Intersil ISL83239EIA ±15kv esd protected, 10na supply- current, 3v to 5.5v, 250kbps, rs-232 transmitters/receiver Datasheet

ISL83239E
TM
Data Sheet
September 2001
±15kV ESD Protected, 10nA SupplyCurrent, +3V to +5.5V, 250kbps, RS-232
Transmitters/Receivers
The Intersil ISL83239E contains 3.0V to 5.5V powered
RS-232 transmitters/receivers which meet ElA/TIA-232 and
V.28/V.24 specifications, even at VCC = 3.0V. Additionally, it
provides ±15kV ESD protection (IEC 1000-4-2 Air Gap and
Human Body Model) on transmitter outputs and receiver
inputs (RS-232 pins). Targeted applications are cell phones,
PDAs, Palmtops, and data cables where the low operational,
and even lower standby, power consumption is critical.
Efficient on-chip charge pumps, coupled with the manual
powerdown function, reduce the standby supply current to a
10nA trickle. Small footprint packaging, and the use of small,
low value capacitors ensure board space savings as well.
Data rates greater than 250kbps are guaranteed at worst
case load conditions.
File Number
6015.1
Features
• ESD Protection For RS-232 I/O Pins to ±15kV (IEC1000)
• Drop In Replacement for SP3239E
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• RS-232 Compatible Outputs at 2.7V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
Capacitors
• Manual Powerdown Feature
• Flow Through Pinout
• Rx and Tx Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/µs
The ISL83239E is a 5 driver, 3 receiver device that also
includes a noninverting always-active receiver for “wake-up”
capability.
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
Table 1 summarizes the features of the device represented
by this data sheet, while Application Note AN9863
summarizes the features of each device comprising the
ICL32XX 3V family.
Applications
• Low Supply Current in Powerdown State. . . . . . . . . . 10nA
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- PDA Data Cradles and Cables
- Cellular/Mobile Phones, Data Cables
Ordering Information
PART NO.
TEMP.
RANGE ( oC)
PACKAGE
PKG. NO.
ISL83239EIA
-40 to 85
28 Ld SSOP
M28.209
ISL83239EIA-T
-40 to 85
Tape and Reel
M28.209
ISL83239EIV
-40 to 85
28 Ld TSSOP
M28.173
ISL83239EIV-T
-40 to 85
Tape and Reel
M28.173
TABLE 1. SUMMARY OF FEATURES
PART
NUMBER
ISL83239E
NO. OF NO. OF
Tx.
Rx.
5
3
1
NO. OF
MONITOR Rx.
(R OUTB)
DATA
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
1
250
NO
NO
YES
NO
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Americas Inc. | Copyright © Intersil Americas Inc. 2001
ISL83239E
Pinout
ISL83239E (SSOP, TSSOP)
TOP VIEW
C2+ 1
28 C1+
GND 2
27 V+
C2-
26 VCC
3
25 C1-
V- 4
T1 OUT 5
24 T1IN
T2 OUT 6
23 T2IN
T3 OUT 7
22 T3IN
R1IN 8
21 R1 OUT
R2IN 9
20 R2 OUT
19 T4IN
T4OUT 10
R3IN 11
18 R3 OUT
T5 OUT 12
17 T5IN
N.C. 13
16 R1 OUTB
15 N.C.
SHDN 14
Pin Descriptions
PIN
VCC
FUNCTION
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RIN
ROUT
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
ROUTB
TTL/CMOS level, noninverting, always enabled receiver output.
SHDN
Active low input shuts down transmitters, receivers, and on-board power supply, to place device in low power mode.
N.C.
No internal connection.
2
ISL83239E
Typical Operating Circuit
ISL83239E
NOTE 2
+
0.1µF
28
C1
0.1µF
+
C2
0.1µF
+
+
C3 (OPTIONAL CONNECTION, NOTE 1)
+3.3V
25
1
3
C1+
26
27
VCC
+
V+
C1C2+
V-
4
C2T1
24
NOTE 2
C4
0.1µF
+
5
T1IN
T1 OUT
T2
23
6
T2IN
T2 OUT
T3
22
7
T3IN
T3 OUT
T4
19
RS-232
LEVELS
10
T4IN
T4 OUT
T5
17
12
T5IN
TTL/CMOS
LOGIC LEVELS
C3
0.1µF
T5 OUT
16
R1OUTB
21
8
R1OUT
R1IN
5kΩ
R1
20
9
R2OUT
R2IN
5kΩ
R2
18
11
R3OUT
R3IN
5kΩ
R3
VCC
RS-232
LEVELS
14
SHDN
GND
2
NOTES:
1. THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND.
2. FOR VCC = 3.15V (3.3V -5%), USE C 1 - C4 = 0.1µF OR GREATER. FOR VCC = 3.0V (3.3V -10%), USE C1 - C4 = 0.22µF.
3
ISL83239E
Absolute Maximum Ratings
Thermal Information
VCC to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, SHDN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to V CC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 3)
θJA (oC/W)
28 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
75
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
100
Moisture Sensitivity (see Technical Brief TB363)
All Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL83239EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF; VCC = 3V, C1 - C4 = 0.22µF, Unless Otherwise
Specified. Typicals are at TA = 25oC
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
Supply Current,
Powerdown Disabled
All Outputs Unloaded, V CC = 3.15V, SHDN = VCC
25
-
0.3
1.0
mA
Supply Current, Powerdown
SHDN = GND
25
-
10
300
nA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
TIN, SHDN
Input Logic Threshold High
TIN, SHDN
Full
-
-
0.8
V
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
25
-
0.5
-
V
Full
-
±0.01
±1.0
µA
Transmitter Input Hysteresis
Input Leakage Current
TIN, SHDN
Output Leakage Current
SHDN = GND (Receivers Disabled)
Full
-
±0.05
±10
µA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
VCC -0.6 V CC -0.1
RECEIVER INPUTS
Input Voltage Range
Input Threshold Low
Input Threshold High
Full
-25
-
25
V
VCC = 3.3V
25
0.6
1.2
-
V
VCC = 5.0V
25
0.8
1.5
-
V
VCC = 3.3V to 5.0V
25
-
1.6
2.4
V
Input Hysteresis
25
-
0.5
-
V
Input Resistance
25
3
5
7
kΩ
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
Ω
Full
-
±35
±60
mA
VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
±25
µA
Output Short-Circuit Current
Output Leakage Current
TIMING CHARACTERISTICS
4
ISL83239E
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1µF; VCC = 3V, C1 - C4 = 0.22µF, Unless Otherwise
Specified. Typicals are at TA = 25oC (Continued)
PARAMETER
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
Maximum Data Rate
RL = 3kΩ, CL = 1000pF One Transmitter Switching
Full
250
700
-
kbps
Receiver Propagation Delay
Receiver Input to Receiver
Output, C L = 150pF
tPHL
25
-
0.15
-
µs
tPLH
25
-
0.15
-
µs
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH
25
-
100
Receiver Skew
tPHL - tPLH, CL = 150pF
25
-
50
-
ns
Transition Region Slew Rate
VCC = 3.3V, RL = 3kΩ to 7kΩ, CL = 150pF to 1000pF
Measured From 3V to -3V
CL = 150pF to 2500pF
or -3V to 3V
25
6
17
30
V/µs
25
4
12
30
V/µs
Human Body Model
25
-
±15
-
kV
IEC1000-4-2 Air Gap Discharge
25
-
±15
-
kV
IEC1000-4-2 Contact Discharge
25
-
±8
-
kV
Human Body Model
25
-
±2.5
-
kV
ns
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
5
ISL83239E
Detailed Description
The ISL83239E operates from a single +3V to +5.5V supply,
guarantees a 250kbps minimum data rate, requires only four
small external 0.1µF (0.22µF for V CC = 3.0V) capacitors,
features low power consumption, and meets all EIA/TIA-232
and V.28 specifications. The circuit is divided into three
sections: The charge pump, the transmitters, and the
receivers.
Charge-Pump
Intersil’s new 3V RS-232 family utilizes regulated on-chip
dual charge pumps as voltage doublers, and voltage
inverters to generate ±5.5V transmitter supplies from a VCC
supply as low as 3.0V. This allows these devices to maintain
RS-232 compliant output levels over the ±10% tolerance
range of 3.3V powered systems. The efficient on-chip power
supplies require only four small, external 0.1µF capacitors
for the voltage doubler and inverter functions at V CC = 3.3V.
See the “Capacitor Selection” section, and Table 3 for
capacitor recommendations for other operating conditions.
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
Additionally, it includes a noninverting (monitor) receiver
(denoted by the R OUTB label) that is always active,
regardless of the state of any control lines. All the receivers
convert RS-232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 1) even if the power is off
(VCC = 0V). The receivers’ Schmitt trigger input stage uses
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
Monitor receivers remain active even during manual
powerdown, making them extremely useful for Ring Indicator
monitoring. Standard receivers driving powered down
peripherals must be disabled to prevent current flow through
the peripheral’s protection diodes (see Figures 2 and 3). This
renders them useless for wake up functions, but the
corresponding monitor receiver can be dedicated to this task
as shown in Figure 3.
VCC
RXIN
RXOUT
-25V ≤ VRIN ≤ +25V
5kΩ
GND ≤ VROUT ≤ VCC
GND
FIGURE 1. INVERTING RECEIVER CONNECTIONS
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
All transmitter outputs disable and assume a high
impedance state when the device enters the powerdown
mode (see Table 2). These outputs may be driven to ±12V
when disabled.
The ISL83239E guarantees a 250Kbps data rate for full load
conditions (3kΩ and 250pF), VCC ≥ 3.0V, with one
transmitter operating at full speed. Under more typical
conditions of V CC ≥ 3.3V, C1-4 = 0.1 µF, RL = 3kΩ, and
CL = 250pF, one transmitter easily operates at 1Mbps.
Transmitter inputs float if left unconnected, and may cause
ICC increases. Connect unused inputs to GND for the best
performance.
Receivers
The ISL83239E contains standard inverting receivers that
tristate when the SHDN control line is driven low.
Powerdown Functionality
This 3V device requires a nominal supply current of 0.3mA
during normal operation (not in powerdown mode). This is
considerably less than the 5mA to 11mA current required of
5V RS-232 devices. The already low current requirement
drops significantly when the device enters powerdown
mode. In powerdown, supply current drops to 10nA,
because the on-chip charge pump turns off (V+ collapses to
VCC , V- collapses to GND), and the transmitter outputs
tristate. This micro-power mode makes the ISL83239E ideal
for battery powered and portable applications.
Software Controlled (Manual) Powerdown
On the ISL83239E, the powerdown control is via a simple
shutdown (SHDN) pin. Driving this pin high enables normal
operation, while driving it low forces the IC into it’s
powerdown state. Connect SHDN to VCC if the powerdown
function isn’t needed. Note that all the transmitter and
receiver outputs tri-state during shutdown (see Table 2). The
time required to exit powerdown, and resume transmission is
only 100µs.
TABLE 2. POWERDOWN LOGIC TRUTH TABLE
SHDN INPUT
TRANSMITTER OUTPUTS
RECEIVER OUTPUTS
ROUTB OUTPUT
L
High-Z
High-Z
Active
Manual Powerdown
H
Active
Active
Active
Normal Operation
6
MODE OF OPERATION
ISL83239E
VCC
VCC
TABLE 3. REQUIRED CAPACITOR VALUES
CURRENT
FLOW
VCC
VOUT = VCC
Rx
POWERED
DOWN
UART
Tx
SHDN = GND
GND
OLD
RS-232 CHIP
VCC
(V)
C1
(µF)
C2, C 3, C4
(µF)
3.0 to 3.6 (3.3V ±10%)
0.22
0.22
3.15 to 3.6 (3.3V ±5%)
0.1
0.1
4.5 to 5.5
0.047
0.33
3.0 to 5.5
0.22
1.0
Power Supply Decoupling
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
In most circumstances a 0.1µF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
VCC
Operation down to 2.7V
ISL83239E transmitter outputs meet RS-562 levels (±3.7V)
with VCC as low as 2.7V. RS-562 levels typically ensure inter
operability with RS-232 devices.
TRANSITION
DETECTOR
TO
WAKE-UP
LOGIC
ISL83239E
Transmitter Outputs when Exiting
Powerdown
VCC
R1OUTB
RX
POWERED
DOWN
UART
VOUT = HI-Z
R1OUT
TX
R1IN
T1IN
T1OUT
SHDN = GND
Figure 4 shows the response of two transmitter outputs
when exiting powerdown mode. As they activate, the two
transmitter outputs properly go to opposite RS-232 levels,
with no glitching, ringing, nor undesirable transients. Each
transmitter is loaded with 3kΩ in parallel with 2500pF. Note
that the transmitters enable only when the magnitude of the
supplies exceed approximately 3V.
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
5V/DIV
SHDN
T1
Capacitor Selection
The charge pumps require 0.1µF capacitors for 3.3V (5%
tolerance) operation. For other supply voltages refer to Table
3 for capacitor values. Do not use values smaller than those
listed in Table 3. Increasing the capacitor values (by a factor
of 2) reduces ripple on the transmitter outputs and slightly
reduces power consumption. C2, C 3, and C4 can be
increased without increasing C1’s value, however, do not
increase C1 without also increasing C2, C3, and C4 to
maintain the proper ratios (C1 to the other capacitors).
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
7
2V/DIV
T2
VCC = +3.3V
C1 - C4 = 0.1µF
TIME (20µs/DIV.)
FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING
POWERDOWN
High Data Rates
The ISL83239E maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 5
details a transmitter loopback test circuit, and Figure 6
illustrates the loopback test result at 120kbps. For this test,
ISL83239E
all transmitters were simultaneously driving RS-232 loads in
parallel with 1000pF, at 120kbps. Figure 7 shows the
loopback results for a single transmitter driving 1000pF and
an RS-232 load at 250kbps. The static transmitters were
also loaded with an RS-232 receiver.
VCC
+
0.1µF
+
C1+
VCC
V+
C1
C1+
V-
C2+
+
C3
C4
+
C2TIN
VCC
SYSTEM
POWER-SUPPLY SUPPLY
VOLTAGE
VOLTAGE
(V)
(V)
3.3
3.3
5
5
5
3.3
TOUT
RIN
ROUT
CL
5k
VCC
The ISL83239E directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the device at 3.3V, and the
logic supply at 5V, AC, HC, and CD4000 outputs can drive
ISL83239E inputs, but ISL83239E outputs do not reach the
minimum VIH for these logic families. See Table 4 for more
information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
ISL83239E
C2
Interconnection with 3V and 5V Logic
SHDN
FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT
COMPATIBILITY
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL.
ISL83239E outputs are
incompatible with AC, HC, and
CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL832XX devices include ESD protection
structures, but the ISL83239E fsincorporates advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
5V/DIV.
T1IN
T1OUT
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
5µs/DIV.
FIGURE 6. LOOPBACK TEST AT 120kbps
5V/DIV.
T1IN
T1OUT
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC-1000 test which
utilizes a 330Ω limiting resistor. The HBM method
determines an ICs ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
IEC1000-4-2 Testing
R1OUT
VCC = +3.3V
C1 - C4 = 0.1µF
2µs/DIV.
FIGURE 7. LOOPBACK TEST AT 250kbps
8
The IEC 1000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
ISL83239E
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
Typical Performance Curves
repeatable results.The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
VCC = 3.3V, TA = 25oC
25
VOUT+
4
-SLEW
20
SLEW RATE (V/µs)
TRANSMITTER OUTPUT VOLTAGE (V)
6
2
1 TRANSMITTER AT 250kbps
OTHER TRANSMITTERS AT 30kbps
0
-2
+SLEW
10
VOUT -
-4
15
-SLEW
-6
0
1000
2000
3000
4000
5
5000
0
1000
LOAD CAPACITANCE (pF)
55
3.5
50
3.0
250kbps
40
120kbps
35
30
25
20kbps
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 10. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
9
4000
5000
NO LOAD
ALL OUTPUTS STATIC
2.5
2.0
1.5
1.0
0.5
20
0
3000
FIGURE 9. SLEW RATE vs LOAD CAPACITANCE
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
FIGURE 8. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
45
2000
LOAD CAPACITANCE (pF)
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
FIGURE 11. SUPPLY CURRENT vs SUPPLY VOLTAGE
6.0
ISL83239E
Die Characteristics
DIE DIMENSIONS:
PASSIVATION:
106 mils x 128 mils (2700µm x 3250µm)
METALLIZATION:
Type: Silox
Thickness: 13kÅ
TRANSISTOR COUNT:
Type: Metal 1: AISi(1%)
Thickness: Metal 1: 8kÅ
Type: Metal 2: AISi (1%)
Thickness: Metal 2: 10kÅ
609
PROCES
SUBSTRATE POTENTIAL (POWERED UP):
GND
10
Si Gate CMOS
ISL83239E
Shrink Small Outline Plastic Packages (SSOP)
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
N
INDEX
AREA
0.25(0.010) M
H
B M
INCHES
E
-B1
2
SYMBOL
GAUGE
PLANE
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
-C-
e
µα
B
0.25(0.010) M
C
0.10(0.004)
C A M
MAX
A
-
A1
0.002
B S
5. Dimensioning and tolerancing per ANSI Y14.5M-1982.
6. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
7. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
8. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
9. “L” is the length of terminal for soldering to a substrate.
10. “N” is the number of terminal positions.
11. Terminal numbers are shown for reference only.
12. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
13. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
11
NOTES
0.078
-
2.00
-
-
0.05
-
-
0.065
0.072
1.65
1.85
-
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
8o
0o
α
4. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
MAX
B
N
NOTES:
MIN
A2
e
A2
A1
MILLIMETERS
MIN
28
0o
28
7
8o
Rev. 1 3/95
ISL83239E
Thin Shrink Small Outline Plastic Packages (TSSOP)
M28.173
N
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
B M
3
L
0.05(0.002)
-A-
SEATING PLANE
A
D
-C-
α
e
A1
b
0.10(0.004) M
0.25
0.010
A2
C A M
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
c
0.10(0.004)
B S
0.026 BSC
E
0.246
L
0.0177
N
NOTES:
MILLIMETERS
α
0.65 BSC
0.256
6.25
0.0295
0.45
28
0o
6.50
0.75
28
8o
0o
14. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
6
7
8o
Rev. 0 6/98
15. Dimensioning and tolerancing per ANSI Y14.5M-1982.
16. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
17. Dimension “E1” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
18. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
19. “L” is the length of terminal for soldering to a substrate.
20. “N” is the number of terminal positions.
21. Terminal numbers are shown for reference only.
22. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimension at maximum material condition. Minimum space between
protrusion and adjacent lead is 0.07mm (0.0027 inch).
23. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.
However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
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12
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