components>
●Instructions of pattern layouts
1. In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as possible to
the VIN & VSS pins.
2. Please mount each external component as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high ground
currents at the time of switching may result in instability of the IC.
5. This series’ internal driver transistors bring on heat because of the output current and ON resistance of driver transistors.
17/28
XCM517 Series
■TEST CIRCUITS
18/28
XCM517
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
VOUT=1.8V,1.2MHz
VOUT=1.8V,3.0MHz
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
PWM/PFM Automatic Sw itching Control
100
100
90
90
80
80
VIN= 4.2V
70
60
Efficency:EFFI(%)
Efficency:EFFI(%)
PWM/PFM Automatic Sw itching Control
PWM Control
VIN= 4.2V
3.6V
3.6V
50
40
30
70
VIN= 4.2V
60
3.6V
50
PWM Control
VIN= 4.2V
3.6V
40
30
20
20
10
10
0
0
0.1
1
10
100
0.1
1000
1
Output Current:IOUT(mA)
(2) Output Voltage vs. Output Current
VOUT=1.8V,1.2MHz
2.1
2.1
2.0
2.0
Output Voltage:Vout(V)
Output Voltage:Vout(V)
1000
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
PWM/PFM Automatic Sw itching Control
VIN＝4.2V,3.6V
1.8
1.7
PWM Control
1.6
PWM/PFM Automatic Sw itching Control
VIN＝4.2V,3.6V
1.9
1.8
1.7
PWM Control
1.6
1.5
1.5
0.1
1
10
100
1000
0.1
1
Output Current:IOUT(mA)
80
80
Ripple Voltage:Vr(mV)
100
PWM/PFM Automatic
Sw itching Control
VIN＝4.2V
3.6V
PWM Control
VIN＝4.2V,3.6V
1000
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
100
40
100
VOUT=1.8V,3.0MHz
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
60
10
Output Current:IOUT(mA)
(3) Ripple Voltage vs. Output Current
VOUT=1.8V,1.2MHz
Ripple Voltage:Vr(mV)
100
VOUT=1.8V,3.0MHz
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
1.9
10
Output Current:IOUT(mA)
20
60
PWM/PFM Automatic
Sw itching Control
VIN＝4.2V
3.6V
PWM Control
VIN＝4.2V,3.6V
40
20
0
0
0.1
1
10
100
Output Current:IOUT(mA)
1000
0.1
1
10
100
1000
Output Current:IOUT(mA)
19/28
XCM517 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Oscillation Frequency vs. Ambient Temperature
VOUT=1.8V,1.2MHz
VOUT=1.8V,3.0MHz
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
3.5
Oscillation Frequency : FOSC(MHz)
Oscillation Frequency : FOSC(MHz)
1.5
1.4
1.3
VIN=3.6V
1.2
1.1
1.0
0.9
0.8
3.4
3.3
3.2
VIN=3.6V
3.1
3.0
2.9
2.8
2.7
2.6
2.5
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta (℃)
35
35
Supply Current : IDD (μA)
Supply Current : IDD (μA)
40
VIN=6.0V
VIN=4.0V
20
15
10
5
0
-50
VIN=6.0V
25
20
15
10
5
-25
0
25
50
75
0
-50
100
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
(7) UVLO Voltage vs. Ambient Temperature
VOUT=1.8V,3.0MHz
2.1
1.8
2.0
1.5
UVLO Voltage : UVLO (V)
Output Voltage : VOUT (V)
100
30
(6) Output Voltage vs. Ambient Temperature
VOUT=1.8V,3.0MHz
VIN=3.6V
1.8
1.7
1.6
1.5
EN=VIN
EN=VIN
CE=VIN
1.2
0.9
0.6
0.3
0.0
-50
-25
0
25
50
Ambient Temperature: Ta (℃)
20/28
75
VIN=4.0V
Ambient Temperature: Ta ( ℃)
1.9
50
VOUT=1.8V,3.0MHz
40
25
25
Ambient Temperature: Ta (℃)
(5) Supply Current vs. Ambient Temperature
VOUT=1.8V,1.2MHz
30
0
75
100
-50
-25
0
25
50
Ambient Temperature: Ta (℃)
75
100
XCM517
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) CE "L" Voltage vs. Ambient Temperature
VOUT=1.8V,3.0MHz
1.0
1.0
0.9
0.9
0.8
0.7
CE "L" Voltage : VCEL (V)
CE "H" Voltage : VCEH (V)
(8) CE "H" Voltage vs. Ambient Temperature
VOUT=1.8V,3.0MHz
VIN=5.0V
0.6
0.5
0.4
0.3
VIN=3.6V
0.2
0.1
0.8
VIN=5.0V
0.7
0.6
0.5
0.4
VIN=3.6V
0.3
0.2
0.1
0.0
0.0
-50
-25
0
25
50
75
100
-50
-25
Ambient Temperature: Ta ( ℃)
(10) Soft Start Time vs. Ambient Temperature
VOUT=1.8V,3.0MHz
4
4
Soft Start Time : TSS (ms)
Soft Start Time : TSS (ms)
5
3
VIN=3.6V
1
-25
0
25
50
50
75
100
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
5
0
-50
25
VOUT=1.8V,3.0MHz
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
2
0
Ambient Temperature: Ta (℃)
75
100
Ambient Temperature: Ta (℃)
3
2
VIN=3.6V
1
0
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Lx SW ON Resistance:RLxH,RLxL (Ω)
(11) "Pch / Nch" Driver on Resistance vs. Input Voltage
VOUT=1.8V,3.0MHz
1.0
0.9
0.8
Nch on Resistance
0.7
0.6
0.5
0.4
0.3
Pch on Resistance
0.2
0.1
0.0
0
1
2
3
4
5
6
Input Voltage : VIN (V)
21/28
XCM517 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) XCM517BxSeries Rise Wave Form
VOUT=1.2V,1.2MHz
VOUT=3.3V,3.0MHz
L=4.7μH (NR4018), CIN=4.7μF, CL=10μF
L=1.5μH (NR3015), CIN=4.7μF, CL=10μF
VIN=5.0V
VIN=5.0V
IOUT=1.0mA
IOUT=1.0mA
VOUT：1.0V/div
VOUT：0.5V/div
EN：0.0V⇒1.0V
EN：0.0V⇒1.0V
100μs/div
100μs/div
(13) XCM517BxSeries Soft-Start Time vs. Ambient Temperature
VOUT=1.2V,1.2MHz
VOUT=3.3V,3.0MHz
L=1.5μH(NR3015), CIN=4.7μF, CL=10μF
500
500
400
400
Soft Start Time :TSS (μs)
Soft Start Time :TSS (μs)
L=4.7μH(NR4018), CIN=4.7μF, CL=10μF
300
200
VIN=5.0V
IOUT=1.0mA
100
300
200
VIN=5.0V
IOUT=1.0mA
100
0
0
-50
-25
0
25
50
75
100
-50
-25
(14) XCM517BxSeries CL Discharge Resistance vs. Ambient Temperature
VOUT=3.3V,3.0MHz
CL Discharge Resistance: (Ω)
600
VIN=6.0V
VIN=4.0V
400
300
200
100
-50
-25
0
25
50
Ambient Temperature: Ta (℃)
22/28
25
50
Ambient Temperature: Ta(℃)
Ambient Temperature: Ta(℃)
500
0
75
100
75
100
XCM517
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response
VOUT=1.2V, 1.2MHz (PWM/PFM Automatic Switching Control)
L=4.7μH(NR4018), CIN=4.7μF(ceramic), CL=10μF(ceramic), Topr=25℃
VIN=3.6V, EN=VIN
IOUT=1mA → 100mA
IOUT =1mA → 300mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
50μs/div
IOUT=100mA → 1mA
50μs/div
IOUT=300mA → 1mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT: 50mV/div
VOUT: 50mV/div
200μs/div
200μs/div
23/28
XCM517 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
VOUT=1.2V, 1.2MHz (PWM Control)
L=4.7μH(NR4018), CIN=4.7μF(ceramic), CL=10μF(ceramic), Topr=25℃
VIN=3.6V, EN=VIN
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT : 50mV/div
VOUT: 50mV/div
50μs/div
50μs/div
IOUT=100mA → 1mA
IOUT=300mA → 1mA
1ch: IOUT
1ch: IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
200μs/div
24/28
200μs/div
XCM517
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
VOUT=1.8V, 3.0MHz (PWM/PFM Automatic Switching Control)
L=1.5μH(NR3015), CIN=4.7μF(ceramic), CL=10μF(ceramic),Topr=25℃
VIN=3.6V, EN=VIN
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
50μs/div
IOUT=100mA → 1mA
50μs/div
IOUT=300mA → 1mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
200μs/div
200μs/div
25/28
XCM517 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) Load Transient Response (Continued)
VOUT=1.8V, 3.0MHz (PWM Control)
L=1.5μH(NR3015), CIN=4.7μF(ceramic), CL=10μF(ceramic), Topr=25℃
VIN=3.6V, EN=VIN
IOUT=1mA → 100mA
IOUT=1mA → 300mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
50μs/div
IOUT=100mA → 1mA
50μs/div
IOUT=300mA → 1mA
1ch : IOUT
1ch : IOUT
2ch
2ch
VOUT : 50mV/div
VOUT : 50mV/div
200μs/div
26/28
200μs/div
XCM517
Series
■PACKAGING INFORMATION
2 .8±0 .08
●USP-12B01
2 .3±0 .08
1234
MAX 0 . 6
567 8
(0 .4 ) (0 .4 ) (0 .4 ) (0 .4 ) (0 .4 )
(0 .25 )
(0 .15 )
0 .25±0 .05
0 .2±0 .05
0 .2±0 .05
0 .2±0 .05
0 .2±0 .05
0 .2±0 .05
2
3
4
5
6
0 .25±0 .1
0 .4±0 .1
1 .3±0 .1
0 .25±0 .1
1
* Au plate thickness: Minimum 0.3 μm
■外部 リー ド処理 ：Au m in0 .3um
*The side of pins is not plated, nickel is exposed.
12 11 10 9
1 .2±0 .1
0 .7±0 .05
8
7
1 .2±0 .1
※
端子
はニッケ
めっきされておりま
*Pin
#1側
is面
wider
than ルで、Au
other pins.
せん。
※端子1は他端子に比べ太 くなっています。
0 .7±0 .05
●USP-12B01 Reference Pattern Layout
20/1
●USP-12B01 Reference Metal Mask Design
0 .20
0 .35
0 .60
1 .10
1 .55
0 .60
1 .10
1 .55
0 .10 0 .10
1 .30
1 .60
0 .50
1 .30
1 .30
0 .95
0 .95
0 .55
0 .55
0 .25 0 .25
1 .05
0 .95
0 .65
0 .55
0 .25 0 .15
0 .05 0 .15 0 .05 0 .05 0 .20 0 .05
0 .35
1 .30
1 .60
1 .05
0 .95
0 .65
0 .55
0 .25 0 .15
0 .25
0 .30
0 .025
0 .025 0 .025
0 .025
1 .35
1 .35
0 .45
0 .90
0 .90
0 .45
0 .65
0 .65
0 .25 0 .25
0 .20
単位
UNIT:：mm
mm
0 .15
0 .40
0 .15
27/28
XCM517 Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics.
Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
28/28