Sharp GP2W0104YP 115 kbps transceiver Datasheet

GP2W0104YP
115 kbps Transceiver
IrDA Data Sheet
FEATURES
• Built-in Photodiode
• Operating voltage 2.4 V to 5.5 V
• Conforms to eye safety IEC60825-1, without external resistor
• This product shall not contain the following materials, and these materials shall not be used in the production process for this product.
– CFCs
– Halon
– Carbon Tetrachloride
– 1.1.1. Trichloroethane (Methylchloroform)
– Specific brominated flame retardants such as the
PBBOS and PBBS are not used in this device.
INTRODUCTION
This specification applies to the outline and characteristics of IrDA 1.2 type (data rate 2.4 kbps to 115.2
kbps, low power option compliant).
NOTES
• Caution should be taken to prevent the detector surface from being smeared with dust or dirt, or from
being touched, as it may cause faulty operation.
• Cleaning conditions:
– Solvent cleaning: Solvent temperature 45°C or
less. Immersion for 3 minutes or less.
– Ultrasonic cleaning: The effect of ultrasonic
cleaning on the device differs by cleaning bath
size, ultrasonic power output, cleaning time, PCB
size or device mounting condition, etc. Test the
device under actual conditions and confirm that
ultrasonic cleaning does not cause any immediate or potential defects.
– Cleaning solvent: The cleaning shall be carried out
with ethyl alcohol, methyl alcohol, isopropyl alcohol.
• In order to prevent electrostatic damage to the integrated circuit, handle this device in a static-free environment and workstation.
• External force applied to the device after mounting can
cause mounting defects such as the terminal coming
off. Be careful when handling the device and prevent
objects from touching the device after mounting.
• Refer to the ‘Precautions for Soldering’ section.
• When the system (program) is designed, the turn
around time from transmit to receive should be
designed by considering 0.5 ms or more that is specified by IrDA. This turn around time means the time
IrDA Data Sheet
that this device does not temporarily detect the
inconsistent signal, since the transmitted light from
the transmitter side reaches the detector side of the
same transceiver.
• When designing the system (program), consider that
0.3 ms or more (at TA = 25°C, no input signal) is necessary to return from shut-down mode to readyoperation mode. In addition, thoroughly confirm the
operation in the actual application.
• When there is considerable external stray light or a
light source is located near the transceiver, or the
detector face receives considerable external stray
light, a pulse other than signal output may be generated as noise on output terminal of the transceiver.
Consider the layout and structure in your design to
minimize disturbing light on the detector face.
• When the sensor is adopted in an IR communication
system, it should be used according to the signal
method which is specified by ‘Serial Infrared Physical
Layer Link Specification’ published by the Infrared
Data Association. Faulty operation may occur, if a signal method other than that specified is used.
• RXD pinout remains at high-level output in shutdown
mode. The RXD pinout is CMOS output, and other
CMOS outputs must not be directly connected to this
pinout, as it does not conform to tri-state output.
• In circuit designs, make allowance for the degradation
of the light emitting diode output that results from longterm continuous operation (50% degradation/5 years).
1
NC
2
NC
3
4
VDD GND
5
6
7
8
SD RXD TXD LEDA
+
CX
VDD GND
SD RXD TXD
COMPONENTS
RECOMMENDED VALUES
CX
10 µF/6.3 V (NOTE 1)
NOTES:
1. Choose the most suitable CX according to the
noise level and noise frequency of power supply.
2. Pin 1 and Pin 2 are not connected internally.
GP2W0104YP-1
Figure 1. Recommended External Circuit
1
GP2W0104YP
115 kbps Transceiver
+
LEDA
1
CX
VDD
2
ENCODER
CIRCUIT
3
TXD
GP2W0104YP
UART
DECODER
CIRCUIT
5
4
3
RXD
SD
GND
SD INPUT
PERFORMANCE
LOW
Normal Mode
HIGH
Shutdown
Mode
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0104YP receiver output waveform
5 Receiving data waveform
GP2W0104YP-2
Figure 2. System Example
1
T
T
0
1
Recommended Size of
Solder Cream Paste
0
Open the solder mask as shown in Figure 4. The
size of solder cream paste for this device before reflow
soldering must be as large as one of the foot pattern
land, indicated in Figure 5.
1
3T/16
2
1.55
4
0
1
0
1
1.55
5
0.6
NOTES:
1 Transmitting data waveform
2 Encoder circuit output waveform
3 Transmitter output optical signal waveform
4 GP2W0104YP receiver output waveform
5 Receiving data waveform
T=
0.475
1.425
2.375
3.325
NOTES:
1. Dimensions are in mm.
2. Dimensions are for reference.
1
Data Rate
Data rate: 2.4 kbps, 9.6 kbps, 19.2 kbps, 38.4 kbps,
57.6 kbps, 115.2 kbps
3.
GP2W0104YP-3
Figure 3. Signal Waveform Example
2
0.1
2.0
1.1
3
Soldering paste area
GP2W0104YP-5
Figure 4. Solder Cream Size
IrDA Data Sheet
GP2W0104YP
1.0
115 kbps Transceiver
1.55
1.55
0.1
2.0
1.1
CENTER OF
MOUNTING AREA
8
0.6
7
6
5
4
3
2
1
0.475
1.425
PIN
PIN NAME
2.375
SYMBOL
1
NC
NC
2
NC
NC
3
VDD
VDD
4
Ground
GND
5
Shutdown
SD
6
Receiver Data Output
RXD
7
Transmitter Data Input
TXD
8
LED Anode
LEDA
3.325
NOTES:
1. Dimensions are in mm.
2. Dimensions are shown for reference.
3. Connect foot pattern of shield case to GND pattern.
GP2W0104YP-4
Figure 5. Foot Pattern of PCB
IrDA Data Sheet
3
GP2W0104YP
115 kbps Transceiver
0.9
2.75 ±0.3
2.7 ±0.3
1.15
0.48
3.9
1.88
1.15
2.5
7.9 ±0.3
5.2
CENTER
EMBOSSED
OF DETECTOR
'S'
CENTER
OF EMITTER
0.8 +0.3
-0.2
0.35
1
2
3
4
1.05 ±0.3
φ2.2
2.15 ±0.3
φ2.2
1.5 ±0.3
2 ±0.3
5
6
+0.4
-0.2
8
7
8 - 0.4 +0.2
-0.3
PO .95 x 7 = 6.65
PIN
PIN NAME
BOTTOM VIEW
SYMBOL
1
NC
NC
2
NC
NC
3
VDD
VDD
4
Ground
GND
5
Shutdown
SD
6
Receiver Data Output
RXD
7
Transmitter Data Input
TXD
8
LED Anode
LEDA
0.6 ±0.3
8 - 0.6
PO .95 x 7 = 6.65
NOTES:
1. Dimensions are in mm.
2. Unspecified tolerances are ±0.2
3. Adhesion of resin to the terminal area are allowed MAX. 0.2 mm.
area: Au plating
GP2W0104YP-6
Figure 6. GP2W0104YP Outline Dimensions
4
IrDA Data Sheet
115 kbps Transceiver
GP2W0104YP
RATINGS AND CHARACTERISTICS
Absolute Maximum Ratings
SYMBOL
RATINGS
UNIT
Supply voltage
PARAMETER
VDD
0 to 6.0
V
Peak forward current
IFM
60
mA
Operating temperature
TOPR
-20 to +85
°C
Storage temperature
TSTG
-30 to +85
°C
Soldering temperature
TSOL
230
°C
NOTES
1
2
NOTES:
1. Pulse width: 78.1 µs. Duty ratio: 3/16.
2. Soldering reflow time: 5 seconds.
Recommended Operating Conditions
PARAMETER
Supply voltage
SYMBOL
OPERATING CONDITION
UNIT
VDD
2.4 to 5.5
V
Data rate
NOTES
BR
2.4 to 115.2
kbps
SD terminal high level input voltage
VIHSD
VDD -0.5 to VDD
V
1
SD terminal low level input voltage
VILSD
0.0 to 0.4
V
2
TXD high level input voltage
VIHTXD
VDD -0.5 to VDD
V
3
TXD low level input voltage
VILTXD
0.0 to 0.4
V
4
3. LED ON. See Figure 12.
4. LED OFF. See Figure 12.
NOTES:
1. Shut down mode
2. Normal mode
Electrical Characteristics
TA = 25°C, VCC = 3.3 V unless otherwise specified
PARAMETER
Current consumption at no input signal
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTES
IDD
70
120
µA
1
Current consumption at shut-down mode
IDD-S
0.01
1.0
µA
2
High level output voltage
VOH
V
3
Low level output voltage
VOL
0.4
V
4
3.0
Low level pulse width
tW
6.0
µs
5
Rise time
tR
1.0
0.4
µs
5
Fall time
tF
0.4
µs
5
Maximum reception distance
L
20
cm
5
W/m2
5
25
mW/sr
6
26
mA
6
0.6
µs
6
0.6
µs
6
900
nm
6
Input irradiance
Ee
0.09
Radiant intensity
IE
3.6
LED peak current
ILED
14
Rise time
tR
Fall time
tF
Peak emission wavelength
λp
NOTES:
1. No input signal, VILSD = 0 V. Output terminal open.
2. No input signal, VIHSD = VDD. Output terminal open.
3. See Figures 7, 8, and 9.
IrDA Data Sheet
20
850
4.
5.
6.
870
IOL = 400 µA. See Figures 7, 8, and 9.
BR = 115.2 kbps, φ ≤ 15°, See Figures 7, 8, and 9.
BR = 115.2 kbps, φ ≤ 15°, VIHTXD = 2.8 V. See Figures 10, 11,
and 12.
5
GP2W0104YP
T1
115 kbps Transceiver
T1
tF
tR
T2
VOH
90%
RADIATION
INTENSITY OF
TRANSMITTER
3.6 mW/sr
50%
10%
VOL
tW
NOTE: At BR = 2.4 Kbps: T1 = 416.7 µs, T2 = 78.1 µs
At BR = 115.2 Kbps: T1 = 8.68 µs, T2 = 1.63 µs
GP2W0104YP-8
GP2W0104YP-7
Figure 7. Input Signal Waveform (Detector Side)
Figure 8. Output Waveform (Detector Side)
φ
φ
GP2W0104YP
TRANSMITTER
(NOTE)
OSCILLOSCOPE
L
NOTE:
1. Transmitter uses GP2W0104YP (λp = 870 nm TYP.)
which is adjusted the radiation intensity at 3.6 mW/sr.
2. φ Indicates horizontal and vertical directions.
3. Ee: Detector face illuminance < 10 x
GP2W0104YP-9
Figure 9. Standard Optical System (Detector Side)
6
IrDA Data Sheet
115 kbps Transceiver
GP2W0104YP
90%
IE
10%
tR
tF
GP2W0104YP-10
Figure 10. Output Waveform Specification
(Emitter Side)
GP2W0104YP
DETECTOR FOR
RADIATION INTENSITY
MEASURING
φ
φ
NOTE: φ indicates horizontal
and vertical directions
GP2W0104YP-11
Figure 11. Standard Optical System (Emitter Side)
VDD = 3.3 V
60
1.63 µs
LEDA
TXD
GP2W0104YP
PEAK
40
FORWARD
CURRENT
25
IFM (mA) 20
VIN Tx = 2.8 V
BR = 115.2 Kbps
0
GP2W0104YP-12
Figure 12. Recommended Circuit (Emitter Side)
-20
-25
85
0
25
50
75
100
AMBIENT TEMPERATURE TA (°C)
NOTE: Pulse width ≤ 78.1 µs, Duty ratio 3/16
GP2W0104YP-13
Figure 13. Peak Forward Current
Versus Ambient Temperature
IrDA Data Sheet
7
GP2W0104YP
115 kbps Transceiver
RELIABILITY
TEST ITEMS
TEST CONDITIONS
FAILURE JUDGEMENT
CRITERIA
SAMPLES
(n)
DEFECTIVE (c)
NOTE
Temperature cycling
1 cycle -30°C to 85°C
(30 minutes) 20 cycles test
n = 22
c=0
1, 3, 4
High temperature and high
humidity storage
+40°C, 90% RH, 20 hours
n = 22
c=0
1, 3, 4
High temperature storage
+85°C, 240 hours
Low temperature storage
-30°C, 240 hours
Operation life 1
+25°C, VDD = 3.3 V, 240 hours
Operation life 2
+25°C, VDD = LEDA = 3.3 V,
240 hours, Pulse width 78.1 µs,
Duty ratio 3/16
Mechanical shock
1000 m/s2, 6 ms,
3 times/±X, ±Y, ±Z direction
Variable frequency
vibration
200 m/s2,
100 to 2,000 to 100 Hz for
Approximately 4 minutes
48 minutes/X, Y, Z direction
Reflow solder head
230°C, 5 s
n = 22
c=0
1, 3, 4
n = 22
c=0
1, 3, 4
n = 11
c=0
1, 3, 4
Up: Upper
Specification Limint
n = 11
c=0
1, 3, 4
Low: Lower
Specification Limint
n = 11
c=0
3, 4
n = 11
c=0
3, 4
n = 11
c=0
2, 3, 4
IDD > Up × 1.2
L < Low × 0.8
IE < Low × 0.8
IE > Up × 1.2
NOTES:
1. The sample to be tested shall be left at normal temperature and humidity for
2 hours after it is taken out of the chamber. No dew point.
2. Refer to the ‘Precautions for Soldering’ section for temperature profile.
3. Confidence level: 90%
4. LTPD: 10%/20%.
8
IrDA Data Sheet
115 kbps Transceiver
GP2W0104YP
PRECAUTIONS FOR SOLDERING
Solder Reflow
may break if the deformation of the PCB affects the lead
pins. Use after fully confirming the conditions of actual
solder reflow machine.
Solder only once at the temperature and the time
within the temperature profile as shown in Figure 14.
Soldering
Other Precautions
An infrared lamp used to heat up for soldering may
cause a localized temperature rise in the resin. So keep
the package temperature within that specified in Figure
14. Also avoid immersing the resin part in the solder.
Even if within the temperature profile shown in Figure 14,
there is the possibility that the gold wire in the package
• Soldering iron shall be less than 25 W, and temperature of soldering iron point shall be used at less
than 260°C.
• Soldering time shall be within 5 seconds.
• Soldered product shall treat at normal temperature.
• Solder: 6/4 solder or included Ag solder.
230°C
MAX.
1 - 4°C/s
200°C
165°C
MAX.
1 - 4°C/s
1 - 4°C/s
25°C
5 s MAX.
60 s MAX.
120 s MAX.
90 s MAX.
GP2W0104YP-14
Figure 14. Temperature Profile
IrDA Data Sheet
9
GP2W0104YP
115 kbps Transceiver
TAPING SPECIFICATIONS
Taping Method
• Taping structure and dimensions: The tape should
have a structure in which a cover tape is sealed heatpressed on the carrier tape of conductive PET. See
Figure 15.
• Reel structure and dimensions: The taping reel
should be conductive plastic with its dimensions as
shown in Figure 16.
• Direction of product insertion: Product direction in
carrier tape should be such that electrode side of
product is placed on the cover tape side and lens
side of product is placed on the hold side of the tape.
See Figure 17.
• Adhesiveness of cover tape: The exfoliation force
between carrier tape and cover tape should be 0.2 N
to 1 N for the angle from 160° to 180°.
• Rolling method and quantity: Wind the tape back on
the reel so that the cover tape is on the outside.
Attach more than 20 cm of blank tape to the trailer
and the leader of the tape and fix both ends with
adhesive tape. One reel shall contain 2,000 pieces.
• Safety protection during shipping: There should be
no deformation of component or degradation of electrical characteristics due to shipping.
2.65 ±0.1
+0.1
φ1.5 -0.0
8.0 ±0.1
16.0 ±0.3
1.75 ±0.1
7.5 ±0.1
0.3 ±0.05
8.2 ±0.1
2.0 ±0.1
4.0 ±0.1
• Taped device repair: To repair taped failure devices,
cut the bottom of carrier tape with a cutter, and after
replacing with good devices, seal the cut portion with
adhesive tape.
3.25 ±0.1
NOTE: Dimensions are in mm.
GP2W0104YP-15
Figure 15. Tape Structure and Dimensions
10
IrDA Data Sheet
115 kbps Transceiver
GP2W0104YP
21 ±0.8
13 ±0.2
22.4 MAX.
100 ±1
2 ±0.5
330 ±2
17.5 ±0.5
NOTE: Dimensions are in mm.
GP2W0104YP-16
Figure 16. Reel Structure and Dimensions
PULL-OUT DIRECTION
LENS
SIDE
GP2W0104YP-17
Figure 17. Direction of Product Insertion
IrDA Data Sheet
11
GP2W0104YP
115 kbps Transceiver
TAPING MOISTURE-PROOF PACKING
Packaging Specifications
Table 1. Packaging Material
NAME
MATERIAL
Aluminum laminate bag
Aluminum polyethylene
Label
Paper
Siccative
Outer case
Paper
Pads
Paper
Packaging Method
• Seal the aluminum laminated bag containing the
tape reel (2,000 pieces per reel) and siccative.
• Fill out necessary information on the label and paste
it on the aluminum laminate bag.
• Pack four aluminum laminated bags (containing one
reel each) into the designated outer case, where
paper pads are placed on the bottom and top of the
outer case, as well as between each layer of the aluminum laminated bags. Minimum order/shipment
quantity should be one laminated bag.
• The outer case should then be sealed with packing
tape, with indicating the model name, quantity, and
outgoing inspection data on the case. Total of 8,000
pieces per carton.
Storage and Treatment After Unsealing
• Storage conditions: The product should be stored
with these conditions:
– Storage temperature: 10°C to 30°C
– Humidity: below 60% RH
• Treatment after opening:
– After unsealing, devices should be mounted under the temperature condition of 10°C to 30°C, at
the humidity conditions of below 60% RH, within
two days.
– In case long term storage is needed, devices
should either be stored in dry box or re-sealed in
a moisture-proof bag with siccative and kept in an
environment where the temperature is 10°C to
30°C, at the humidity condition of below 60% RH.
Devices must be mounted within two weeks.
• Baking before mounting:
– In the event that the devices are not maintained
in the recommended storage conditions or the
enclosed siccative indicator has turned pink,
baking must be done before devices are mounted. Please also note that baking should only be
done once.
– Recommended condition: 100°C, 12 to 24 hours.
– Baking will not be properly done with the devices
in their shipping package. To complete the baking
properly, devices should either be temporarily
mounted to PCB with adhesive, or placed in a
metal tray. The temporary mounting should be
done using adhesive, not by soldering.
Table 2. Packaging Method Specifications
PACKAGE
SHAPE
PRODUCT
QUANTITY
SACK
QUANTITY
Tape reel
(φ 330 mm)
1 model
2,000 pieces per reel
1 reel per
moisture-proof
laminated bag
12
IrDA Data Sheet
115 kbps Transceiver
GP2W0104YP
PRODUCTS
IN TAPE-REEL
PADS
(TOTAL 5 SHEETS)
TAPE-REEL IN
ALUMINUM
LAMINATED BAG
(TOTAL 4 SETS)
DESICCANT
ALUMINUM
LAMINATED BAG
EXAMPLE 1
PACKING CASE
LABEL
(MODEL NUMBER
QUANTITY
DATE)
TAPE-REEL IN
ALUMINUM LAMINATED BAG
EXAMPLE 3
370 mm TYP.
440 mm TYP.
PACKING
TAPE
150 mm TYP.
EXAMPLE 2
PACKAGE METHOD EXAMPLES:
1. Seal the aluminum laminated bag, including the tape reel
with 2,000 pieces and desiccant.
2. Fill out the model name, quantity etc. in the blank area of label
and paste on the bag.
3. Put the four moisture-proof laminated bags in the ruled case.
Put the pad between the bags, and top and bottom.
4. Seal the case with packing tape, and indicate model name
and quantity. (8,000 pieces/package)
Total Packaged mass: Approximately 0.7 kg.
MODEL NUMBER
QUANTITY
DATE
EXAMPLE 4
NOTE: Dimensions are in mm.
GP2W0104YP-18
Figure 18. Packing Specification
IrDA Data Sheet
13
GP2W0104YP
115 kbps Transceiver
LIFE SUPPORT POLICY
SHARP components should not be used in medical devices with life support functions or in safety equipment (or similiar applications where
component failure would result in loss of life or physical harm) without the written approval of an officer of the SHARP Corporation.
LIMITED WARRANTY
SHARP warrants to its Customer that the Products will be free from defects in material and workmanship under normal use and service for a
period of one year from the date of invoice. Customer's exclusive remedy for breach of this warranty is that SHARP will either (i) repair or
replace, at its option, any Product which fails during the warranty period because of such defect (if Customer promptly reported the failure to
SHARP in writing) or, (ii) if SHARP is unable to repair or replace, refund the purchase price of the Product upon its return to SHARP. This
warranty does not apply to any Product which has been subjected to misuse, abnormal service or handling, or which has been altered or
modified in design or construction, or which has been serviced or repaired by anyone other than Sharp. The warranties set forth herein are in
lieu of, and exclusive of, all other warranties, express or implied. ALL EXPRESS AND IMPLIED WARRANTIES, INCLUDING THE
WARRANTIES OF MERCHANTABILITY, FITNESS FOR USE AND FITNESS FOR A PARTICULAR PURPOSE, ARE SPECIFICALLY
EXCLUDED. In no event will Sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage.
The above warranty is also extended to Customers of Sharp authorized distributors with the following exception: reports of failures of Products
during the warranty period and return of Products that were purchased from an authorized distributor must be made through the distributor.
In case Sharp is unable to repair or replace such Products, refunds will be issued to the distributor in the amount of distributor cost.
SHARP reserves the right to make changes in specifications at any time and without notice. SHARP does not assume any responsibility
for the use of any circuitry described; no circuit patent licenses are implied.
NORTH AMERICA
EUROPE
ASIA
SHARP Microelectronics
of the Americas
5700 NW Pacific Rim Blvd.
Camas, WA 98607, U.S.A.
Phone: (360) 834-2500
Telex: 49608472 (SHARPCAM)
Facsimile: (360) 834-8903
http://www.sharpsma.com
SHARP Electronics (Europe) GmbH
Microelectronics Division
Sonninstraße 3
20097 Hamburg, Germany
Phone: (49) 40 2376-2286
Facsimile: (49) 40 2376-2232
http://www.sharpmed.com
SHARP Corporation
Integrated Circuits Group
2613-1 Ichinomoto-Cho
Tenri-City, Nara, 632, Japan
Phone: +81-743-65-1321
Facsimile: +81-743-65-1532
http://www.sharp.co.jp
©2000 by SHARP Corporation
Reference Code SMA00002
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