Single-chip Type with built-in FET Switching Regulator Series Simple Step-down Switching Regulators with Built-in Power MOSFET No.10027EAT43 BD9859EFJ ●Summary Output 3.0A and below High Efficiency Rate Step-down Switching Regulator Power MOSFET Internal Type BD9859EFJ mainly used as secondary side Power supply, for example from fixed Power supply of 9V, 12V etc, Step-down Output of 1.2V/1.8V/3.3V/5V, etc, can be produced. This IC has external Coil/Capacitor down-sizing through 750kHz High Frequency operation, inside Nch-FET SW for 15V “withstand-pressure” commutation and also, High Speed Load Response through Current Mode Control is a simple external setting Phase compensation System, through a wide range external constant, a compact Power supply can be produced easily. ●Features 1) 2) 3) 4) 5) 6) 7) 8) Internal 100 mΩ Nch MOSFET Output Current 3A Oscillation Frequency 750kHz Feedback Voltage 1.0V±1.0% Internal Soft Start Function Internal Over Current Protect Circuit, Low Input Error Prevention Circuit, Heat Protect Circuit ON/OFF Control through EN Pin (Standby Current 0μA Typ.) Package :HTSOP-J8 Package ●Uses For Household machines in general that have 9V/12V Lines, etc. ●Operating Conditions (Ta=25℃) Item Symbol Voltage Range Unit Power supply Voltage VCC 5.0～14 V Output Voltage VOUT 1.0 V ●Absolute Maximum Rating Item Symbol Rating Unit Maximum Application Power supply Voltage VCC 15 V Between BST – GND VBST 22 V Between BST – Lx ⊿VBST 7 V Between EN – GND VEN 15 V Between Lx – GND VLx 15 V Between FB – GND VFB 7 V Between VC – GND VC 7 V Highside NchFET Drain Current IDH 3 A Power Dissipation Pd 3.76 W Operating Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -55～+150 ℃ Junction Temperature Tjmax 150 ℃ (*1)During mounting of 70×70×1.6t mm 4layer board (Copper area：70mm×70mm).Reduce by 30.08mW for every 1℃ increase. (Above 25℃) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 1/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Electrical Characteristics (Unless otherwise specified, Ta=25℃，VCC=12V, Vo=5V,EN=3V) Item Symbol Min Rating Value Typ Max Unit Conditions 【Circuit Current】 Circuit Current during Standby Ist － 0 10 uA VEN=0V Circuit Current during Operation Icc － 2.8 5.6 mA FB=1.2V 【Low Voltage Input Error Prevention Circuit】 Detect Threshold Voltage Vuv 4.2 4.4 4.6 V Vuvhy - 200 400 mV fosc 675 750 825 kHz Dmax 75 85 95 % FB Pin Threshold Voltage VFB 0.990 1.000 1.010 V FB Pin Input Current IFB -1.0 0 1.0 uA Hysteresis Width 【Oscillator】 Oscillation Frequency Max Duty Cycle 【Error Amp】 Mutual Conductance Gm 70 140 280 uA/V Soft Start Time Tsoft 2.0 4.0 6.0 ms High Side Nch FET ON Resistance RonH － 100 200 mΩ Nch FET ON Resistance for Pre-Charge RonL － 5 10 Ω Over Current Detect Current Iocp 3.5 5.5 － A ON VENON 2.0 － 14 V OFF VENOF F -0.3 － 0.3 V REN 2.5 7.5 15 uA VFB=0V IVC=±10uA,VC=1.5V 【Output-part】 【CTL】 EN Pin Threshold Voltage EN Pin Input Current VEN=3V ◎Not designed to withstand radiation. ●Pin Description Pin No. Pin Name Function 1 Lx 2 GND 3 VC Error Amp Output Pin 4 FB Output Voltage Return Pin 5 EN ON/OFF Control Pin NMOSFET Source Pin Ground Pin 6 BST Capacitor Connection Pin for Bootstrap 7 VCC Power supply Voltage Pin 8 VCC Power supply Voltage Pin Fig.1 Pin Layout Diagram www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 2/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Block Diagram ON/OFF EN VCC TSD UVLO Reference REG VREF ICOMP shutdown FB 1.0V BST Σ ERROR - AMP + + R Q S 100mΩ Lx Soft Start VOUT 5Ω GND OSC 750kHz VC Fig.2 Block Diagram www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 3/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Block Description 1. Reference This Block generates Error Amp Standard Voltage. Standard Voltage is 1.0V. 2. REG This is a Gate Drive Voltage Generator and 5VLow Saturation regulator for internal Circuit Power supply. 3. OSC This is a precise wave Oscillation Circuit with Operation Frequency fixed to 750kHz fixed. 4. Soft Start A Circuit that does Soft Start to the Output Voltage of DC／DC Comparator, and prevents Rush Current during Start-up. Soft Start Time is set at IC internal, after 4mSecs from starting-up EN Pin, Standard Voltage comes to 1.0V, and Output Voltage becomes set Voltage. 5. ERROR AMP This is an Error amplifier what detects Output Signal, and outputs PWM Control Signal. Internal Standard Voltage is set to 1.0V. Also, C and R are connected between the Output (VC) Pin GND of Error Amp as Phase compensation elements. (See Page11) 6. ICOMP This is a Voltage-Pulse Width Converter that controls Output Voltage in response to Input Voltage. This compares the Voltage added to the internal SLOPE waveform in response to the FET WS Current with Error amplifier Output Voltage, controls the width of Output Pulse and outputs to Driver. 7. Nch FET SW This is an internal commutation SW that converts Coil Current of DC/DC Comparator. It contains 15V”withstand pressure” 100mΩSW. Because the Current Rating of this FET is 3.0A, including Ripple Current of DC Current+Coil, please use at within 3.0A 8. UVLO This is a Low Voltage Error Prevention Circuit. This prevents internal circuit error during increase of Power supply Voltage and during decline of Power supply Voltage. It monitors VCC Pin Voltage and internal REG Voltage、And when VCC Voltage becomes 4.4V and below, it turns OFF all Output FET and turns OFF DC／DC Comparator Output, and Soft Start Circuit resets. Now this Threshold has Hysteresis of 200mV. 9. TSD This is a Heat Protect (Temperature Protect) Circuit. When it detects an abnormal temperature exceeding Maximum Junction Temperature (Tj=150℃), it turns OFF all Output FET, and turns OFF DC/DC Comparator Output. When Temperature falls, it has/with Hysteresis and automatically returns. 10. EN With the Voltage applied to EN Pin(5pin), IC ON／OFF can be controlled. When a Voltage of 2.0V or more is applied, it turns ON, at Open or 0V application, it turns OFF. About 400kΩ Pull-down Resistance is contained within the Pin. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 4/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Reference Data (Unless otherwise specified, Ta=25℃，VCC=12V, Vo=5V,EN=3V) 6 6 0.5 5 5 0.4 4 0.3 0.2 VCC=14V 0.0 -60 VCC=7V -40 -20 0 3 2 VCC=12V 0.1 Temp=85℃ Temp=25℃ 20 40 60 80 100 VCC=12V 3 2 Temp=-40℃ VCC=7V VCC=5V 1 1 0 0 Temp (°C) VCC=15V 4 ICC(mA) ICC(mA) ICC (uA) 0.6 0 5 10 VCC(V) -60 -40 -20 0 20 40 60 Temperature(°C) 15 80 100 Fig.3. Standby Current Temperature Fig.4. Circuit Current Power supply Voltage Fig.5. Circuit Current Characteristics Characteristics Temperature Characteristics 6.0 800 High Threshold Low Threshold 3.0 2.0 1.0 0.0 -60 VCC=14V 600 VCC=12V VCC=7V 500 Max_Duty (%) 4.0 OSC_freq (KHz) UVLO_th (V) 5.0 120.0 700 400 300 200 100.0 80.0 VCC=14V VCC=12V VCC=7V 60.0 100 -40 -20 0 20 40 60 80 0 -60 100 -40 -20 Temp (°C) 0 20 40 60 80 40.0 -60 100 -40 -20 Temp (°C) 0 20 40 60 80 Fig.6. UVLO Threshold Fig.7. Oscillation Frequency Fig.8. Max Duty Temperature Temperature Characteristics Temperature Characteristics Characteristics 1.2 1.2 1.0 1.0 100 Temp (°C) 50 40 0.8 0.6 0.4 0.4 0.2 0.0 -60 0.0 -20 0 20 40 60 80 100 Temp (°C) Fig.9. FB Threshold Voltage Temperature Characteristics www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ Temp=25°C 20 0.6 0.2 -40 Temp=85°C Temp=25°C Temp=-40°C I_VC (uA) VCC=12V VCC=7V VFB (V) VFB (V) 0.8 Temp=-40°C 30 VCC=14V 10 Temp=85°C 0 -10 -20 -30 -40 -50 0 5 10 15 VCC (V) Fig.10. FB Threshold Power supply Characteristics 5/15 0 0.5 1 1.5 2 VFB (V) Fig.11. FB Voltage - IVC Current Characteristics 2010.02 - Rev.A Technical Note BD9859EFJ 6.0 360 1 00 Temp=-40°C 300 5.0 Temp=25°C 3.0 VCC=14V VCC=12V VCC=7V 2.0 Ta=25℃ 60 40 -20 0 20 40 60 80 Temp=85°C 180 120 60 0 0 -40 240 Ta=-40℃ 20 1.0 0.0 -60 Ta=85℃ I_LX (mA) 4.0 △ VCC-VLx[mV] SS_Time (ms) 80 100 0 20 0 40 0 Temp (°C) 60 0 800 0 1 00 0 2 4 6 8 10 12 V_LX (V) ILx[mA] Fig.12. Soft Start Time Temperature Fig.13. Nch FET ON Resistance Fig.14. Pre-charge FET ON Resistance Characteristics Temperature Characteristics Temperature Characteristics 10.0 VCC=12V 6.0 VEN_th (V) Iocp (A) 8.0 VCC=14V VCC=8V 4.0 12.0 2.0 10.0 1.6 8.0 1.2 0.8 0.4 2.0 0.0 -60 2.4 REN (uA) 12.0 -40 -20 0 20 40 60 80 100 0.0 -60 -40 -20 0 20 40 60 80 100 Temp (°C) Fig.15 OCP Detect Current Fig.16. EN Threshold Temperature Temperature Characteristics Characteristics www.rohm.com 4.0 2.0 Temp (°C) c 2010 ROHM Co., Ltd. All rights reserved. ○ 6.0 6/15 0.0 -60 -40 -20 0 20 40 60 80 100 Temp (°C) Fig.17. EN Pin Influx Current 2010.02 - Rev.A Technical Note BD9859EFJ ●Example of Reference Application Circuit (Input 12V, Output 5.0V/ 2.5A) CBST 0.022 uF JEN VBAT 0 Ω SW CBAT 22 uF/ 16V GRM31CB31C226KE15 (murata) 4.7 uH (FDV0630 - 4R7M) VCC VCC BST EN Lx GND VC FB REN 0Ω CEN open EN 10 uF/ 6.3V GRM219B30J106KE18 (murata) L VOUT COUT CC2 RFRA 0Ω RINV1 120 kΩ RINV2 30 kΩ 1000 pF RC open 7.5 kΩ RSX301-LA30 (ROHM) (Example of Reference Application Circuit) Transformation Efficiency η [%] ●Reference Application Data CC1 D 100.0 80.0 VCC=7V VCC=10V 60.0 VCC=12V VCC=14V 40.0 20.0 0.0 0 500 1000 1500 2000 2500 3000 Load Current Io [mA] Fig.19 Electric Power Conversion www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 7/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Reference Application Data (Example of Reference Application Circuit) Gain [dB] Phase [deg] 40 90 Gain [dB] Phase [deg] 40 90 Phase Phase Gain 0 -40 100 10k Frequency[kHz] Gain 0 0 -90 -40 1M 100 Phase 0 -90 10k Gain Frequency[kHz] 1M Fig.20 Frequency Response Fig.21 Frequency Response Fig.22 Load Response Characteristics Characteristics（Io=1.5A） Characteristics （Io=3.0A） （Io=0A→3A） Fig.23 Load Response Characteristics Fig.24 Operation Waveform Fig.25 Stop Waveform （Io=3A→0A） www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 8/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Evaluation Board Pattern (Reference) VOUT Lx VBAT GND Fig.26 Evaluation Board Pattern ・ ・ Please make the Heat radiation plate of the Bottom layer to a plane of Low Impedance. Because large currents low into the lines of VCC, Lx, PGND, please make the patterns as thick as much as possible. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 9/15 2010.02 - Rev.A Technical Note BD9859EFJ ●Application Components Selection Method (1)Inductor Something of the shield Type that Fulfills the Current Rating (Current value Ipecac below), with low DCR (Direct Current Resistance element) is recommended. Value of Inductor influences Inductor Ripple Current and becomes the cause of Output Ripple. In the same way as the formula below, this Ripple Current can be made small for as big as the L value of Coil or as high as the Switching Frequency. Ipeak =Iout ＋ ⊿IL/2 [A] ⊿IL= Vin-Vout × Vout (1) × Vin L 1 [A] Δ IL (2) Fig.27 Inductor Current f (η：Efficiency、⊿IL：Output Ripple Current、f：Switching Frequency ) For design value of Inductor Ripple Current, please carry out design tentatively with about 20％～50% of Maximum Input Current. ※When current that exceeds Coil rating flows to the coil, the Coil causes a Magnetic Saturation, and there are cases wherein a decline in efficiency, oscillation of output happens. Please have sufficient margin and select so that Peak Current does not exceed Rating Current of Coil. (2)Output Capacitor In order for Capacitor to be used in Output to reduce Output Ripple, Low Ceramic Capacitor of ESR is recommended. Also, for Capacitor Rating, on top of putting into consideration DC Bias Characteristics, please use something whose Maximum Rating has sufficient margin with respect to the Output Voltage. Output Ripple Voltage is looked for using the following formula. Vpp=⊿IL× 1 2π×f×Co ＋ ⊿IL×RESR [V] ・・・ (3) Please design in a way that it is held within Capacity Ripple Voltage. (3)Output Voltage Setting ERROR AMP internal Standard Voltage is 1.0V.Output Voltage is determined as seen in (4) formula. VOUT ERROR AMP R1 FB Vo= R2 (R1+R2) R2 ×1.0 [V] ・・・ (4) VREF 1.0V Fig.28 Voltage Return Resistance Setting Method (4)Boost Capacitor Please connect CBST=0.022uF(Laminate Ceramic Capacitor) between BST Pin－Lx Pins as Output capacitors of Gate Drive Voltage Generator REG(5V). www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 10/15 2010.02 - Rev.A Technical Note BD9859EFJ (5)About Adjustment of DC/DC Comparator Frequency Characteristics Role of Phase compensation element CC1､CC2,RC (See P.7Example of Reference Application Circuit) Stability and Responsiveness of Loop are controlled through VC Pin which is the output of Error Amp. The combination of zero and ball that determines Stability and Responsiveness is adjusted by the combination of resistor and capacitor that are connected in series to the VC Pin. DC Gain of Voltage Return Loop can be calculated for using the following formula. Adc Rl Gcs A EA V FB Vout Here, VFB is Feedback Voltage(1.0V).AEA is Voltage Gain of Error amplifier(typ : 60dB), Gcs is the Trans-conductance of Current Detect(typ : 6A/V), and Rl is the Output Load Resistance value. There are 2 important balls in the Control Loop of this DC/DC. The first occurs with/ through the output resistance of Phase compensation Capacitor (CC1) and Error amplifier. The other one occurs with/through the Output Capacitor and Load Resistor. These balls appear in the frequency written below. fp1 GEA 2π CC1 AEA fp2 1 2π COUT Rl Here、GEA is the trans-conductance of Error amplifier(typ : 140uA/V). Here、in this Control Loop, one zero becomes important. With the zero which occurs because of Phase compensation Capacitor CC1 and Phase compensation Resistor RC, the Frequency below appears. fz1 1 2π CC1 RC Also, if Output Capacitor is big, and that ESR (RESR) is big, in this Control Loop, there are cases when it has an important, separate zero (ESR zero). This ESR zero occurs due to ESR of Output Capacitor and Capacitance, and exists in the Frequency below. fzESR 1 2π COUT RESR (ESR zero) In this case, the 3rd ball determined with the 2nd Phase compensation Capacitor (CC2) and Phase Correction Resistor (RC) is used in order to correct the ESR zero results in Loop Gain. This ball exists in the frequency shown below. fp3 1 2π CC2 RC (Ball that corrects ESR zero) The target of Phase compensation design is to create a communication function in order to acquire necessary band and Phase margin. Cross-over Frequency (band) at which Loop gain of Return Loop becomes “0” is important. When Cross-over Frequency becomes low, Power supply Fluctuation Response, Load Response, etc worsens. On the other hand, when Cross-over Frequency is too high, instability of the Loop can occur. Tentatively, Cross-over Frequency is targeted to be made 1/20 or below of Switching Frequency. www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 11/15 2010.02 - Rev.A Technical Note BD9859EFJ Selection method of Phase Compensation constant is shown below. 1. Phase Compensation Resistor (RC) is selected in order to set to the desired Cross-over Frequency. Calculation of RC is done using the formula below. RC 2π COUT fc Vout 2π COUT 0.1 fs Vout ＜ GEA GCS VFB GEA GCS VFB Here, fc is the desired Cross-over Frequency. It is made about 1/20 and below of the Normal Switching Frequency (fs). 2. Phase compensation Capacitor (CC1) is selected in order to achieve the desired phase margin. In an application that has a representative Inductance value (about several uH～20uH), by matching zero of compensation to 1/4 and below of the Cross-over Frequency, sufficient Phase margin can be acquired.CC1 can be calculated using the following formula. CC1＞ 4 2π RC fc RC is Phase compensation Resistor. 3. Examination whether the second Phase compensation Capacitor CC2 is necessary or not is done. If the ESR zero of Output Capacitor exists in a place that is smaller than half of the Switching Frequency, a second Phase compensation Capacitor is necessary. In other words, it is the case wherein the formula below happens. 1 fs ＜ 2π COUT RESR 2 In this case, add the second Phase compensation Capacitor CC2, and match the frequency of the third ball to the Frequency fp3 of ESR zero. CC2 is looked for using the following formula. CC2 COUT RESR RC www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ 12/15 2010.02 - Rev.A Technical Note BD9859EFJ ●I/O Equivalent Schematic Pin. No Pin Name 1 Lx 2 GND 6 BST 7 VCC 8 VCC Pin. No Pin Equivalent Schematic Pin Name VCC 4 FB FB GND VCC VCC VC 3 Pin Equivalent Schematic VC 5 GND www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ EN EN GND 13/15 2010.02 - Rev.A Technical Note BD9859EFJ ～ ～ ●Cautions for Use (1)About Absolute Maximum Rating When the absolute maximum ratings of application voltage, operating temperature range, etc. was exceeded, there is possibility of deterioration and destruction. Also, the short Mode or open mode, etc. destruction condition cannot be assumed. When the special mode where absolute maximum rating is exceeded is assumed, please give consideration to the physical safety countermeasure for the fuse, etc. (2)About GND Electric Potential In every state, please make the electric potential of GND Pin into the minimum electrical potential. Also, include the actual excessive effect, and please do it such that the pins, excluding the GND Pin does not become the voltage below GND. (3)About Heat Design Consider the Power Dissipation (Pd) in actual state of use, and please make Heat Design with sufficient margin. (4)About short circuit between pins and erroneous mounting When installing to set board, please be mindful of the direction of the IC, phase difference, etc. If it is not installed correctly, there is a chance that the IC will be destroyed. Also, if a foreign object enters the middle of output, the middle of output and power supply GND, etc., even for the case where it is shorted, there is a change of destruction. (5)About the operation inside a strong electro-magnetic field When using inside a strong electro-magnetic field, there is a possibility of error, so please be careful. (6)Temperature Protect Circuit (TSD Circuit) Temperature Protect Circuit(TSD Circuit) is built-in in this IC. As for the Temperature Protect Circuit (TSD Circuit), because it a circuit that aims to block the IC from insistent careless runs, it is not aimed for protection and guarantee of IC. Therefore, please do not assume the continuing use after operation of this circuit and the Temperature Protect Circuit operation. (7)About checking with Set boards When doing examination with the set board, during connection of capacitor to the pin that has low impedance, there is a possibility of stress in the IC, so for every 1 process, please make sure to do electric discharge. As a countermeasure for static electricity, in the process of assembly, do grounding, and when transporting or storing please be careful. Also, when doing connection to the jig in the examination process, please make sure to turn off the power supply, then connect. After that, turn off the power supply then take it off. (8)About common impedance For the power supply and the wire of GND, lower the common impedance, then, as much as possible, make the ripple smaller (as much as possible make the wire thick and short、and lower the ripple from L・C), etc., then and please consider it sufficiently. (9)In the application, when the mode where the VCC and each pin electrical potential becomes reversed exists, there is a possibility that the internal circuit will become damaged. For example、during cases wherein the condition when charge was given in the external capacitor、 and the VCC was shorted to GND, it is recommended to insert the bypass diode to the diode of the back current prevention in the VCC series or the middle of each Pin-VCC. (10)About High-side NchFET Please use within 3A containing ripple current, because the absolute maximum rating of high-side NchFET is 3A. (11)About over current detection The detecting current is the current flowing through high-side NchFET. Output current containing ripple current, therefore the detecting current is the current of the output current containing ripple current. (12)About IC Pin Input This IC is a Monolithic IC、and between each element, it hasＰ＋isolation for element separation and P board. With the N layer of each element and this , the P－N junction is formed、and the parasitic element of each type is composed. For example、like the diagram below、when resistor and transistor is connected to Pin, ○When GND＞(PinＡ) in Resistor、 when GND＞(PinＡ)、when GND＞(Pin B) in Transistor (NPN), the P－N junction will operate as a parasitic diode. ○Also, during GND＞(Pin B) in the Transistor (NPN), through the N layer of the other elements connected to the above-mentioned parasitic diode , the parasitic NPN Transistor will operation. On the composition of IC, depending on the electrical potential, the parasitic element will become necessary. Through the operation of the parasitic element interference of circuit operation will arouse, and error, therefore destruction can be caused. Therefore please be careful about the applying of voltage lower than the GND (P board) in I/O Pin, and the way of using when parasitic element operating. Transistor (NPN) Resistor B (Pin B) E C (Pin A) P＋ N P N P Substrate P＋ P＋ N GND P N Ｎ GND Parasitic Element Fig.29 Example of simple structure of Bipolar IC www.rohm.com N P Substrate Parasitic Element c 2010 ROHM Co., Ltd. All rights reserved. ○ (Pin A) P＋ ～ ～ N 14/15 GND 2010.02 - Rev.A Technical Note BD9859EFJ ●ORDER MODEL NAME B D 9 Device 8 5 9 E Debice Name F J Package type HFN : HTSOP-J8 - E 2 Taping model name E2: Reel-shape emboss taping MSOP8 <Tape and Reel information> 2.8±0.1 4.0±0.2 8 7 6 5 0.6±0.2 +6° 4° −4° 0.29±0.15 2.9±0.1 (MAX 3.25 include BURR) Tape Embossed carrier tape Quantity 3000pcs Direction of feed TR The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1 2 3 4 1PIN MARK 1pin +0.05 0.145 −0.03 0.475 0.08±0.05 0.75±0.05 0.9MAX S +0.05 0.22 −0.04 0.08 S Direction of feed 0.65 (Unit : mm) www.rohm.com c 2010 ROHM Co., Ltd. All rights reserved. ○ Reel 15/15 ∗ Order quantity needs to be multiple of the minimum quantity. 2010.02 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2010 ROHM Co., Ltd. All rights reserved. R1010A