AVAGO AFCT-711XPDZ Multi-rate 1310 nm xfp 10 gbit/s optical transceiver Datasheet

AFCT-711XPDZ
Multi-rate 1310 nm XFP 10 Gbit/s Optical Transceiver
Data Sheet
Description
Features
The 1310 nm XFP transceiver is a high performance, cost
effective module for serial optical data communications
applications specified for signal rates of 9.95 Gb/s to 11.3
Gb/s. It is compliant to XFP MSA Rev 4.5. The module is
designed for single mode fiber and operates at a nominal
wavelength of 1310 nm. The transmitter section incorporates a directly modulated 1310 nm distributed feedback
laser (DFB). The receiver section uses an MOVPE grown
planar TEDET PIN photodetector for low dark current and
excellent responsivity. Integrated Tx and Rx eye openers
provide high jitter-tolerance and low jitter-generation
and transfer for full XFI and SONET compliance. The
internally AC coupled high speed serial I/O simplifies
interfacing to external circuitry. The electrical interface
is made using an industry standard 0.8 mm pitch 30-pin
right angle connector. Optical connection is made via the
duplex LC connector.
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Applications
• Fibre Channel Switches
• Host Bus Adapter Cards
• Mass Storage System and Server I/O
• Optical Cross Connect Switches
- Next generation SONET/SDH ADMs
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- Core Routers
Related Products
• AFCT-721XPDZ: 10GbE/10GFC 1310nm XFP 10Gbit/s
Optical Transceiver
• AFBR-720XPDZ: 10GbE 850nm XFP 10Gbit/s Optical
Transceiver
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RoHS-6 Compliant
Supports 9.95Gb/s to 11.3Gb/s bit rates
Compliant to XFP MSA
Multi-protocol multi-bitrate
- SONET/SDH OC-192/STM-64 rate 9.9532 Gb/s,
Telcordia GR-253-CORE SR-1, ITU-T G.691 I64.1
- IEEE 802.3ae 10GBASE-LR for 10GbE, 10.3125 Gb/s
- 10GFC 1310 nm Serial PMD, type 1200-SM-LL-L,
10.51875 Gb/s
Uncooled 1310 nm DFB Laser and PIN Photodiode
Compliant XFI 10G Serial electrical interface
LC Duplex optical connector interface conforming to
ANSI TIA/EIA604-10 (FOCIS 10)
1.5W typical power dissipation
No Reference Clock required
Superior Thermal and EMI performance to support
high port densities
Customizable clip-on heatsink to support a variety
of line card environments
-5 to +70 °C case operating temperature range
Support XFI loopback
2-wire serial management interface provides real
time monitors of:
- Transmitted Optical Power
- Received Optical Power
- Laser Bias Current
- Module Temperature
- Supply Voltage
Link Lengths up to 10 km with 9 µm SMF
IEC 60825-1 Class 1/CDRH Class 1 laser eye safe
The product offers digital diagnostics using the 2-wire
serial interface defined in the XFP MSA. The product
provides real time temperature (module and laser),
supply voltage, laser bias current, laser average output
power and received input power. The digital diagnostic
interface also adds the ability to disable the transmitter
(TX_DIS), power down the module, monitor for module
faults and monitor for Receiver Loss of Signal (RX_LOS).
Transmitter disable, interrupt, power down/reset, receiver
loss of signal and module not ready are also hard wired
pins on the 30-pin right angle connector.
Installation
The AFCT-711XPDZ is hot-pluggable, allowing the
module to be installed while the host system is operating
and on-line. The attach heatsink is designed to clip on to
the XFP cage without a module present.
Upon insertion, the transceiver housing makes initial
contact with the host board XFP cage, mitigating
potential damage due to Electro-Static Discharge (ESD).
Once fully inserted into the XFP cage, the top surface of
the XFP module makes contact with the heatsink through
a cutout in the top of the cage ensuring an effective
thermal path for module heat.
Functional Description
Transmitter Section
The transmitter section includes a 1310 nm DFB (Distributed Feedback Laser) light source, a transmitter driver
circuit and a signal conditioner circuit on the TX data
inputs. (See Figure 1) Optical connection to the transmitter is provided via a LC connector. The optical output is
controlled by a custom IC that detects the laser output
via the monitor photodiode. This IC provides both dc and
AC current drive to the laser to ensure correct modulation, eye diagram and extinction ratio over temperature,
supply voltage and operating life.
TX_DIS
Asserting pin 5, TX_DIS, will disable the transmitter optical output. The transmitter output can also
be disabled and monitored via the two-wire serial
interface.
Eye Safety Circuit
Under normal operating conditions laser power will be
maintained below Class 1 eye-safety limits.
Heat sink
RF
driver
Optical
isolator
Mon. PIN
CW
driver
Th
Power
supply
control
PIN
TIA
ROSA
Main housing
Figure 1. Transceiver Functional Diagram
Analog signal
conditioners
Optical receptacles
D/A
TOSA
Eye opener
(CDR)
ESA
Digital 10 Gb/s
electrical signal
EEPROM
Micro
controller
A/D
Eye opener
(CDR)
Digital low speed
bus or signal
Electrical connector
Laser
Analog low
speed signal
+3.3V
Receiver Section
Host Board
The receiver section includes a PIN detector with amplification, quantization and signal conditioner circuits. (See
Figure 1) Optical connection to the receiver is provided
via a LC optical connector.
0.1 µF
Host +3.3 V
RX_LOS
0.1 µF
The receiver section contains a loss of signal (RX_LOS)
circuit to indicate when the optical input signal power
is insufficient for reliable signal detection. A high signal
indicates loss of modulated signal, indicating link failure
such as a broken fiber or nonfunctional remote transmitter. RX_LOS can also be monitored via the two-wire serial
interface (byte 110, bit 1).
Optional
Host +1.8 V
0.1 µF
Optional Host -5.2 V
0.1 µF
Functional Data I/O
4.7 µH
22 µF
4.7 µH
22 µF
4.7 µH
22 µF
0.1 µF
VCC 3
0.1 µF
VCC 2
0.1 µF
VEE 5
0.1 µF
Figure 2. MSA Recommended Power Supply Filter
Electrical Pinout
Top surface of edge
connector on module
Bottom surface of edge
connector on module
GND
15
16
GND
RX_LOS
14
17
RD-
MOD_NR
13
18
RD+
MOD_ABS
12
19
GND
SDA
11
20
VCC2
SCL
10
21
P_DOWN/RST
VCC3
9
22
VCC2
VCC3
8
23
GND
GND
7
24
REFCLK+
VCC5
6
25
REFCLK-
TX_DIS
5
26
GND
INTERRUPT
4
27
GND
MOD_DESEL
3
28
TD-
VEE5
2
29
TD+
GND
1
30
GND
Figure 3. Host PCB XFP Pinout Top View
22 µF
VCC 5
GND
Avago Technologies’ AFCT-711XPDZ fiber-optic transceiver is designed to accept industry standard electrical input
differential signals. The transceiver provides AC-coupled,
internally terminated data input and output interfaces.
Bias resistors and coupling capacitors have been included
within the module to reduce the number of components
required on the customer’s board.
TOWARD
ASIC
4.7 µH
XFP Connector
Optional
Host +5 V
TOWARD
BEZEL
XFP Module
Table 1. Electrical Pin Definitions
Pin
Name
Function/Description
Notes
1
GND
Logic
Module Ground
1
2
VEE5
-5.2 V power supply. (Not Used)
3
Mod-Desel
LVTTL-I
Module De-select; When held low allows the module to respond to 2wireSerial interface commands
4
4
Interrupt
LVTTL-O
Interrupt; Indicates presence of an important condition which can be
read over the serial 2-wire interface
2
5
TX_DIS
LVTTL-I
Transmitter Disable; Transmitter Laser Source Turned Off
4
6
VCC5
5 V power supply. (Not Used)
7
GND
Module Ground
8
VCC3
+3.3 V Power Supply
9
VCC3
+3.3 V Power Supply
10
SCL
LVTTL-I
Two Wire Interface Clock
2
11
SDA
LVTTL-I/O
Two Wire Interface Data Line
2
12
Mod_Abs
LVTTL-O
LVTTL-O Mod_Abs Indicates Module is not present. Grounded in the
Module
2
13
Mod_NR
LVTTL-O
Module Not Ready; Indicating Module Operational Fault
2
14
RX_LOS
LVTTL-O
Receiver Loss Of Signal Indicator
2
15
GND
Module Ground
1
16
GND
Module Ground
1
17
RD-
CML-O
Receiver Inverted Data Output
18
RD+
CML-O
Receiver Non-Inverted Data Output
19
GND
Module Ground
20
VCC2
+1.8 V Power Supply (Not Used)
21
P_Down/RST
22
VCC2
23
GND
24
RefCLK+
PECL-I
Reference Clock Non-Inverted Input, AC coupled on the host board (Not 3
Used)
25
RefCLK-
PECL-I
Reference Clock Inverted Input, AC coupled on the host board (Not
Used)
3
26
GND
Module Ground
1
27
GND
Module Ground
1
28
TD-
CML-I
Transmitter Inverted Data Input
29
TD+
CML-I
Transmitter Non-Inverted Data Input
30
GND
LVTTL-I
1
Power down: When high, the module is put into a low power mode. Se- 4
rial interface is functional in the low power mode. Reset: The falling edge
initiates a complete reset of the module including the serial Interface,
equivalent to a power cycle.
+1.8 V Power Supply (Not Used)
Module Ground
Module Ground
Notes:
1. Module ground pins Gnd are isolated from the module case and chassis ground within the module.
2. Open Collector should be pulled up with 4.7kΩ to 10kΩ to a voltage between 3.15 V and 3.6 V on the host board.
3. RefCLK+/- are internally terminated (50Ω)
4. Pulled up to Vcc3 via 4.7-10kΩ resistor inside the module
1
1
1
Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Storage Temperature
(non-operating)
TS
-40
Typical
+85
°C
1, 2, 3
Ambient Operating Temperature
TA
-40
+85
°C
1, 2, 3
Relative Humidity
RH
10
90
%
1
Supply Voltage
VCC3
3.6
V
1, 2
Low Speed Input Voltage
VIN
-0.5
VCC+0.5
V
1
Parameter
Symbol
Minimum
Maximum
Unit
Notes
Case Operating Temperature
TC
-5
+70
°C
3
Supply Voltage
VCC3
3.135
3.465
V
5
9.95
11.3
Gb/s
Recommended Operating Conditions [4]
Data Rate
Typical
Transceiver Electrical Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Power Supply Noise Rejection
(peak-peak) under 1MHz
Maximum
Unit
Notes
PSNR
2% of VCC
mV
6
Power Supply Noise Rejection
(peak-peak) 1MHz to 10 MHz
PSNR
3% of VCC
mV
6
Module supply current
ICC
425
605 (EOL)
mA
Power Dissipation
PDISS
1410
2100 (EOL)
mW
Low Speed Outputs:
MOD_NR, RX_LOS, MOD_ABS,
INTERRUPT
VOH
VOL
Host_VCC-0.5
0.0
Host_VCC+0.3
0.4
V
V
7
8
VIH
VIL
2.0
-0.5
VCC3+0.3
0.8
V
V
10
9
Low Speed Inputs:
TX_DIS, MOD_DESEL, P_DOWN/RST
Minimum
Typical
Notes:
1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short
period of time. See Reliability Data Sheet for specific reliability performance.
2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability
is not implied, and damage to the device may occur over an extended period of time.
3. The Ambient Operating Temperature limitations are based on the Case Operating Temperature limitations and are subject to the host system
thermal design.
4. Recommended Operating Conditions are those values for which functional performance and device reliability is implied
5. Vcc condition applies to supply voltage at the XFP module
6. Power Supply filtering on host board required as per XFP MSA specification
7. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOH(max) = - 2 mA.
8. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IOL(max) = 2 mA.
9. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIL(max) = 10 µA.
10. 4.7 kW to 10 kW resistor pull-up to host_VCC, measured at the host side of connector. IIH(max) = - 10 µA.
Transmitter Electrical Input Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Differential Input Impedance
Zd
Minimum
Termination Mismatch
DZM
Differential Input Amplitude
DVQDO
120
Differential Input Return Loss
SDD11
Differential Input Return Loss
SDD11
Differential Input Return Loss
Typical
Maximum
Unit
Notes
W
100
5
%
820
mV
peak to peak (1)
20
dB
0.05 to 0.1 GHz
8
dB
0.1 to 5.5 GHz
SDD11
8 - 20.66
log10(f/5.5),
f in GHz
dB
5.5 - 12 GHz
Common Mode Input Return Loss
SCC11
3
dB
0.1 to 12 GHz
Differential to Common Mode
Conversion
SCD11
10
dB
0.1 to 12 GHz
Jitter and Eye Mask
XFP MSA Compliant
Receiver Electrical Output Characteristics
Parameter
Symbol
Differential Output Impedance
Zd
Termination Mismatch
DZM
Differential Output Amplitude
DVQDO
DC Common Mode Potential
Vcm
Minimum
Typical
Maximum
Unit
5
%
340
850
mV
0
3.6
V
15
mV
Output AC Common Mode Voltage
Notes
W
100
peak to peak (1)
RMS
Output Rise/Fall time (20% to 80%)
tr, tf
24
ps
Common mode output return loss
SCC22
3
dB
0.1 to 12 GHz
Differential output return loss
SDD22
20
dB
0.05 to 0.1 GHz
Differential output return loss
SDD22
8
dB
0.1 to 5.5 GHz
Differential output return loss
SDD22
8 - 20.66
log10(f/5.5)
f in GHz
dB
5.5 to 12 GHz
Jitter and Eye Mask
Notes:
1. The differential input and output amplitudes are per XFP MSA Rev 4.5 mask at points B’ and C’.
XFP MSA Compliant
Transmitter Optical Characteristics 10 GbE/10GFC
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Minimum
Optical Output Power
Pout
-5.2
Average Optical Output Power
Pout
-8.2
Extinction Ratio
ER
3.5
Spectral Width - rms
s, rms
Center Wavelength
lC
Transmitter and dispersion penalty
TDP
1260
Typical
Maximum
Unit
Notes
dBm OMA
1, 2
dBm
1, 2
dB
1, 2
0.2
nm RMS
3
1355
nm
3.2
dB
1, 2
0.5
1310
Side mode suppression ratio
30
dB
1
Optical output power (min)
in OMA - TDP
-6.2
dBm OMA
1, 2
-128
dB/Hz
1
Maximum
Unit
Notes
0.5
dBm mean
1
-10.3
dBm OMA
1
-12.6
dBm OMA
3
-12
dB
1
1355
nm
RIN12 (OMA)
RIN
Optical eye mask
Compliant with IEEE 802.3ae 10GBASE-LR
Receiver Optical Characteristics 10 GbE/10GFC
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Average Receive power
Minimum
Typical
-14.4
Stressed receiver sensitivity
Receiver sensitivity
PIN
Max Receiver Reflectance
Wavelength
Jitter Tolerance Compliant
with XFP MSA Rev 4.5
lC
1260
1310
Transmitter Optical Characteristics OC-192 SONET SR-1
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Minimum
Optical Output Power
PO
-6
Typical
Maximum
Unit
Notes
-1
dbm
4
Extinction Ratio
ER
6
Spectral Width @ 20 dB
s
Center Wavelength
lC
1290
Side mode suppression ratio
SMSR
30
Output Optical Eye Mask
Compliant with Telcordia GR-253-CORE, ITU-T G.691
Jitter Generation (peak-to-peak)
20kHz – 80MHz
4MHz – 80MHz
Tjpp
Jitter Transfer
Compliant with XFP MSA
dB
1310
1
nm
1330
nm
5
dB
0.3
0.1
UIpp
UIpp
6
Notes:
1. 10GFC 1200-SM-LL-L / IEEE 802.3ae 10GBASE-LR compliant
2. These parameters are interrelated: see IEEE 802.3ae
3. For information only
4. The output power is coupled into a 1 m single mode fiber. Minimum output optical level is at end of life.
5. Measured 20 dB down from the maximum of the central wavelength peak
6. Supports compliance to both GR-253-CORE and ITU-T G.783 specifications.
Receiver Optical Characteristics OC-192 SONET SR-1
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Receiver sensitivity
PIN (MIN)
Receiver overload
PIN (MAX)
Minimum
Max Receiver Reflectance
Input Operating Wavelength
1290
Typical
Maximum
Unit
Notes
-18.1
(BOL, ER =6 dB)
-11
dBm
1
-1
dBm
1
-14
dB
1330
nm
Jitter Tolerance
Compliant with GR-253 and ITU-T G.783 masks.
Jitter Transfer
Compliant with XFP MSA.
Notes:
1. BER no worse than 1x10-12
Transceiver Timing Characteristics
(TC = -5 °C to +70 °C, VCC3 = 3.3 V ± 5%)
Parameter
Symbol
Max
Unit
Notes
TX_DIS Assert Time
t_off
20
µs
Time from rising edge of TX_DIS to when the optical
output falls below 10% of nominal.
TX_DIS Negate Time
t_on
2
ms
Time from falling edge of TX_DIS to when the modulated optical output rises above 90% of nominal.
Time to initialize
t_init
300
ms
From power on or hot plug after meeting power
supply specs
Interrupt assert delay
Interrupt_on
200
ms
From occurrence of the condition triggering interrupt
Interrupt negate delay
Interrupt_off
500
us
From clear on read interrupt flags
P_Down/RST assert delay
P_Down/RST_on
100
us
From Power down initiation
P_Down negate delay
P_Down/RST_off
300
ms
Max delay from negate to completion of power up
and reset
Mod_NR assert delay
Mod_nr_on
1
ms
From Occurrence of fault to assertion of MOD_NR
Mod_NR negate delay
Mod_nr_off
1
ms
From Occurrence of signal to negation of MOD_NR
Mod_DeSel assert time
T_Mod_DeSel
2
ms
Maximum delay between assertion ofMod_DeSel
and end of module response to 2-wire interface communications
Mod_DeSel de-assert time
T_Mod_Sel
2
ms
Maximum delay between de-assertion of Mod_DeSel and proper module response to 2-wire interface
communications
P_Down reset time
t_reset
RX_LOS Assert delay
T_loss_on
RX_LOS negate delay
T_loss_off
Serial ID Clock Rate
f_serial_clock
Min
10
µs
Min length of P-Down assert to initial reset
100
µs
From Occurrence of loss of signal to assertion of
RX_LOS
2.3
100
µs
From Occurrence of presence of signal to negation of
RX_LOS
0
400
kHz
Digital Diagnostic Interface and Serial Identification
Transmitter Laser DC Bias Current
The 2-wire serial interface is explicitly defined in the XFP
MSA document and is designed to be compatible with
I2C host controllers. 2-wire timing specifications and the
structure of the memory map are per XFP MSA Rev 4.0.
The normal 256 Byte I2C address space is divided into
lower and upper blocks of 128 Bytes. The lower block
of 128 Bytes is always directly available and is used for
diagnostic information providing the opportunity for
Predictive Failure Identification, Compliance Prediction,
Fault Isolation and Component Monitoring. The upper
address space tables are used for less frequently accessed
functions such as serial ID, user writeable EEPROM,
reserved EEPROM and diagnostics and control spaces for
future standards definition, as well as Avago Technologies
specific functions.
Laser bias current is measured using sensing circuitry
located on the transmitter laser driver IC. Normal variations in laser bias current are expected to accommodate
the impact of changing transceiver temperature and
supply voltage operating points. The AFCT-711XPDZ
uses a closed loop laser bias feedback circuit to maintain
constant optical power and extinction ratio. This circuit
compensates for normal laser parametric variations in
quantum efficiency, forward voltage and lasing threshold
due to changing transceiver operating points.
Predictive Failure Identification
The diagnostic information allows the host system to
identify potential link problems. Once identified, a
“fail over” technique can be used to isolate and replace
suspect devices before system uptime is impacted.
Compliance Prediction
The real-time diagnostic parameters can be monitored
to alert the system when operating limits are exceeded
and compliance cannot be ensured. As an example, the
real time average receive optical power can be used to
assess the compliance of the cable plant and remote
transmitter.
Fault Isolation
The diagnostic information can allow the host to pinpoint
the location of a link problem and accelerate system
servicing and minimize downtime.
Component Monitoring
As part of host system qualification and verification, real
time transceiver diagnostic information can be combined
with system level monitoring to ensure performance and
operating environment are meeting application requirements.
Transceiver Module Temperature
The transceiver module temperature represents the
module case temperature. It is a calibrated value from
an internal PCB temperature measured using a sensing
circuitry.
10
Transmitted Average Optical Output Power
Variations in average optical power are not expected
under normal operation because the AFCT-711XPDZ
uses a closed loop laser bias feedback circuit to maintain
constant optical power over time at a given temperature.
This circuit compensates for normal laser parametric
variations due to changing transceiver operating points.
Only under extreme laser bias conditions will significant
drifting in transmitted average optical power be observable. Therefore it is recommended Tx average optical
power be used for fault isolation, rather than predictive
failure purposes.
Received Average Optical Input Power
Received average optical power measurements are a
valuable asset for installers to verify cable plant compliance. Drifts in average power can be observed from the
cable plant and remote transmitter for potential predictive failure use. Received average optical power can be
used for fault isolation.
Auxiliary Monitors
There are two auxiliary monitors implemented in AFCT711XPDZ. One is the +3.3V supply voltage reported as
Auxiliary Measurement 2. The other is the Module PCB
temperature reported as Auxiliary Measurement 1. As
there is no auxiliary type defined for Module PCB Temperature, auxiliary type for Laser Temperature (0100b) is
used in this case.
Host Board
Clip
Heat Sink
Cage Assembly
Connector
EMI Gasket
(not shown)
Bezel
Module
Figure 4. XFP Assembly Drawing
11
Mechanical Specifications
Package Dimensions
Figure 5a. Module Drawing
Figure 5b. Module Drawing
12
Figure 6. XFP host board mechanical layout
13
Application Support
An Evaluation Kit and Reference Designs are available to
assist in evaluation of the AFCT-711XPDZ. Please contact
your local Field Sales representative for availability and
ordering details.
Regulatory Compliance
The transceiver Regulatory Compliance performance
is provided in Table 2 as a figure of merit to assist the
designer. The overall equipment design will determine
the certification level.
Electrostatic Discharge (ESD)
There are two conditions in which immunity to ESD
damage is important. Table 2 documents the ESD
immunity to both of these conditions.
The first condition is static discharge to the transceiver
during handling such as when the transceiver is inserted
into the transceiver port. To protect the transceiver,
it is important to use normal ESD handling precautions including the use of grounded wrist straps, work
benches, and floor mats in ESD controlled areas. The
ESD sensitivity of the AFCT-711XPDZ is compatible with
typical industry production environments.
The second condition is static discharge to the exterior
of the host equipment chassis after installation. To the
extent that the duplex LC optical interface is exposed
to the outside of the host equipment chassis, it may be
subject to system-level ESD requirements.
The ESD performance of the AFCT-711XPDZ exceeds
typical industry standards.
Immunity
The transceivers have a shielded design to provide
excellent immunity to radio-frequency electromagnetic
fields which may be present in some operating environments.
Electromagnetic Interference (EMI)
Most equipment designs using the AFCT-711XPDZ are
subject to the requirements of the FCC in the United
States, CENELEC EN55022 (CISPR 22) in Europe and VCCI
in Japan. The metal housing and shielded design of the
AFCT-711XPDZ minimizes EMI and provides excellent
EMI performance.
Table 2. Regulatory Compliance
Feature
Test Method
Performance
Electrostatic Discharge (ESD)
to the exterior of the XFP module
JEDEC JESD22-A114-B
1000 Volts
Electrostatic Discharge (ESD)
to the Optical Connector
GR1089
10 discharges of both polarities of 8 KV on
the electrical faceplate with device inserted
into a panel.
Electrostatic Discharge (ESD)
to the Optical Connector
Variation of IEC 801-2
Air discharge of 15 kV(min) contact to connector w/o damage
Electromagnetic Interference
(EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class 1
System margins are dependent on customer
board and chassis design.
Immunity
Variation of IEC 61000-4-3
Less than 0.5 dB of Rx sensitivity degradation
and less than 10% margin reduction of Tx
mask at 10 V/m, 10 MHZ to 1 GHz w/o chassis
enclosure
Laser Eye Safety and Equipment
Type Testing
US FDA CDRH AEL Class 1
US21 CFR, Subchapter J per Paragraphs 1002.10 and
1002.12.
CDRH certification # 9521220-100
TUV Certificate # R72071466
(IEC) EN60825-1: 1994 + A11+A2
(IEC) EN60825-2: 1994 + A1
(IEC) EN60950: 1992 + A1 + A2 + A3
+ A4 + A11
Component Recognition
14
Underwriters Laboratories and Canadian Standards
Association Joint Component Recognition for Information Technology Equipment Including Electrical
Business Equipment
UL file # E173874
Eye Safety
Caution
The AFCT-711XPDZ transceivers provide Class 1 eye
safety by design. Avago Technologies has tested the
transceiver design for regulatory compliance, under
normal operating conditions and under single fault conditions. See Table 2.
The AFCT-711XPDZ contains no user serviceable parts.
Tampering with or modifying the performance of the
AFCT-711XPDZ will result in voided product warranty.
It may also result in improper operation of the AFCT711XPDZ circuitry, and possible overstress of the laser
source. Device degradation or product failure may result.
Connection of the AFCT-711XPDZ to a non-approved
optical source, operating above the recommended
absolute maximum conditions may be considered an
act of modifying or manufacturing a laser product. The
person(s) performing such an act is required by law to
recertify and reidentify the laser product under the provisions of U.S. 21 CFR (Subchapter J) and the TUV.
Flammability
The AFCT-711XPDZ is compliant to UL 94V-0.
Customer Manufacturing Processes
The module is pluggable and is not designed for aqueous
wash, IR reflow or wave soldering processes.
Ordering Information
Please contact your local field sales engineer or one of
Avago Technologies franchised distributors for ordering
information. For technical information, please visit Avago
Technologies ’ WEB page at www.avagotech.com. For information related to XFP MSA documentation visit www.
xfpmsa.org
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved.
AV02-1079EN - November 26, 2008
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