TI LM358PSRE4 Dual operational amplifier Datasheet

LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
D
D
D
D
D
1OUT
1IN−
1IN+
GND
1
8
2
7
3
6
4
5
VCC
2OUT
2IN−
2IN+
LM158, LM158A . . . FK PACKAGE
(TOP VIEW)
NC
1IN−
NC
1IN+
NC
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
2OUT
NC
2IN−
NC
NC
GND
NC
2IN+
NC
D
− Single Supply . . . 3 V to 32 V
(26 V for LM2904)
− or Dual Supplies . . . +1.5 V to +16 V
(+13 V for LM2904)
Low Supply-Current Drain, Independent of
Supply Voltage . . . 0.7 mA Typ
Common-Mode Input Voltage Range
Includes Ground, Allowing Direct Sensing
Near Ground
Low Input Bias and Offset Parameters:
− Input Offset Voltage . . . 3 mV Typ
A Versions . . . 2 mV Typ
− Input Offset Current . . . 2 nA Typ
− Input Bias Current . . . 20 nA Typ
A Versions . . . 15 nA Typ
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . 32 V
(26 V for LM2904)
Open-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
Internal Frequency Compensation
LM158, LM158A . . . JG PACKAGE
LM258, LM258A . . . D, DGK, OR P PACKAGE
LM358 . . . D, DGK, P, PS, OR PW PACKAGE
LM358A . . . D, DGK, P, OR PW PACKAGE
LM2904 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
NC
1OUT
NC
V CC+
NC
D Wide Supply Range:
description/ordering information
NC − No internal connection
These devices consist of two independent,
high-gain frequency-compensated operational
amplifiers designed to operate from a single
supply over a wide range of voltages. Operation from split supplies also is possible if the difference between
the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and VCC is at least 1.5 V more positive than the
input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply
voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,
these devices can be operated directly from the standard 5-V supply used in digital systems and easily can
provide the required interface electronics without additional ±5-V supplies.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
ORDERING INFORMATION{
TA
VIOmax
AT 25°C
MAX
TESTED
VCC
PDIP (P)
30 V
LM358P
Tube of 75
LM358D
Reel of 2500
LM358DR
Reel of 2500
LM358DRG3
Reel of 2000
LM358PSR
Tube of 150
LM358PW
Reel of 2000
LM358PWR
Reel of 2000
LM358PWRG3
MSOP/VSSOP (DGK)
Reel of 2500
LM358DGKR
M5_§
PDIP (P)
Tube of 50
LM358AP
LM358AP
Tube of 75
LM358AD
Reel of 2500
LM358ADR
Tube of 150
LM358APW
Reel of 2000
LM358APWR
MSOP/VSSOP (DGK)
Reel of 2500
LM358ADGKR
M6_§
PDIP (P)
Tube of 50
LM258P
LM258P
Tube of 75
LM258D
Reel of 2500
LM258DR
Reel of 2500
LM258DRG3
MSOP/VSSOP (DGK)
Reel of 2500
LM258DGKR
M2_§
PDIP (P)
Tube of 50
LM258AP
LM258AP
Tube of 75
LM258AD
Reel of 2500
LM258ADR
MSOP/VSSOP (DGK)
Reel of 2500
LM258ADGKR
M3_§
PDIP (P)
Tube of 50
LM2904P
LM2904P
Tube of 75
LM2904D
Reel of 2500
LM2904DR
Reel of 2500
LM2904DRG3
Reel of 2000
LM2904PSR
Tube of 150
LM2904PW
Reel of 2000
LM2904PWR
Reel of 2000
LM2904PWRG3
MSOP/VSSOP (DGK)
Reel of 2500
LM2904DGKR
MB_§
SOIC (D)
Reel of 2500
LM2904VQDR
L2904V
TSSOP (PW)
Reel of 2000
LM2904VQPWR
L2904V
SOIC (D)
Reel of 2500
LM2904AVQDR
L2904AV
TSSOP (PW)
Reel of 2000
LM2904AVQPWR
L2904AV
CDIP (JG)
Tube of 50
LM158JG
LM158JG
LCCC (FK)
Tube of 55
LM158FK
LM158FK
CDIP (JG)
Tube of 50
LM158AJG
LM158AJG
LCCC (FK)
Tube of 55
LM158AFK
LM158AFK
SOP (PS)
TSSOP (PW)
0°C
0
C to 70°C
70 C
SOIC (D)
3 mV
30 V
TSSOP (PW)
5 mV
30 V
−25°C
25 C to 85°C
85 C
3 mV
30 V
SOIC (D)
SOIC (D)
SOIC (D)
7 mV
26 V
−40°C
40 C to 125
125°C
C
SOP (PS)
TSSOP (PW)
7 mV
2 mV
32 V
32 V
5 mV
30 V
2 mV
30 V
−55°C
55°C to 125°C
TOP-SIDE
MARKING
Tube of 50
SOIC (D)
7 mV
ORDERABLE
PART NUMBER
PACKAGE}
†
LM358P
LM358
L358
L358
LM358A
L358A
LM258
LM258A
LM2904
L2904
L2904
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
§
The actual top-side marking has one additional character that designates the wafer fab/assembly site.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
symbol (each amplifier)
IN+
+
−
IN−
OUT
schematic (each amplifier)
VCC+
≈6-µA
Current
Regulator
≈6-µA
Current
Regulator
≈100-µA
Current
Regulator
OUT
IN−
≈50-µA
Current
Regulator
IN+
GND (or VCC−)
To Other Amplifier
COMPONENT COUNT
Epi-FET
Diodes
Resistors
Transistors
Capacitors
4
POST OFFICE BOX 655303
1
2
7
51
2
• DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
LM158, LM158A
LM258, LM258A
LM358, LM358A
LM2904V
±16 or 32
Supply voltage, VCC (see Note 1)
±32
Differential input voltage, VID (see Note 2)
LM2904
±13 or 26
V
±26
V
V
Input voltage, VI (either input)
−0.3 to 32
−0.3 to 26
Duration of output short circuit (one amplifier) to ground
at (or below) 25°C free-air temperature (VCC ≤ 15 V) (see Note 3)
Unlimited
Unlimited
D package
97
97
172
172
P package
85
85
PS package
95
95
PW package
149
149
FK package
5.61
JG package
14.5
DGK package
Package thermal impedance, qJA (see Notes 4 and 5)
impedance qJC (see Notes 6 and 7)
Package thermal impedance,
Operating free-air
free air temperature range,
range TA
LM158, LM158A
−55 to 125
LM258, LM258A
−25 to 85
LM358, LM358A
0 to 70
LM2904
Operating virtual junction temperature, TJ
−40 to 125
150
Case temperature for 60 seconds
FK package
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds
JG package
Storage temperature range, Tstg
300
°C/W
C/W
°C/W
°C
−40 to 125
150
°C
°C
260
−65 to 150
UNIT
300
°C
−65 to 150
°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground
terminal.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/qJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
LM158
LM258
TA‡
TEST CONDITIONS†
MIN
VIO
Input offset voltage
aV
Average temperature
coefficient of
input offset voltage
IO
IIO
Input offset current
aI
Average temperature
coefficient of
input offset current
IO
IIB
VICR
C
VOH
Input bias current
Common mode
Common-mode
input voltage range
High level
High-level
output
p voltage
g
VCC = 5 V to MAX,
VIC = VICR(min),
VO = 1.4 V
VO = 1.4
14V
2
10
25°C
−20
3
7
9
30
2
10
−150
−20
0 to
VCC − 2
0 to
VCC − 2
VCC − 1.5
VCC − 1.5
RL ≥ 10 kΩ
Full range
27
Full range
−250
5
27
20
100
V
28
5
25
nA
V
26
28
nA
pA/°C
−500
0 to
VCC − 1.5
26
50
150
0 to
VCC − 1.5
Full range
µV/°C
7
−300
RL = 2 kΩ
Crosstalk attenuation
MAX
100
Full range
25°C
VO1/VO2
Output current
25°C
25°C
Supply-voltage
rejection ratio
(∆VDD/∆VIO)
IO
7
RL ≥ 2 kΩ
kSVR
UNIT
TYP§
7
Full range
RL ≥ 10 kΩ
VCC = 15 V,
VO = 1 V to 11 V
V,
RL ≥ 2 kΩ
VCC = 5 V to MAX,
VIC = VICR(min)
MIN
mV
Full range
Large-signal
differential
voltage amplification
Common-mode
rejection ratio
CMRR
5
Full range
VCC = 5 V to MAX
RL ≤ 10 kΩ
AVD
3
Full range
Low-level
output voltage
VOL
MAX
25°C
25°C
VCC = MAX
TYP§
Full range
VO = 1.4
14V
LM358
20
mV
25°C
50
100
Full range
25
25°C
70
80
65
80
dB
VCC = 5 V to MAX
25°C
65
100
65
100
dB
f = 1 kHz to 20 kHz
25°C
120
dB
VCC = 15 V,
VID = 1 V,
V
VO = 0
25°C
−20
Full range
−10
V/mV
15
120
−30
−20
−30
Source
IO
Output current
VCC = 15 V,
Sink
VID = −1
1 V,
V
VO = 15 V
VID = −1 V, VO = 200 mV
IOS
Short-circuit
output current
VCC at 5 V, GND at −5 V,
VO = 0
ICC
Supply current
(two amplifiers)
−10
mA
25°C
10
Full range
5
25°C
12
25°C
±40
±60
±40
±60
VO = 2.5 V, No load
Full range
0.7
1.2
0.7
1.2
VCC = MAX, VO = 0.5 V,
No load
Full range
1
2
1
2
†
20
10
20
5
30
12
µA
30
mA
mA
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for the LM2904 and 30 V for others.
‡ Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
§ All typical values are at T = 25°C.
A
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS†
TA‡
LM2904
MIN
25°C
VIO
aV
IO
Input offset voltage
VCC = 5 V to MAX,
VIC = VICR(min),
VO = 1.4 V
Non A devices
Non-A
Average temperature coefficient
of input offset voltage
Non V device
Non-V
IIO
Input offset current
VO = 1.4
14V
IO
Average temperature coefficient
of input offset current
IIB
Input bias current
VICR
Common
mode input voltage
Common-mode
range
14V
VO = 1.4
VOL
High-level
High
level output voltage
Low-level output voltage
Full range
7
25°C
2
Full range
2
10
25°C
−20
25°C
22
Full range
23
VCC = MAX,
V-suffix device
RL = 2 kΩ
Full range
26
RL ≥ 10 kΩ
Full range
27
28
25°C
25
100
Full range
15
Non-V device
25°C
50
80
V-suffix device
25°C
65
80
65
100
Full range
CMRR
Common mode rejection ratio
Common-mode
VCC = 5 V to MAX,
VIC = VICR(min)
kSVR
Supply-voltage rejection ratio
(∆VDD/∆VIO)
VCC = 5 V to MAX
25°C
VO1/VO2
Crosstalk attenuation
f = 1 kHz to 20 kHz
25°C
VCC = 15 V,
VID = 1 V, VO = 0
25°C
−20
Full range
−10
25°C
10
Full range
5
IOS
Short-circuit output current
ICC
Supply current (two amplifiers)
−250
24
5
VCC = 15 V, VO = 1 V to 11 V,
RL ≥ 2 kΩ
VID = −1
1 V,
VO = 200 mV
pA/°C
nA
V
Full range
Large signal differential
Large-signal
voltage amplification
Output current
nA
VCC − 1.5
AVD
IO
50
0 to
VCC − 2
RL ≥ 10 kΩ
VCC = 15 V,
VID = −1
1 V,
V
VO = 15 V
50
0 to
VCC − 1.5
RL = 2 kΩ
Source
mV
µV/°C
−500
VCC = MAX,
Non-V device
RL ≤ 10 kΩ
2
150
Full range
Full range
7
300
Full range
VCC = 5 V to MAX
UNIT
4
Full range
RL ≥ 10 kΩ
VOH
1
Full range
25°C
MAX
10
25°C
V suffix device
V-suffix
aI
3
Full range
25°C
A suffix devices
A-suffix
TYP§
V
20
mV
V/mV
dB
dB
120
dB
−30
mA
mA
20
mA
Sink
Non-V device
25°C
V-suffix device
25°C
mA
30
12
µA
A
40
25°C
±40
±60
VO = 2.5 V, No load
Full range
0.7
1.2
VCC = MAX, VO = 0.5 V, No load
Full range
1
2
VCC at 5 V, GND at −5 V, VO = 0
mA
mA
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others.
‡ Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
§ All typical values are at T = 25°C.
A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
VIO
Input offset voltage
aV
Average
temperature
coefficient of
input offset voltage
IO
IIO
Input offset current
aI
Average
temperature
coefficient of
input offset current
IO
IIB
Input bias current
VICR
C
Common mode
Common-mode
input voltage range
VOH
VOL
AVD
CMRR
High-level
High
level
output voltage
VCC = 5 V to 30 V,
VIC = VICR(min),
VO = 1.4 V
VO = 1.4
14V
VO = 1.4
14V
Crosstalk
attenuation
Output current
IOS
Short-circuit output
current
ICC
Supply current (two
amplifiers)
Full range
4
MIN
TYP§
MAX
2
3
UNIT
mV
4
Full range
7
15*
7
15
25°C
2
10
2
15
30
30
Full range
10
200
10
200
25°C
−15
−50
−15
−80
−100
−100
25°C
0 to
VCC − 1.5
0 to
VCC − 1.5
Full range
0 to
VCC − 2
0 to
VCC − 2
VCC − 1.5
VCC − 1.5
25°C
RL = 2 kΩ
Full range
26
RL ≥ 10 kΩ
Full range
27
VCC = 15 V,
VO = 1 V to 11 V
V,
RL ≥ 2 kΩ
LM258A
MAX
2
RL ≥ 2 kΩ
Large-signal
differential
voltage amplification
Common-mode
rejection ratio
VO1/VO2
TYP§
25°C
VCC = 30 V
VCC = 30 V
LM158A
MIN
Full range
RL ≤ 10 kΩ
Supply-voltage
rejection ratio
(∆VDD/∆VIO)
TA‡
Full range
Low-level
output voltage
kSVR
IO
TEST CONDITIONS†
Full range
5
27
20
100
pA/°C
nA
V
28
5
50
nA
V
26
28
µV/°C
20
mV
25°C
50
100
Full range
25
25°C
70
80
70
80
dB
25°C
65
100
65
100
dB
120
dB
V/mV
f = 1 kHz to 20 kHz
25°C
VCC = 15 V,
VID = 1 V,
V
VO = 0
25°C
−20
Full range
−10
25
120
−30
−60
−20
−30
−60
Source
−10
mA
VCC = 15 V,
Sink
VID = −1
1 V,
V
VO = 15
VID = −1 V, VO = 200 mV
25°C
10
Full range
5
25°C
12
VCC at 5 V, GND at −5 V,
VO = 0
25°C
±40
±60
±40
±60
VO = 2.5 V, No load
Full range
0.7
1.2
0.7
1.2
VCC = MAX, VO = 0.5 V,
No load
Full range
1
2
1
2
20
10
20
5
30
12
µA
30
mA
mA
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
† All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V
CC for
testing purposes is 26 V for LM2904 and 30 V for others.
‡ Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
§ All typical values are at T = 25°C.
A
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
TEST CONDITIONS†
PARAMETER
VCC = 5 V to 30 V,
VIC = VICR(min), VO = 1.4 V
VIO
Input offset voltage
aV
Average temperature coefficient of
input offset voltage
IO
IIO
Input offset current
aI
Average temperature coefficient of
input offset current
IO
IIB
VO = 1.4
14V
Input bias current
TA‡
25°C
VOL
Low-level output voltage
3
5
7
20
25°C
2
30
75
Full range
10
300
25°C
−15
−100
Full range
VCC = 30 V
RL ≥ 2 kΩ
High-level
High
level output voltage
2
Full range
Full range
VOH
MAX
Full range
VO = 1.4
14V
Common mode input voltage range
Common-mode
TYP§
Full range
25°C
VICR
LM358A
MIN
25°C
VCC = 30 V
−200
0 to
VCC − 1.5
µV/°C
nA
pA/°C
nA
VCC − 1.5
Full range
26
RL ≥ 10 kΩ
Full range
27
28
25°C
25
100
Full range
15
Full range
VCC = 15 V, VO = 1 V to 11 V,
RL ≥ 2 kΩ
mV
V
0 to
VCC − 2
RL = 2 kΩ
RL ≤ 10 kΩ
UNIT
V
5
20
mV
AVD
Large signal differential
Large-signal
voltage amplification
CMRR
Common-mode rejection ratio
25°C
65
80
dB
kSVR
Supply-voltage rejection ratio
(∆VDD/∆VIO)
25°C
65
100
dB
VO1/VO2
Crosstalk attenuation
120
dB
f = 1 kHz to 20 kHz
VCC = 15 V,
VID = 1 V,
V
VO = 0
IO
Output current
IOS
Short-circuit output current
ICC
Supply current (two amplifiers)
25°C
25°C
−20
Full range
−10
25°C
10
Full range
5
V/mV
−30
−60
Source
mA
VCC = 15 V,
VID = −1
1 V,
V
VO = 15 V
20
Sink
µA
VID = −1 V, VO = 200 mV
25°C
30
VCC at 5 V, GND at −5 V, VO = 0
25°C
±40
±60
VO = 2.5 V, No load
Full range
0.7
1.2
VCC = MAX, VO = 0.5 V, No load
Full range
1
2
mA
mA
†
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for LM2904 and 30 V for others.
‡ Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
§ All typical values are at T = 25°C.
A
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
operating conditions, VCC = ±15 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP
UNIT
0.3
V/µs
SR
Slew rate at unity gain
RL = 1 MΩ, CL = 30 pF, VI = ±10 V
(see Figure 1)
B1
Unity-gain bandwidth
RL = 1 MΩ, CL = 20 pF (see Figure 1)
0.7
MHz
Vn
Equivalent input noise voltage
RS = 100 Ω, VI = 0 V, f = 1 kHz
(see Figure 2)
40
nV/√Hz
VCC+
−
VI
VO
+
CL
VCC−
RL
Figure 1. Unity-Gain Amplifier
900 Ω
VCC+
100 Ω
−
VI = 0 V
RS
VO
+
VCC−
Figure 2. Noise-Test Circuit
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
5962-87710012A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287710012A
LM158FKB
5962-8771001PA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
8771001PA
LM158
5962-87710022A
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287710022A
LM158AFKB
5962-8771002PA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
8771002PA
LM158A
LM158AFKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287710022A
LM158AFKB
LM158AJG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
LM158AJG
LM158AJGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
8771002PA
LM158A
LM158FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
596287710012A
LM158FKB
LM158JG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
LM158JG
LM158JGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
8771001PA
LM158
LM258AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258A
LM258ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258A
LM258ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258A
LM258ADGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-25 to 85
(M3L ~ M3P ~ M3S ~
M3U)
LM258ADGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(M3L ~ M3P ~ M3S ~
M3U)
LM258ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-25 to 85
LM258A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM258ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258A
LM258ADRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258A
LM258AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM258AP
LM258APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM258AP
LM258D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-25 to 85
(M2L ~ M2P ~ M2S ~
M2U)
LM258DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(M2L ~ M2P ~ M2S ~
M2U)
LM258DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DRE4
ACTIVE
SOIC
D
8
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 85
LM258
LM258DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM258
LM258P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM258P
LM258PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM258P
LM2904AVQDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904AV
LM2904AVQDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904AV
LM2904AVQPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904AV
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2904AVQPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904AV
LM2904D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 125
(MBL ~ MBP ~ MBS ~
MBU)
LM2904DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(MBL ~ MBP ~ MBS ~
MBU)
LM2904DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2904
LM2904P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
LM2904P
LM2904PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
LM2904P
LM2904PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PSRE4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM2904PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
LM2904PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904PWRG3
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L2904
LM2904QD
OBSOLETE
SOIC
D
8
TBD
Call TI
Call TI
-40 to 125
LM2904QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2904Q1
LM2904QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2904Q1
LM2904QP
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
-40 to 125
LM2904VQDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904V
LM2904VQDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904V
LM2904VQPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904V
LM2904VQPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2904V
LM358AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358A
LM358ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358A
LM358ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358A
LM358ADGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
0 to 70
(M6L ~ M6P ~ M6S ~
M6U)
LM358ADGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M6L ~ M6P ~ M6S ~
M6U)
LM358ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
LM358A
LM358ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358A
LM358ADRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358A
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM358AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM358AP
LM358APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM358AP
LM358APW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358A
LM358APWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358A
LM358APWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358A
LM358APWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
L358A
LM358APWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358A
LM358APWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358A
LM358D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358
LM358DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358
LM358DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358
LM358DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
0 to 70
(M5L ~ M5P ~ M5S ~
M5U)
LM358DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M5L ~ M5P ~ M5S ~
M5U)
LM358DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
LM358
LM358DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358
LM358DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM358
LM358DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM358
LM358P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU | CU SN
N / A for Pkg Type
0 to 70
LM358P
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM358PE3
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 70
LM358P
LM358PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM358P
LM358PSLE
OBSOLETE
SO
PS
8
TBD
Call TI
Call TI
0 to 70
LM358PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PSRE4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
0 to 70
LM358PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
0 to 70
L358
LM358PWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
LM358PWRG3
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
L358
LM358PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L358
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :
• Automotive: LM2904-Q1
• Enhanced Product: LM258A-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM258ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM258ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM258ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM258ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM258ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM258DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM258DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM258DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM258DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM258DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM258DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904AVQPWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2904AVQPWRG4
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2904DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2904DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2904DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2904DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM2904PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2904PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2904QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2904VQPWRG4
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM358ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM358ADR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM358ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358APWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358APWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM358DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM358DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
4.0
12.0
Q1
LM358DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM358DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM358PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM358PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM358PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM258ADGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM258ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM258ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM258ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM258ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM258DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM258DGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM258DR
SOIC
D
8
2500
367.0
367.0
35.0
LM258DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM258DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM258DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM2904AVQPWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM2904AVQPWRG4
TSSOP
PW
8
2000
367.0
367.0
35.0
LM2904DGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM2904DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM2904DR
SOIC
D
8
2500
367.0
367.0
35.0
LM2904DR
SOIC
D
8
2500
340.5
338.1
20.6
LM2904DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM2904DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM2904DRG4
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Nov-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2904PSR
SO
PS
8
2000
367.0
367.0
38.0
LM2904PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2904PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2904QDR
SOIC
D
8
2500
367.0
367.0
35.0
LM2904VQPWRG4
TSSOP
PW
8
2000
367.0
367.0
35.0
LM358ADGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM358ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM358ADR
SOIC
D
8
2500
364.0
364.0
27.0
LM358ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM358ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM358ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM358APWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM358APWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM358DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM358DGKR
VSSOP
DGK
8
2500
332.0
358.0
35.0
LM358DR
SOIC
D
8
2500
367.0
367.0
35.0
LM358DR
SOIC
D
8
2500
340.5
338.1
20.6
LM358DR
SOIC
D
8
2500
367.0
367.0
35.0
LM358DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM358DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM358PSR
SO
PS
8
2000
367.0
367.0
38.0
LM358PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM358PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
Pack Materials-Page 4
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
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