TI LM3490IM5-12 Lm3490 100 ma, sot-23, quasi low-dropout linear voltage regulator with logic- Datasheet

LM3490
www.ti.com
SNVS012E – JUNE 1999 – REVISED APRIL 2013
LM3490 100 mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator with LogicControlled ON/OFF
Check for Samples: LM3490
FEATURES
DESCRIPTION
•
•
•
The LM3490 is an integrated linear voltage regulator.
It features operation from an input as high as 30V
and a specified maximum dropout of 1.2V at the full
100 mA load. Standard packaging for the LM3490 is
the 5-lead SOT-23 package. A logic-controlled
ON/OFF feature makes the LM3490 ideal for
powering subsystems ON and OFF as needed.
1
2
3.3, 5, 12, and 15V Versions Available
Logic-Controlled ON/OFF
Packaged in the Tiny 5-Lead SOT-23 Package
APPLICATIONS
•
•
•
•
Tiny Alternative to LM78LXX Series and
Similar Devices
Tiny 5V±5% to 3.3V, 100 mA Converter
Post Regulator for Switching DC/DC Converter
Bias Supply for Analog Circuits
KEY SPECIFICATIONS
•
•
•
•
•
30V Maximum Input for Operation
1.2V Specified Maximum Dropout over Full
Load and Temperature Ranges
100 mA Specified Load Current
±5% Specified Output Voltage Tolerance over
Full Load and Temperature Ranges
−40 to +125°C Junction Temperature Range for
Operation
Typical Application Circuit
The 5, 12, and 15V members of the LM3490 series
are intended as tiny alternatives to industry standard
LM78LXX series and similar devices. The 1.2V quasi
low dropout of LM3490 series devices makes them a
nice fit in many applications where the 2 to 2.5V
dropout of LM78LXX series devices precludes their
(LM78LXX series devices) use.
The LM3490 series features a 3.3V member. The
SOT packaging and quasi low dropout features of the
LM3490 series converge in this device to provide a
very nice, very tiny 3.3V, 100 mA bias supply that
regulates directly off the system 5V±5% power
supply.
Connection Diagram
Figure 1. Top View
SOT-23 Package
5-Lead, Molded-Plastic Small-Outline Transistor
(SOT) Package
Package Code DBV0005A
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1) (2)
Input Voltage (IN to GND)
35V
Voltage ON/OFF to GND
5.5V
Power Dissipation (3)
Junction Temp. (TJ)
400 mW
(3)
+150°C
−65 to +150°C
Ambient Storage Temp.
Wave
Soldering Time, Temp.
(4)
ESD (5)
(1)
(2)
(3)
(4)
(5)
4sec., 260°C
Infrared
10sec., 240°C
Vapor Phase
75sec., 219°C
ON/OFF
1.0kV
All Other Pins
2.0kV
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ - TA)/θJA where TJ
is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. The 400 mW rating
results from substituting the Absolute Maximum junction temperature, 150°C, for TJ , 50°C for TA, and 250°C/W for θJA. More power can
be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures. The Absolute
Maximum power dissipation can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above
50°C ambient. A θJA of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat
sinking enables the safe dissipation of more power. The LM3490 actively limits its junction temperature to about 150°C.
Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline
packages, see http://www.ti.com.
For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
OPERATING RATINGS (1)
Maximum Input Voltage (IN to GND)
30V
Voltage ON/OFF to GND
0 to 5V
−40 to +125°C
Junction Temperature (TJ)
Maximum Power Dissipation (2)
(1)
(2)
2
300 mW
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature.
The 300 mW rating appearing under Operating Ratings results from substituting the maximum junction temperature for operation,
125°C, for TJ, 50°C for TA, and 250°C/W for θJA in P = (TJ − TA)/θJA. More power can be dissipated at lower ambient temperatures. Less
power can be dissipated at higher ambient temperatures. The maximum power dissipation for operation appearing under Operating
Ratings can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above 50°C ambient. A
θJA of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat sinking enables the
dissipation of more power during operation.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
LM3490
www.ti.com
SNVS012E – JUNE 1999 – REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS LM3490-3.3, LM3490-5.0
VIN = VNOM + 1.5V unless otherwise noted. Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits
appearing in boldface type apply over the entire junction temperature range for operation, −40 to +125°C (1) (2) (3)
Nominal Output Voltage (VNOM)
Symbol
VOUT
Parameter
Output Voltage
3.3V
Conditions
1 mA ≤ IOUT ≤ 100 mA
Typical
5.0V
Limit
3.30
Typical
5.00
3.17
3.14
3.43
3.46
ΔVOUT
ΔVOUT
Line Regulation
Load Regulation
VNOM + 1.5V ≤ VIN ≤ 30V,
IOUT = 1 mA
7
10 mA ≤ IOUT ≤ 100 mA
15
Ground Pin Current
25
mV
mV(max)
40
mV
mV(max)
4
mA(max)
5
µA(max)
0.9
1.0
V
V(max)
V(max)
1.1
1.2
V
V(max)
V(max)
15
2
2
4
VON/OFF = 0V
0.1
IOUT = 10 mA
0.7
0.9
0.9
1.1
1.2
VIN = 10V,
Bandwidth: 10 Hz to 100 kHz
µA
0.7
0.9
1.0
IOUT = 100 mA
mA
0.1
5
Dropout Voltage
V
V(min)
V(min)
V(max)
V(max)
VNOM + 1.5V ≤ VIN ≤ 30V,
No Load
VON/OFF = 5V
VIN VOUT
Units
4.80
4.75
5.20
5.25
9
25
40
IGND
Limit
en
Output Noise Voltage
VIL
Maximum Low Level
Input Voltage at
ON/OFF
0.2
0.2
V(max)
VIH
Minimum High Level
Input Voltage at
ON/OFF
2.0
2.0
V(min)
−1
−1
µA(max)
20
µA(max)
IIL
VON/OFF = 0V
IIH
VON/OFF = 5V
100
150
1
1
20
(1)
(2)
(3)
µVrms
µA
A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
All limits are specified. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
All voltages except dropout are with respect to the voltage at the GND pin.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
3
LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS LM3490-12, LM3490-15
VIN = VNOM + 1.5V unless otherwise noted. Typicals and limits appearing in normal type apply for TA = TJ = 25°C. Limits
appearing in boldface type apply over the entire junction temperature range for operation, −40 to +125°C (1) (2) (3)
Nominal Output Voltage (VNOM)
Symbol
VOUT
12V
Parameter
Output Voltage
Conditions
1 mA ≤ IOUT ≤ 100 mA
Typical
15V
Limit
12.00
Typical
15.00
11.52
11.40
12.48
12.60
ΔVOUT
ΔVOUT
Line Regulation
Load Regulation
VNOM + 1.5V ≤ VIN ≤ 30V,
IOUT = 1 mA
14
10 mA ≤ IOUT ≤ 100 mA
36
Ground Pin Current
40
mV
mV(max)
75
mV
mV(max)
4
mA(max)
5
µA(max)
0.9
1.0
V
V(max)
V(max)
1.1
1.2
V
V(max)
V(max)
45
2
2
4
VON/OFF = 0V
0.1
IOUT = 10 mA
0.7
0.9
0.9
1.1
1.2
VIN = 10V,
Bandwidth: 10 Hz to 100 kHz
µA
0.7
0.9
1.0
IOUT = 100 mA
mA
0.1
5
Dropout Voltage
V
V(min)
V(min)
V(max)
V(max)
VNOM + 1.5V ≤ VIN ≤ 30V,
No Load
VON/OFF = 5V
VIN VOUT
Units
14.40
14.25
15.60
15.75
16
40
60
IGND
Limit
en
Output Noise
Voltage
VIL
Maximum Low Level
Input Voltage at
ON/OFF
0.2
0.2
V(max)
VIH
Minimum High Level
Input Voltage at
ON/OFF
2.0
2.0
V(min)
−1
−1
µA(max)
20
µA(max)
IIL
VON/OFF = 0V
IIH
VON/OFF = 5V
360
450
1
1
20
(1)
(2)
(3)
4
µVrms
µA
A typical is the center of characterization data taken with TA = TJ = 25°C. Typicals are not ensured.
All limits are specified. All electrical characteristics having room-temperature limits are tested during production with TA = TJ = 25°C. All
hot and cold limits are specified by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
All voltages except dropout are with respect to the voltage at the GND pin.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
LM3490
www.ti.com
SNVS012E – JUNE 1999 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
Dropout Voltage
vs Load Current
Dropout Voltage
vs Junction Temperature
Figure 2.
Figure 3.
Ground Pin Current
vs Input Voltage
Ground Pin Current
vs Input Voltage
Figure 4.
Figure 5.
Ground Pin Current
vs Load Current
Ground Pin Current
vs Junction Temperature
Figure 6.
Figure 7.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
5
LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
6
Input Current
vs Input Voltage
Input Current
vs Input Voltage
Figure 8.
Figure 9.
Line Transient Response
Line Transient Response
Figure 10.
Figure 11.
Load Transient Response
Load Transient Response
Figure 12.
Figure 13.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
LM3490
www.ti.com
SNVS012E – JUNE 1999 – REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
Load Transient Response
Load Transient Response
Figure 14.
Figure 15.
Output Voltage
vs Input Voltage
Output Voltage
vs Input Voltage
Figure 16.
Figure 17.
Output Voltage
vs Input Voltage
Output Voltage
vs Input Voltage
Figure 18.
Figure 19.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
7
LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless indicated otherwise, VIN = VNOM + 1.5V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .=25°C.
Output ShortCircuit Current
Output ShortCircuit Current
Figure 20.
Figure 21.
Power Supply
Rejection Ratio
Power Supply
Rejection Ratio
Figure 22.
Figure 23.
DC Load
Regulation
Figure 24.
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
LM3490
www.ti.com
SNVS012E – JUNE 1999 – REVISED APRIL 2013
APPLICATIONS INFORMATION
ON/OFF Pin
The LM3490 features a logic controlled ON/OFF pin that will allow the output voltage to be disabled, or enabled,
as needed. The defined operating voltage range for this pin is 0.0V to 5.0V. The ON/OFF pin can not be left
floating, as the output status cannot be ensured. Additionally, the ON/OFF pin should not be biased below
ground potential as unpredictable device behavior may occur.
Pulling the ON/OFF pin voltage to a value between the VIH threshold and 5.0V will enable the output voltage.
Pulling the ON/OFF pin voltage to a value between the VIL threshold and Ground potential will disable the output
voltage. Although the ON/OFF threshold is typically 725mV, and has no hysteresis, the ON/OFF signal must rise
and fall, cleanly and promptly, from voltage levels that are below the VIL threshold and above the VIH threshold.
The ON/OFF pin has no internal pull-up or pull-down to establish a default condition and, as a result, this pin
must be terminated, either actively or passively, to an appropriate voltage level.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
9
LM3490
SNVS012E – JUNE 1999 – REVISED APRIL 2013
www.ti.com
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
10
Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM3490
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM3490IM5-12
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
L80B
LM3490IM5-12/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L80B
LM3490IM5-3.3
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
L78B
LM3490IM5-3.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L78B
LM3490IM5-5.0
NRND
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
L79B
LM3490IM5-5.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L79B
LM3490IM5X-12/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L80B
LM3490IM5X-5.0
NRND
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
L79B
LM3490IM5X-5.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L79B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LM3490IM5-12
SOT-23
DBV
5
1000
178.0
8.4
LM3490IM5-12/NOPB
SOT-23
DBV
5
1000
178.0
LM3490IM5-3.3
SOT-23
DBV
5
1000
178.0
LM3490IM5-3.3/NOPB
SOT-23
DBV
5
1000
LM3490IM5-5.0
SOT-23
DBV
5
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM3490IM5-5.0/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM3490IM5X-12/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM3490IM5X-5.0
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM3490IM5X-5.0/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Sep-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM3490IM5-12
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5-12/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5-3.3
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5-3.3/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5-5.0
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5-5.0/NOPB
SOT-23
DBV
5
1000
210.0
185.0
35.0
LM3490IM5X-12/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
LM3490IM5X-5.0
SOT-23
DBV
5
3000
210.0
185.0
35.0
LM3490IM5X-5.0/NOPB
SOT-23
DBV
5
3000
210.0
185.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
Similar pages