Freescale MP3V5050V High temperature accuracy integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated Datasheet

MP3V5050V
Rev 1, 10/2008
Freescale Semiconductor
Technical Data
High Temperature Accuracy
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5050V
Series
INTEGRATED
PRESSURE SENSOR
–50 to 0 kPa (–7.25 to 0 psi)
0.12 to 2.8 Volts Output
The MP3V5050V sensor integrates on-chip, bipolar op amp circuitry and thin
film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale Semiconductor, Inc. pressure sensor a logical and
economical choice for the system designer.
The MP3V5050V piezoresistive transducer is a state-of-the-art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor
processing to provide an accurate, high level analog output signal that is
proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a
pressure sensor chip.
SMALL OUTLINE PACKAGE
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller-Based Systems
• Temperature Compensated from Over –40° to +125°C
• Patented Silicon Shear Stress Strain Gauge
• Durable Thermoplastic (PPS) Surface Mount Package
• Easy-to-Use Chip Carrier Option
• Ideal for Automotive and Non-Automotive Applications
MP3V5050VC6T1
CASE 482A-01
PIN NUMBER(1)
Typical Applications
• Vacuum Pump Monitoring
ORDERING INFORMATION
Device
Type
Case
No.
MPX Series
Order No.
Ported
Vacuum,
Element Axial Port
482A
MP3V5050VC6T1
Ported
Vaccum,
Element Axial Port
482A
MP3V5050VC6U
Options
Packing
Options
Device Marking
Tape & Reel MP3V5050V
Rail
1
N/C
5
N/C
2
VS
6
N/C
3
GND
7
N/C
4
VOUT
8
N/C
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
MP3V5050V
VS
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
Gain Stage #2
and
Ground
Reference
Shift Circuitry
Vout
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
MP3V5050V
Sensors
Freescale Semiconductor
1
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
200
kPa
Storage Temperature
Tstg
–40° to +125°
°C
Operating Temperature
TA
–40° to +125°
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
–50
—
0
kPa
Supply Voltage(1)
VS
2.7
3.0
3.3
Vdc
Supply Current
Io
—
7.0
10
mAdc
(0 to 85°C)
(Pdiff = 0 kPa)
VFSO
2.7
2.8
2.9
Vdc
Full Scale Span(3)
@ VS = 3.0 Volts
(0 to 85°C)
VFSS
—
2.7
—
Vdc
Accuracy(4)
(0 to 85°C)
—
—
—
±2.5
%VFSS
V/P
—
54
—-
mV/kPa
Response Time(5)
tR
—
1.0
—-
ms
Warm-Up Time(6)
—
—
20
—-
ms
Offset Stability(7)
—
—
±0.5
—-
%VFSS
Voff
0.06
0.12
0.19
Vdc
Full Scale Output(2)
@ VS = 3.0 Volts
Sensitivity
Pressure Offset(8)
(0 to 85°C)
1. Device is ratiometric within this specified excitation range.
2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of errors, including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
8. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
MP3V5050V
2
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Freescale Semiconductor
FLUOROSILICONE
GEL DIE COAT
+3 V
STAINLESS
STEEL CAP
DIE
P1
WIRE BOND
OUTPUT
Vout
THERMOPLASTIC
CASE
Vs
LEAD
FRAME
IPS
1.0 µF
P2
0.01 µF
GND
470 pF
DIE BOND
DIFFERENTIAL SENSING ELEMENT
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 2. Cross-Sectional Diagram
(not to scale)
TRANSFER FUNCTION MP3V5050VC6T1
3
TYPICAL
MAX
1
Output Range (Typ)
Output Voltage (V)
2
Span Range (Typ)
Transfer Function:
Vout = VS x (0.018 x P + 0.94) ± (PE x TM x 0.018 x Vs)
Vs = 3.0 ± 0.30 Vdc
PE = 1.25
TM = 1
Temperature = 0 to 85°C
MIN
0
–50
–40
–30
–20
–10
0
Offset
(Typ)
Pressure (kPa)
Figure 4. Output versus Differential Pressure
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MP3V5050V
pressure sensor operating characteristics, internal reliability
and qualification tests are based on use of dry air as the
pressure media. Media other than dry air may have adverse
effects on sensor performance and long-term reliability.
Contact the factory for information regarding media
compatibility in your application.
MP3V5050V
Sensors
Freescale Semiconductor
3
Transfer Function (MP3V5050VC6T1
Nominal Transfer Value: Vout = VS x (0.018 x P + 0.94)
± (Pressure Error x Temp Multi x 0.018 x VS)
VS = 3.0 ± 0.3 V
Temperature Error Band
MP3V5050V
4.0
Break Points
Temp
3.0
Temperature
Error
Factor
Multiplier
–40
0 to 85
+125
2.0
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.
Pressure Error Band
MPXV5050V
Error Limits for Pressure
Pressure Error (kPa)
1.25
1.00
0.75
0
–50
–40
–30
–20
–10
0
Pressure (in kPa)
–0.75
–1.00
–1.25
Pressure
Error (Max)
–50 to 0 kPa
±1.25 kPa
MP3V5050V
4
Sensors
Freescale Semiconductor
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
Figure 5. SOP Footprint (Case 482A)
MP3V5050V
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5050V
6
Sensors
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NOTES
MP3V5050V
Sensors
Freescale Semiconductor
7
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MP3V5050V
Rev. 1
10/2008
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