◆CMOS Low Power Consumption ◆Input Frequency : 14kHz ~ 35MHz ◆Divider Ratio : 1~ 2047 Divisions (Laser Trimming) ◆Multiplier Ratio : 20 ~ 2047 Multiplications (Laser Trimming) ◆Comparative Frequency : 14kHz ~ 500kHz ◆Output Frequency : 9MHz ~ 80MHz ■APPLICATIONS ■GENERAL DESCRIPTION ■FEATURES The XC25BS3 series are high frequency, low power consumption PLL clock generator ICs with built-in crystal ●Crystal oscillation modules ●Microcontroller ●PDAs ●Portable audio systems ●Various system clocks Output Frequency : 9MHz ~ 80MHz (Q0=fCLKin×N/M) Reference Oscillation : 14kHz ~ 35MHz oscillator circuit, divider circuit & multiplier PLL circuit. (fCLKin) Laser trimming gives the option of being able to select from Divider Ratio (M) : Selectable from divisions of 1 ~ 2047 divider ratios (M) of 1 to 2047 and multiplier ratio (N) of 20 to Multiplier Ratio (N) : Selectable from multiplications 2047. Output frequency (Q0) is equal to reference oscillation (fCLKin) multiplied by N/M, within a range of 9MHz to 80MHz. of 20 ~ 2047 Output : 3-State Q1 output is selectable from input reference frequency (f0), Q1 output selectable from Ground and reference oscillation, GND, PLL Reference oscillation can output frequency/2, comparative (GND), PLL output comparative frequency/2 (f0/M/2). frequency/2 (Q0/2), input 14kHz to 35MHz of reference clock. Further, comparative frequency/2. frequency, within a range of 14kHz to 500kHz, can be obtained Operating Voltage Range: 2.97V ~ 5.5V by dividing the reference oscillation. By halting oscillation via Low Power Consumption: CMOS (stand-by function included)*1 the CE pin, consumption current can be controlled. Output will Ultra Small Package be one of high impedance. : SOT-26, USP-6B *1 High output impedance during stand-by ■PIN ASSIGNMENT ■PIN CONFIGURATION Q1 VDD CLKin Q0 PIN NUMBER SOT-26 USP-6B PIN NAME FUNCTION VSS 1 3 CE Chip Enable CE 2 2 VSS GND 3 1 Q0 PLL Output SOT-26 (TOP VIEW) *The dissipation pad for the USP-6B package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VDD pin. 4 6 Q1 Reference Oscillation, GND, Comparative Frequency/2, or PLL Output/2 Output * 5 5 VDD Power Supply 6 4 CLKin Reference Clock Input * Q1 Output is selectable from the above mentioned functions. XC25BS3 ETR1501_003 1/10 XC25BS3 Series ■FUNCTION LIST ●CE,Q0/Q1 True Logic CE FUNCTION “H” Q0/Q1 Clock Output “L” Stand-by Output Pin = High Impedance Open Stand-by Output Pin = High Impedance (VSS pin pull-down due to IC's internal resistance) "H" = High level "L" = Low level ■PRODUCT CLASSIFICATION ●Ordering Information XC25BS3①②③④⑤ DESIGNATOR DESCRIPTION ①②③ Product Number ④ Package ⑤ Device Orientation SYMBOL Integer DESCRIPTION : Based on internal standards e.g. Product number 001 → M : SOT-26 D : USP-6B Ｒ : Embossed tape, standard feed Ｌ : Embossed tape, reverse feed ■PACKAGING INFORMATION ●SOT-26 2/10 ●USP-6B ①②③ = 001 XC25BS3 Series ■MARKING RULE ●SOT-26 ①②Represents product series MARK PRODUCT SERIES ② 3 ① B XC25BS30xxMx ③Represents ② and ③ of product number as in ordering information SOT-26 (TOP VIEW) SYMBOL ② ③ 1 2 3 4 5 6 7 8 9 A B C D E F H 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 2 3 4 5 6 7 8 9 0 1 2 3 4 5 6 PRODUCT SERIES XC25BS3x01Mx XC25BS3x02Mx XC25BS3x03Mx XC25BS3x04Mx XC25BS3x05Mx XC25BS3x06Mx XC25BS3x07Mx XC25BS3x08Mx XC25BS3x09Mx XC25BS3x10Mx XC25BS3x11Mx XC25BS3x12Mx XC25BS3x13Mx XC25BS3x14Mx XC25BS3x15Mx XC25BS3x16Mx SYMBOL ② ③ K L M N P R S T U V X Y Z 0 1 1 1 1 2 2 2 2 2 2 2 2 2 2 3 3 7 8 9 0 1 2 3 4 5 6 7 8 9 0* 1* PRODUCT SERIES XC25BS3x17Mx XC25BS3x18Mx XC25BS3x19Mx XC25BS3x20Mx XC25BS3x21Mx XC25BS3x22Mx XC25BS3x23Mx XC25BS3x24Mx XC25BS3x25Mx XC25BS3x26Mx XC25BS3x27Mx XC25BS3x28Mx XC25BS3x29Mx XC25BS3x30Mx XC25BS3x31Mx … … … … ④Represents assembly lot number 0 to 9, A to Z, reverse character 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.) * Character inversion is used. ●USP-6B ① ② ③ 2 ④ ⑤ ⑥ 1 ①②③Represents product series 3 USP-6B (TOP VIEW) 6 5 ① B S MARK ② S 3 ③ 3 S PRODUCT SERIES XC25BS30xxDx XC25BS3SxxDx 4 ④,⑤Represents ② and ③ of product number as in ordering information (ex) MARK ④ 0 0 ⑤ 7 1 PRODUCT SERIES XC25BS3007Dx XC25BS3S01Dx ⑥Represents production lot number 0 to 9, A to Z repeated (G, I, J, O, Q, W excepted) Note: No character inversion used. 3/10 XC25BS3 Series ■BLOCK DIAGRAM ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITIONS UNITS Supply Voltage VDD VSS-0.3～VSS+7.0 V CLKin Pin Voltage VCK VSS-0.3～VDD+0.3 V CE Pin Voltage VCE VSS-0.3～VDD+0.3 V Q0 Pin Voltage VQ0 VSS-0.3～VDD+0.3 V Q1 Pin Voltage VQ1 VSS-0.3～VDD+0.3 V Q0 Output Current IQ0 ±50 mA Q1 Output Current IQ1 ±50 mA Power Dissipation 4/10 Ta = 25℃ SOT-26 USP-6B Pd 150 100 mW Storage Temperature Range Topr -30～+80 ℃ Operating Temperature Range Tstg -40～+125 ℃ XC25BS3 Series ■ELECTRICAL CHARACTERISTICS XC25BS30xxMR ●Set Value (example 1) PARAMETER Input Frequency Q0 Pin Output Multiplier Ratio Output Frequency 1 Output Frequency 2 SYMBOL fCLKin N/M fQ0 Q1 ● DC Characteristics XC25BS30xxMR PARAMETER Supply Voltage Input Voltage "High" Input Voltage "Low" Input Current "High" Input Current "Low" Output Voltage "High" Output Voltage "Low" Supply Current 1 Supply Current 2 CE "High" Voltage CE "Low" Voltage CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 MIN. 13.000 － 52.000 TYP. － 4.000 － fCLKin MAX. 20.000 － 80.000 UNITS MHz Multiplier MHz － fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, No Load SYMBOL VDD VIH VIL IIH IIL VOH VOL IDD1 IDD2 VCEH VCEL Rp1 Rp2 CONDITIONS VCK=3.3V VCK=0V VDD=2.97V, IOH=-8mA VDD=2.97V, IOL=8mA CE=3.3V CE=0V CE=3.3V CE=0.3V MIN. 2.97 2.7 － － -3.0 2.5 － － － 2.70 － 0.5 20.0 TYP. 3.30 － － － － － － 5.5 － － － 1.5 50.0 MAX. 3.63 － 0.6 3.0 － － 0.4 11.0 5.0 － 0.45 2.5 80.0 UNITS V V V μA μA V V mA μA V V MΩ kΩ ● AC Characteristics XC25BS30xxMR PARAMETER Output Rise Time Output Fall Time Duty Ratio Output Start Time PLL Output Jitter fCLKin=20MHz, Q0 pin output multiplier ratio=4, Ta=25℃, CL=15pF SYMBOL TTLH TTHL DUTY Ton Tj CONDITIONS VDD=3.3V (20% to 80%) (*2) VDD=3.3V (20% to 80%) (*2) (*2) 1σ(*2) MIN. － － 40 － － TYP. 5.0 5.0 50 － 60 MAX. － － 60 20 － *2 UNITS ns ns % ms ps R&D guarantee 5/10 XC25BS3 Series ■ELECTRICAL CHARACTERISTICS (Continued) XC25BS30xxMR (Continued) ●Set Value (example 2) PARAMETER Input Frequency Q0 Pin Output Multiplier Ratio Output Frequency 1 Output Frequency 2 SYMBOL fCLKin N/M fQ0 Q1 ●DC Characteristics XC25BS30xxMR PARAMETER Supply Voltage Input Voltage "High" Input Voltage "Low" Input Current "High" Input Current "Low" Output Voltage "High" Output Voltage "Low" Supply Current 1 Supply Current 2 CE "High" Voltage CE "Low" Voltage CE Pull-Down Resistance 1 CE Pull-Down Resistance 2 TYP. － 3.000 － GND MAX. 16.000 － 48.000 CONDITIONS VCK=3.3V VCK=0V VDD=2.97V, IOH=-8mA VDD=2.97V, IOL=8mA CE=3.3V CE=0V CE=3.3V CE=0.3V MIN. 2.97 2.7 － － -3.0 2.5 － － － 2.70 － 0.5 20.0 TYP. 3.30 － － － － － － 4.0 － － － 1.5 50.0 MAX. 3.63 － 0.6 3.0 － － 0.4 8.0 5.0 － 0.45 2.5 80.0 UNITS V V V μA μA V V mA μA V V MΩ kΩ fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, CL=15pF SYMBOL TTLH TTHL DUTY Ton Tj CONDITIONS VDD=3.3V (20% to 80%) (*2) VDD=3.3V (20% to 80%) (*2) (*2) 1σ(*2) MIN. － － 40 － － TYP. 5.0 5.0 50 － 60 MAX. － － 60 20 － *2 6/10 UNITS MHz Multiplier MHz － fCLKin=16MHz, Q0 pin output multiplier ratio=3, Ta=25℃, No Load SYMBOL VDD VIH VIL IIH IIL VOH VOL IDD1 IDD2 VCEH VCEL Rp1 Rp2 ● AC Characteristics XC25BS30xxMR PARAMETER Output Rise Time Output Fall Time Duty Ratio Output Start Time PLL Output Jitter MIN. 10.000 － 30.000 UNITS ns ns % ms ps R&D guarantee XC25BS3 Series ■TYPICAL APPLICATION CIRCUITS ●Circuit Example ①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2 ②Q1 Pin - GND ■NOTES ON USE (1) Please insert a by-pass capacitor of 0.1μF. (2) Rq0 and Rq1 are matching resistors. Their use is recommended in order to counter unwanted radiations. (3) Please place a by-pass capacitor and matching resistors as close to the IC as possible. The output may not be locked if the by-pass capacitor is not close enough to the IC. Further, there is a possibility of unwanted radiation occurrence between the resistor and the IC pin if the matching resistors are not close enough to the IC. (4) When selecting GND for the Q1 pin, although the IC will be connected to GND internally, it is also recommended that the PCB be connected to GND. (5) When the CE pin is not controlled by external signals, it is recommended that a time constant circuit of R1=1kΩ× C1=0.1μF be added for stability. (6) With this IC, output is achieved by dividing and multiplying the reference oscillation by means of the PLL circuit. In cases where this output is further used as a reference oscillation of another PLL circuit, the final output signal's jitter may increase, so all necessary precautions should be taken to avoid this. (7) It is recommended that a low noise power supply, such as a series regulator, be used for the supply voltage. Using a power supply such as a switching regulator might lead to a larger jitter, which in turn may lead to an inability to lock due to the ripple of the switching regulator. (8) As for this IC, synchronization of input and output signal’s edge is not guaranteed though the input frequency operates to the output frequency multiply. 7/10 XC25BS3 Series ■REFERENCE LAND PATTERN ①Q1 Pin - reference oscillation, PLL output frequency/2, comparative frequency/2 ②Q1 Pin - GND 8/10 XC25BS3 Series ■AC CHARACTERISTICS WAVEFORMS 1) Output Rise Time / Output Fall Time 2) Duty Ratio 3) Output Start Time 9/10 XC25BS3 Series 1. The products and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this catalog is up to date. 2. We assume no responsibility for any infringement of patents, patent rights, or other rights arising from the use of any information and circuitry in this catalog. 3. Please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. The products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction can be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. Atomic energy; aerospace; transport; combustion and associated safety equipment thereof.) 5. Please use the products listed in this catalog within the specified ranges. Should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. We assume no responsibility for damage or loss due to abnormal use. 7. All rights reserved. No part of this catalog may be copied or reproduced without the prior permission of Torex Semiconductor Ltd. 10/10