FAIRCHILD FPF1104

FPF1103 / FPF1104
Advance Load Management Switch
Features
Description
ƒ
ƒ
The FPF1103/04 are low RDS P-channel MOSFET load
switches of the IntelliMAX™ family. Integrated slew-rate
control prevents inrush current from glitch supply rails
with capacitive loads common in power applications.
ƒ
ƒ
ƒ
ƒ
ƒ
1.2V to 4V Input Voltage Operating Range
Typical RDS(ON):
- 35mΩ at VIN=3.3V
-
55mΩ at VIN=1.8V
-
85mΩ at VIN=1.2V
The input voltage range operates from 1.2V to 4V to
fulfill today's lowest ultra-portable device supply
requirements. Switch control is by a logic input (ON-pin)
capable of interfacing directly with low-voltage CMOS
control signals and GPIOs in embedded processors.
Slew Rate Control with tR: 65µs
Output Discharge Function on FPF1104
Low <1µA Quiescent Current at VON=VIN
ESD Protected: Above 4000V HBM, 2000V CDM
GPIO/CMOS-Compatible Enable Circuitry
Applications
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Mobile Devices and Smart Phones
Portable Media Devices
Digital Cameras
Advanced Notebook, UMPC, MID
Portable Medical Devices
GPS and Navigation Equipment
Ordering Information
Part
Number
Switch
Input
Output
ON Pin
Part
(Typical)
Buffer Discharge Activity
Marking
At 1.8VIN
tR
Eco
Status
Package
4-Ball, Wafer-Level ChipScale Package (WLCSP),
1.0 x 1.0mm, 0.5mm Pitch
FPF1103
Q9
55mΩ
CMOS
NA
Active
HIGH
65µs
Green
FPF1104
QA
55mΩ
CMOS
65Ω
Active
HIGH
65µs
Green
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
FPF1103 / FPF1104 — Advance Load Management Switch
November 2009
VIN
CIN
VOUT
FPF1103/FPF1104
OFF ON
ON
To Load
COUT
GND
Figure 1. Typical Application
Notes:
1. CIN=1μF, X5R, 0603, for example Murata GRM185R60J105KE26
2. COUT=1μF, X5R, 0805, for example Murata GRM216R61A105KA01
Block Diagram
FPF1103/4
Figure 2. Block Diagram (Output Discharge for FPF1104 Only)
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
2
FPF1103 / FPF1104 — Advance Load Management Switch
Application Diagram
Figure 3. 1 x 1mm WLCSP Bumps Facing Down
VOUT
A1
A2
VIN
GND
B1
B2
ON
Figure 4. 1 x 1mm WLCSP Bumps Facing Up
Figure 5. Pin Assignments (Top View)
VIN
A2
A1
VOUT
ON
B2
B1
GND
Figure 6. Pin Assignments (Bottom View)
Pin Definitions
Pin #
Name
Description
A1
VOUT
Switch Output
A2
VIN
B1
GND
B2
ON
Supply Input: Input to the Power Switch
Ground
ON/OFF Control, Active High
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
3
FPF1103 / FPF1104 — Advance Load Management Switch
Pin Configurations
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device
reliability. The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
-0.3
4.2
V
VIN
VIN, VOUT, VON to GND
ISW
Maximum Continuous Switch Current
1.2
A
PD
Power Dissipation at TA=25°C
1.0
W
TSTG
Storage Junction Temperature
-65
+150
°C
TA
Operating Temperature Range
-40
+85
°C
ΘJA
ESD
Thermal Resistance, Junction-to-Ambient
Electrostatic Discharge Capability
1S2P with 1 Thermal Via
95
1S2P without Thermal Via
187
Human Body Model,
JESD22-A114
4
Charged Device Model,
JESD22-C101
2
°C/W
kV
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Supply Voltage
1.2
4.0
V
TA
Ambient Operating Temperature
-40
+85
°C
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
4
FPF1103 / FPF1104 — Advance Load Management Switch
Absolute Maximum Ratings
Unless otherwise noted, VIN=1.2 to 4.0V, TA=-40 to +85°C; typical values are at VIN=3.3V and TA=25°C.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
4.0
V
Basic Operation
VIN
Supply Voltage
1.2
IQ(OFF)
Off Supply Current
VON=GND, VOUT=Open, VIN=4V
1
μA
ISD(OFF)
Off Switch Current
VON=GND, VOUT=GND
1
μA
IOUT=0mA, VON=VIN
1
IOUT=0mA, VON < VIN
3
IQ
Quiescent Current
RON
On-Resistance
VIN=3.3V, IOUT=200mA, TA=25°C
35
50
VIN=1.8V, IOUT=200mA, TA=25°C
55
70
VIN=1.5V, IOUT=200mA, TA=25°C
70
VIN=1.2V, IOUT=200mA, TA=25°C
mΩ
85
150
VIN=1.8V, IOUT=200mA, TA=85°C
65
100
65
110
(3)
RPD
Output Discharge RPULL DOWN
VIN=3.3V, VON=0V, IFORCE=20mA,
TA=25°C, FPF1104
VIH
ON Input Logic High Voltage
VIN=1.2V to 4.0V
VIL
ON Input Logic Low Voltage
VIN=1.2V to 4.0V
ION
ON Input Leakage
VON=VIN or GND
μA
1.1
Ω
V
-1
0.35
V
1
μA
Dynamic Characteristics
(4)
tDON
Turn-On Delay
tR
VOUT Rise Time
tON
Turn-On Time
(4)
(4,6)
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C
(4)
tDON
Turn-On Delay
tR
VOUT Rise Time
tON
Turn-On Time
(4)
(4,6)
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C
35
μs
65
μs
100
μs
30
50
μs
40
55
μs
70
105
μs
2.0
2.5
μs
FPF1103
(4)
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
(4)
(4,7)
tOFF
Turn-Off
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
(4)
tOFF
FPF1104
tDOFF
tF
tOFF
Turn-Off
(4)
(4,7)
VIN=3.3V, RL=500Ω, CL=0.1µF,
TA=25°C
2.2
μs
4.2
μs
7.0
μs
110
μs
117
μs
(5)
(4)
Turn-Off Delay
VOUT Fall Time
Turn-Off
(4)
(4,7)
VIN=3.3V, RL=10Ω, CL=0.1µF,
RPD=65Ω, TA=25°C
(4)
tDOFF
Turn-Off Delay
tF
VOUT Fall Time
tOFF
VIN=3.3V, RL=10Ω, CL=0.1µF,
TA=25°C
Turn-Off
(4)
(4,7)
VIN=3.3V, RL=500Ω, CL=0.1µF,
RPD=65Ω, TA=25°C
2.0
2.5
μs
1.9
μs
3.9
μs
2.5
μs
10.6
μs
13.1
μs
Notes:
3. This parameter is guaranteed by design and characterization; not production tested.
4. tDON/tDOFF/tR/tF are defined in Figure 7.
5. Output discharge path is enabled during off.
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
5
FPF1103 / FPF1104 — Advance Load Management Switch
Electrical Characteristics
FPF1103 / FPF1104 — Advance Load Management Switch
Timing Diagram
90%
VOUT
90%
10%
10%
tR
tF
3.3V
50%
50%
VON
90%
10%
VOUT
tDON
tDOFF
Notes:
6. tON=tR + tDON.
7. tOFF=tF + tDOFF.
Figure 7. Timing Diagram
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
6
0.25
VON = VOUT = 0V
SHUTDOWN CURRENT ( μA)
V IN SH UTDOW N C UR REN T ( μA )
0.30
0.25
0.20
VIN = 4.0V
0.15
VIN = 3.3V
0.10
VIN = 1.2V
0.05
IN
VON=V
0.15
0.10
85°C
0.05
V
25°C
-40°C
0.00
-40
-15
10
35
60
0.00
1.0
85
1.5
2.0
TJ, JUNCTION TEMPERATURE (°C)
3.0
3.5
4.0
Figure 9. Shutdown Current vs. Supply Voltage
0.07
0.10
O FF SUPPLY CU RRENT ( μA)
VON = 0V
0.09
O F F SU P PL Y CU R R EN T ( μA )
2.5
SUPPLY VOLTAGE (V)
Figure 8. Shutdown Current vs. Temperature
0.08
0.07
0.06
0.05
VIN = 4.0V
0.04
VIN = 3.3V
0.03
VIN = 1.2V
0.02
0.01
0.00
-40
-15
10
35
60
VON = 0V
0.06
0.05
0.04
0.03
85°C
0.02
-40°C
0.01
25°C
0.00
85
1.0
TJ, JUNCTION TEMPERATURE (°C)
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOLTAGE (V)
Figure 10. Off Supply Current vs. Temperature
(FPF1103, VOUT is floating)
Figure 11. Off Supply Current vs. Supply Voltage
(FPF1103, VOUT is Floating)
0.40
0.050
VON = VIN
0.045
0.35
0.040
SU PPLY CUR REN T ( μA)
SUPPLY CU RRENT ( μA)
OUT=0V
0.20
FPF1103 / FPF1104 — Advance Load Management Switch
Typical Performance Characteristics
0.035
0.030
0.025
VIN = 4.0V
0.020
0.015
VIN = 3.3V
VIN = 1.2V
0.010
0.30
0.25
0.15
0.10
25°C
0.05
0.000
0.00
-15
10
35
60
85
85°C
1.0
TJ, JUNCTION TEMPERATURE (°C)
1.5
2.0
2.5
3.0
3.5
4.0
SUPPLY VOLTAGE (V)
Figure 12. Quiescent Current vs. Temperature
(VON=VIN)
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
-40°C
0.20
0.005
-40
VON = VIN
Figure 13. Quiescent Current vs. Supply Voltage
www.fairchildsemi.com
7
3.00
2.50
VON = 0.75 x VIN
2.00
VIN = 4.0V
2.00
S U P P LY C U R R E N T (µA)
SUPPLY CU RRENT ( μA)
2.50
1.50
VIN = 3.3V
1.00
0.50
+25°C
1.50
+85°C
1.00
-40°C
0.50
VIN = 1.2V
0.00
0.00
-40
-15
10
35
60
1.0
85
1.5
2.0
TJ, JUNCTION TEMPERATURE (°C)
Figure 14. Quiescent Current vs. Temperature
(VON=0.75 x VIN)
4.0
VON = V IN
IO U T = 200mA
)
250
ON R E SISTA N CE (m
O N R E S IS T A N C E (m Ω )
300
VON = VIN
IOUT = 200mA
VIN = 1.2V
3.5
Figure 15. Quiescent Current vs. Supply Voltage at
VON=1.2V
120
100
2.5
3.0
S U P P LY V O LTA G E (V )
80
60
VIN = 3.3V
40
VIN = 4.0V
20
200
150
FPF1103 / FPF1104 — Advance Load Management Switch
Typical Performance Characteristics
100
25°C
85°C
50
0
-40°C
0
-40
-15
10
35
60
85
1.0
TJ, JUNCTION TEMPERATURE (°C)
1.5
2.0
2.5
3.0
3.5
4.0
SUP PLY VOLTAGE (V)
Figure 16. RON vs. Temperature
Figure 17. RON vs. Supply Voltage
V O N INPUT LO GIC VOL TAG E (V)
1.00
0.90
0.80
V IH
0.70
0.60
0.50
V IL
0.40
0.30
0.20
1.0
1.5
2.0
2.5
3.0
3.5
4.0
SUP PLY VO LTAG E (V)
Figure 18. ON-Pin Threshold vs. VIN
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
8
10
100
O N /O FF D ELAY TIM E (µs)
R IS E /FA LL TIM E (µ s)
VIN = 3.3
CL= 0.1 µ
RL= 10
1
tF
1
-
-15
1
3
6
t DOFF
-40
10
35
60
85
Figure 20. VOUT Turn-On and Turn-Off Delay vs.
Temperature at RL=10Ω
60
60
50
50
O N /O F F D ELAY T IM E (µs)
tR
40
30
VIN =3.3
C L =0.1 µF
R =50 0
-15
TJ JU N C T IO N T E M P E R A T U R E (°C )
Figure 19. VOUT Rise and Fall Time vs. Temperature
at RL=10Ω
R IS E /FA LL TIM E (µs)
10
1
8
TJ JU N C TIO N TE M P E R A TU R E (°C )
20
VIN= 3.3
CL= 0.1 µF
RL= 10
t DON
tR
tF
10
0
VIN= 3.3
C L= 0.1 µF
R L= 50 0
40
t DON
30
FPF1103 / FPF1104 — Advance Load Management Switch
Typical Performance Characteristics
20
10
t DOFF
0
-40
-15
10
35
60
85
-40
TJ JU N C TIO N T E M P E R A T U R E (°C )
-50
10
35
60
85
TJ JU N C TIO N TE M P E R A TU R E (°C )
Figure 21. VOUT Rise and Fall Time vs. Temperature
at RL=500Ω
Figure 22. VOUT Turn-On and Turn-Off Delay vs.
Temperature at RL=500Ω
90
R ISE /D E L AY T IM E ( μ s )
80
70
60
tR
50
40
t DON
30
20
10
0
10
R LOA D
10 0
O U T P U T L O AD ( Ω )
100 0
Figure 23. tR/tDON vs. Output Load at VIN=3.3V
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
9
Figure 24. Turn-On Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω)
Figure 25. Turn-Off Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=10Ω)
Figure 26. Turn-On Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
Figure 27. Turn-Off Response
(VIN=3.3V, CIN=1µF, COUT=0.1µF, RL=500Ω)
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
FPF1103 / FPF1104 — Advance Load Management Switch
Typical Performance Characteristics
www.fairchildsemi.com
10
Input Capacitor
Fall Time
TM
An IntelliMAX
switch doesn’t require an input
capacitor. To reduce device inrush current effect, a
0.1µF ceramic capacitor, CIN, is recommended close to
the VIN pin. A higher value of CIN can be used to further
reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
Device output fall time can be calculated based on RC
constant of the external components as follows:
t F = R L × C L × 2 .2
(1)
where tF is 90% to 10% fall time, RL is output load, and
CL is output capacitor.
Output Capacitor
The same equation works for a device with a pull-down
output resistor. RL is replaced by a parallel connected
pull-down and an external output resistor combination,
as follows:
TM
An IntelliMAX
switch works without an output
capacitor. However, if parasitic board inductance forces
VOUT below GND when switching off, a 0.1µF capacitor,
COUT, should be placed between VOUT and GND.
tF =
R L × R PD
× C L × 2 .2
R L + R PD
(2)
where tF is 90% to 10% fall time, RL is output load,
RPD=65Ω.is output pull-down resistor, and CL is the
output capacitor.
Resistive Output Load
TM
If resistive output load is missing, the IntelliMAX
switch without a pull-down output resistor is not
discharging the output voltage. Output voltage drop
depends, in that case, mainly on external device leaks.
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
FPF1103 / FPF1104 — Advance Load Management Switch
Application Information
www.fairchildsemi.com
11
as close to the device as possible. Below is a
recommended layout for this device to achieve
optimum performance.
For best thermal performance and minimal
inductance and parasitic effects, it is recommended
to keep input and output traces short and capacitors
FPF1103 / FPF1104 — Advance Load Management Switch
Recommended Land Pattern and Layout
Figure 28. Recommended Land Pattern and Layout
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
12
FPF1103 / FPF1104 — Advance Load Management Switch
Physical Dimensions
Figure 29. 4 Ball, 1.0 x 1.0mm Wafer-Level Chip-Scale Packaging (WLCSP)
Product-Specific Dimensions
Product
D
E
X
Y
FPF1103
960µm ± 30µm
960µm ± 30µm
0.230mm
0.230mm
FPF1104
960um ± 30µm
960um ± 30µm
0.230mm
0.230mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
13
FPF1103 / FPF1104 — Advance Load Management Switch
© 2009 Fairchild Semiconductor Corporation
FPF1103 / FPF1104 • Rev. 1.0.1
www.fairchildsemi.com
14