ON MC14042BFR2 Quad transparent latch Datasheet

MC14042B
Quad Transparent Latch
The MC14042B Quad Transparent Latch is constructed with MOS
P–channel and N–channel enhancement mode devices in a single
monolithic structure. Each latch has a separate data input, but all four
latches share a common clock. The clock polarity (high or low) used to
strobe data through the latches can be reversed using the polarity
input. Information present at the data input is transferred to outputs Q
and Q during the clock level which is determined by the polarity input.
When the polarity input is in the logic “0” state, data is transferred
during the low clock level, and when the polarity input is in the logic
“1” state the transfer occurs during the high clock level.
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MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
Buffered Data Inputs
Common Clock
Clock Polarity Control
Q and Q Outputs
Double Diode Input Protection
Supply Voltage Range = 3.0 Vdc to 1 8 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
MC14042BCP
AWLYYWW
1
16
SOIC–16
D SUFFIX
CASE 751B
14042B
AWLYWW
1
16
SOEIAJ–16
F SUFFIX
CASE 966
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol
Value
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
VDD
Vin, Vout
Iin, Iout
Parameter
DC Supply Voltage Range
Input or Output Voltage Range
(DC or Transient)
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
v
MC14042B
AWLYWW
1
Device
Package
Shipping
MC14042BCP
PDIP–16
2000/Box
MC14042BD
SOIC–16
2400/Box
MC14042BDR2
SOIC–16
2500/Tape & Reel
MC14042BF
SOEIAJ–16
See Note 1.
MC14042BFEL
SOEIAJ–16
See Note 1.
MC14042BFR1
SOEIAJ–16
See Note 1.
MC14042BFR2
SOEIAJ–16
See Note 1.
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
Publication Order Number:
MC14042B/D
MC14042B
PIN ASSIGNMENT
Q3
1
16
VDD
Q0
2
15
Q3
Q0
3
14
D3
D0
4
13
D2
CLOCK
5
12
Q2
POLARITY
6
11
Q2
D1
7
10
Q1
VSS
8
9
Q1
TRUTH TABLE
Clock
Polarity
Q
0
1
1
0
0
0
1
1
Data
Latch
Data
Latch
LOGIC DIAGRAM
5
D0
LATCH
1
4
CLOCK
POLARITY
Q0
2
Q0
3
6
D1
LATCH
2
7
Q1
10
Q1
9
D2
LATCH
3
13
VDD = PIN 16
VSS = PIN 8
Q2
11
Q2
12
D3
LATCH
4
14
Q3
1
Q3
15
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2
MC14042B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
IT
5.0
10
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
Vdc
IOH
Source
Sink
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
mAdc
IT = (1.0 µA/kHz) f + IDD
IT = (2.0 µA/kHz) f + IDD
IT = (3.0 µA/kHz) f + IDD
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
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3
µAdc
MC14042B
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SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time, D to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Propagation Delay Time, Clock to Q, Q
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 57 ns
tPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,
tPHL
Clock Pulse Width
tWH
Clock Pulse Rise and Fall Time
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
220
90
60
440
180
120
5.0
10
15
—
—
—
220
90
60
440
180
120
5.0
10
15
300
100
80
150
50
40
—
—
—
5.0
10
15
—
—
—
—
—
—
15
5.0
4.0
5.0
10
15
100
50
40
50
25
20
—
—
—
5.0
10
15
50
30
25
0
0
0
—
—
—
no
ns
ns
µs
th
Setup Time
ns
tsu
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
VDD
1
f
16
20 ns
5
6
PULSE
GENERATOR 1
4
7
13
CLOCK
POLARITY
D0
D1
D2
14
D3
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
20 ns
90%
50%
2
3
10
9
11
12
1
15
DATA INPUT
tPLH
90%
Q OUTPUT
8
50%
10%
tTLH
Q OUTPUT
VSS
Figure 1. AC and Power Dissipation Test Circuit and Timing Diagram
(Data to Output)
4
tTHL
tPHL
90%
tTHL
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10%
tPHL
10%
For Power Dissipation test, each output
is loaded with capacitance CL.
Unit
ns
tTLH,
tTHL
Hold Time
VDD
50%
tTLH
MC14042B
VDD
16
PULSE
GENERATOR 1
5
PULSE
GENERATOR 2
4
CLOCK
6
POLARITY
D0
7
D1
13
D2
14
D3
NOTE: CL connected to output under test.
20* ns
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
2
3
10
9
11
12
1
15
VSS
8
20 ns
90%
50%
CLOCK INPUT
P.G. 1
10%
tWH
20 ns
90%
50%
DATA INPUT
P.G. 2
tsu
th
tPLH
Q OUTPUT
90%
50%
10%
*Input clock rise time is 20 ns except for maximum rise time test.
Figure 2. AC Test Circuit and Timing Diagram
(Clock to Output)
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5
MC14042B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14042B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
http://onsemi.com
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
MC14042B
ON Semiconductor and
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MC14042B/D
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