Rohm BU9795AGUW Standard function segment driver Datasheet

LCD Segment Driver series
Standard function
Segment Drivers
No.09044EBT01
BU9795AKV, BU9795AFV, BU9795AGUW
●Description
This is LCD segment driver for 140 segment type display. There is a lineup which is suitable for multi function display and is
integrated display RAM and power supply circuit for LCD driving with 4 common output type: BU9795AKV/FV/GUW.
●Features
1) 3wire serial interface (CSB, SD, SCL)
2) Integrated RAM for display data (DDRAM) : 35 × 4bit (Max 140 Segment)
3) LCD driving port: 4 Common output,
Segment: 35output (BU9795AKV), 31output (BU9795AGUW), 27output (BU9795AFV)
4) Display duty: 1/4 duty
5) Integrated Buffer AMP for LCD driving power supply
6) 1/2bias, 1/3bias selectable
7) No external components
8) Low power/ Ultra low power consumption design: +2.5~5.5V
●Applications
Telephone, FAX, Portable equipment (POS, ECR, PDA etc.),
DSC, DVC, Car audio, Home electrical appliance, Meter equipment etc.
●Line up matrix
Parameter
Segment output
Common output
Package
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© 2009 ROHM Co., Ltd. All rights reserved.
BU9795AKV
35
4
VQFP48C
BU9795AFV
27
4
SSOP-B40
1/15
BU9795AGUW
31
4
VBGA048W040
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Absolute maximum ratings (Ta=25degree, VSS=0V)
Parameter
Power supply voltage1
Power supply voltage2
Allowable loss
Input voltage range
Operational temperature
range
Storage temperature range
Symbol
Limits
Unit
Remark
VDD
VLCD
-0.5 ~ +7.0
-0.5 ~ VDD
V
V
0.6
W
0.7
W
0.27
W
Power supply
LCD drive voltage
When use more than Ta=25C, subtract 6mW
per degree.(BU9795AKV)
When use more than Ta=25C, subtract 7mW
per degree (BU9795AFV)
When use more than Ta=25C, subtract 2.7mW
per degree (BU9795AGUW)
Pd
VIN
-0.5
~
VDD+0.5
V
Topr
-40 ~
+85
degree
Tstg
-55
~
+125
degree
*This product is not designed against radioactive ray.
●Operating conditions (Ta=25degree,VSS=0V)
Parameter
Symbol
Min.
Power Supply voltage1
VDD
2.5
Power Supply voltage2
VLCD
0
* Please use VDD-VLCD≧2.4V condition.
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© 2009 ROHM Co., Ltd. All rights reserved.
Typ.
-
Max.
5.5
VDD-2.4
2/15
Unit
V
V
Remark
Power supply
LCD drive voltage
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Electrical characteristics
DC Characteristics (VDD=2.5~5.5V, VSS=0V, Ta=-40~85degree, unless otherwise specified)
Limit
Symbol
Unit
Condition
Parameter
MIN
TYP
MAX
VIH
0.7VDD
VDD
V
“H” level input voltage
VIL
VSS
0.3VDD
V
“L” level input voltage
IIH
1
uA
“H” level input current
IIL
-1
uA
“L” level input current
SEG
RON
3.5
kΩ
Iload=±10uA
LCD Driver on
resistance
COM
RON
3.5
kΩ
VDD -2.4
VLCD supply voltage
VLCD
0
V
VDD-VLCD≧2.5V
Display
off, Oscillator off
Ist
5
uA
Standby current
Power consumption 1
IDD1
-
12.5
30
uA
VDD=3.3[V], Ta=25,
Power save mode1, FR=70Hz
1/3 bias, Frame inverse
Power consumption 2
IDD2
-
20
40
uA
VDD=3.3[V], Ta=25,
Normal mode, FR=80Hz
1/3 bias, Line inverse
Limit
TYP
80
80
MAX
104
90
Limit
TYP
-
MAX
80
80
-
● Oscillation Characteristics
(VDD=2.5~5.5V,VSS=0V, Ta=-40~85degree)
Parameter
Symbol
Frame frequency
Frame frequency1
MIN
56
70
fCLK
fCLK1
Unit
Hz
Hz
Condition
FR = 80Hz setting
VDD=3.5V, 25degree
● MPU interface Characteristics
(VDD=2.5V~5.5V,VSS=0V, Ta=-40~85degree)
Parameter
Symbol
Input rise time
MIN
400
100
100
20
50
50
50
50
tr
tf
tSCYC
tSHW
tSLW
tSDS
tSDH
tCSS
tCSH
tCHW
Input fall time
SCL cycle time
“H” SCL pulse width
“L” SCL pulse width
SD setup time
SD hold time
CSB setup time
CSB hold time
“H” CSB pulse width
Unit
Condition
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tCHW
CSB
tCSS
tf
SCL
tSCYC
tr
tCSH
tSLW
tSHW
SD
tSDS
tSDH
Fig.1 3wire Serial timing waveform
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© 2009 ROHM Co., Ltd. All rights reserved.
3/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
* BU9795AKV
● Block Diagram
● Pin Arrangement
COM1
+
LCD
BIAS
SELECTOR
common
counter
+
-
blink timing
generator
DDRAM
VLCD
INHb
Command
Data Decoder
Command
register
OSCIN
SEG24
25
SEG25
SEG26
SEG27
SEG28
SEG29
24
SEG23
SEG22
COM3
SEG21
VLCD
SEG20
VDD
SEG19
VSS
SEG18
OSCIO
SEG17
CSB
SEG16
SCL
SEG15
SD
SEG14
TEST
SEG13
SEG12
13
48
CSB
SD
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG0
TEST
SEG4
1
IF FILTER
VSS
SEG11
12
INHb
serial inter face
SEG3
Power On Reset
SEG2
OSCILLATOR
37
COM2
SEG1
-
SEG30
Segment
driver
SEG31
common
driver
SEG32
LCD voltage generator
SEG33
VDD
SEG34
SEG0……SEG34
36
COM0
COM0……COM3
SCL
Fig. 2A
BU9795AKV Block diagram
Fig. 3A
BU9795AKV Pin arrangement
● Terminal description
Terminal
No.
I/O
INHb
48
I
Input terminal for turn off display
H: turn on display
L: turn off display
TEST
47
I
Test input (ROHM use only)
Must be connect to VSS
OSCIO
43
I
External clock input
Ex clock and Int clock can be changed by command.
Must be connect to VSS when use internal oscillation circuit.
SD
46
I
serial data input
SCL
45
I
serial data transfer clock
CSB
44
I
Chip select
VSS
42
GND
VDD
41
Power supply
VLCD
40
Power supply for LCD driving
Terminal
Function
:
“L” active
SEG0-34
1-35
O
SEGMENT output for LCD driving
COM0-3
36-39
O
COMMON output for LCD driving
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© 2009 ROHM Co., Ltd. All rights reserved.
4/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
* BU9795AFV
● Block Diagram
●
SEG28
SEG29
COM0
SEG30
COM1
COM2
VLCD
COM3
VDD
VSS
CSB
OSCIO
SD
SCL
INHb
Segment
driver
TEST
common
driver
SEG4
LCD voltage generator
SEG7
VDD
SEG5
SEG4……SEG30
SEG6
COM0……COM3
Pin Arrangement
40
21
1
20
+
LCD
BIAS
SELECTOR
-
common
counter
+
-
blink timing
generator
DDRAM
Pow er On Reset
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
Command
Data Decoder
Command
register
OSCILLATOR
SEG10
INHb
OSCIN
SEG9
SEG8
VLCD
serial inter face
IF FILTER
VSS
TEST
CSB
SD
SCL
Fig. 2B
BU9795AFV Block diagram
Fig. 3B
BU9795AFV Pin arrangement
● Terminal description
Terminal
No.
I/O
INHb
36
I
Input terminal for turn off display
H: turn on display
L: turn off display
TEST
35
I
Test input (ROHM use only)
Must be connect to VSS
OSCIO
31
I
External clock input
Ex clock and Int clock can be changed by command.
Must be connect to VSS when use internal oscillation circuit.
SD
34
I
serial data input
SCL
33
I
serial data transfer clock
CSB
32
I
Chip select
VSS
30
GND
VDD
29
Power supply
VLCD
28
I
Power supply for LCD driving
SEG4-30
1-23,
37-40
O
SEGMENT output for LCD driving
COM0-3
24-27
O
COMMON output for LCD driving
Terminal
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© 2009 ROHM Co., Ltd. All rights reserved.
Function
:
“L” active
5/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
* BU9795AGUW
● Block Diagram
●
COM0……COM3
Pin Arrangement
SEG2……SEG32
1
2
3
4
5
6
7
G
(NC)
SEG13
SEG15
SEG18
SEG20
SEG22
(NC)
F
SEG11
SEG12
SEG16
SEG17
SEG21
SEG23
SEG24
E
SEG9
SEG10
SEG14
SEG19
SEG25
SEG27
SEG26
D
SEG7
SEG6
SEG8
SEG5
SEG30
SEG28
SEG29
C
SEG4
SEG3
SEG2
CSB
COM3
SEG32
SEG31
INHb
SD
VSS
VDD
COM1
COM0
TEST2
SCL
OSCIO
VLCD
COM2
(NC)
VDD
LCD voltage generator
common
driver
Segment
driver
+
LCD
BIAS
SELECTOR
-
common
counter
+
-
blink timing
generator
DDRAM
VLCD
INHb
Command
Data Decoder
Command
register
OSCIN
OSCILLATOR
Pow er On Reset
B
serial inter face
A
(NC)
IF FILTER
VSS
TEST
CSB
SD
SCL
Fig. 2C
BU9795AGUW Block diagram
Fig. 3C
BU9795AGUW Pin arrangement
● Terminal description
Terminal
I/O
Function
INHb
I
Input terminal for turn off display
H: turn on display
L: turn off display
TEST
I
Test input (ROHM use only)
Must be connect to VSS
OSCIO
I
External clock input
Ex clock and Int clock can be changed by command.
Must be connect to VSS when use internal oscillation circuit.
SD
I
serial data input
SCL
I
serial data transfer clock
CSB
I
Chip select
:
VSS
GND
VDD
Power supply
“L” active
VLCD
I
Power supply for LCD driving
SEG2-32
O
SEGMENT output for LCD driving
COM0-3
O
COMMON output for LCD driving
(Caution) About terminal number, please refer to above pin arrangement
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© 2009 ROHM Co., Ltd. All rights reserved.
6/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Command Description
D7 (MSB) is bit for command or data judgment.
Refer to Command and data transfer method.
C: 0: Next byte is RAM write data.
1: Next byte is command.
○ Mode Set (MODE SET)
MSB
D7
C
D6
1
D5
0
D4
*
D3
P3
D2
P2
D1
*
LSB
D0
*
(*:Don’t care)
Set display ON and OFF
Setting
Display OFF (DISPOFF)
Display ON (DISPON)
P3
0
1
Reset initialize condition
○
Set bias level
Setting
P2
1/3 Bias
1/2 Bias
Reset initialize condition
○
0
1
○ Address set (ADSET)
MSB
D7
C
D6
0
D5
0
D4
P4
D3
P3
D2
P2
D1
P1
LSB
D0
P0
Address data is specified in P[4:0] and P2 (ICSET command) as follows.
Internal register
Bit of each command
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© 2009 ROHM Co., Ltd. All rights reserved.
MSB
Address [5]
ICSET [P2]
7/15
Address [4]
ADSET [P4]
・・・
・・・
LSB
Address [0]
ADSET [P0]
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
○ Display control (DISCTL)
MSB
D7
C
D6
0
D5
1
D4
P4
D3
P3
D2
P2
LSB
D0
P0
D1
P1
Set Frame frequency
Setting
P4
P3
Reset initialize condition
80Hz
0
0
○
71Hz
0
1
64Hz
1
0
53Hz
1
1
Set LCD drive waveform
Setting
P2
Reset initialize condition
Line inversion
0
○
Frame inversion
1
Set Power save mode
*
Setting
P1
P0
Power save mode 1
0
0
Power save mode 2
0
1
Normal mode
1
0
High power mode
1
1
Reset initialize condition
○
VDD-VLCD>=3.0V is required for High power mode.
○ Set IC Operation (ICSET)
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
C
1
1
0
1
P2
P1
P0
P2: MSB data of DDRAM address. Please refer to “ADSET” command.
Setting
P2
Reset initialize condition
Address MSB‘0’
0
○
Address MSB‘1’
1
Set Software Reset condition
Setting
P1
No operation
0
Software Reset
1
Switch between internal clock and external clock.
Setting
P0
Reset initialize condition
Internal clock
0
○
External clock input
1
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© 2009 ROHM Co., Ltd. All rights reserved.
8/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
○ Blink control (BLKCTL)
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
C
1
1
1
0
*
P1
P0
Set blink condition
Setting
P1
P0
Reset initialize condition
OFF
0
0
○
0.5 Hz
0
1
1 Hz
1
0
2 Hz
1
1
○ All pixel control (APCTL)
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
C
1
1
1
1
1
P1
P0
All display set ON. OFF
Setting
P1
Reset initialize condition
Normal
0
○
All pixel ON
1
P0
Reset initialize condition
Normal
Setting
0
○
All pixel OFF
1
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© 2009 ROHM Co., Ltd. All rights reserved.
9/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Function description
○ Command and data transfer method
○ 3-SPI (3wire Serial interface)
This device is controlled by 3-wire signal (CSB, SCL, and SD).
First, Interface counter is initialized with CSB=“H",
and CSB=”L” makes SD and SCL input enable.
The protocol of 3-SPI transfer is as follows.
Each command starts with Command or Data judgment bit (D/C) as MSB data,
and continuously in order of D6 to D0 are followed after CSB =”L”.
(Internal data is latched at the rising edge of SCL, it converted to 8bits parallel data
at the falling edge of 8th CLK.)
Command/Data
Command
CSB
SCL
SD
D/C D6
D5
D4
D3
D2
D1
D0
D/C
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D4
D3
D2
D1
D0
D7
D6
D5
D/C = “H” : Command D/C = “L” : Data
Fig. 4 3-SPI Command/Data transfer format
○Write display data and transfer method
* BU9795AKV
This LSI have Display Data RAM (DDRAM) of 35×4=140bit.
The relationship between data input and display data, DDRAM data and address are as follows.
Command
0000000
a
b
c d
e
f
g
h
i
j k
l m
n
o p
…
Display Data
8 bit data will be stored in DDRAM. The address to be written is the address specified by
Address set command, and the address is automatically incremented in every 4bit data.
Data can be continuously written in DDRAM by transmitting Data continuously.
(When RAM data is written successively after writing RAM data to 22h (SEG34), the address
is returned to 00h (SEG0) by the auto-increment function.
DDRAM address
BIT
1Fh
20h
21h
22h
02h
03h
04h
05h
0
a
e
i
m
q
u
COM0
1
b
f
j
n
r
v
COM1
2
c
g
k
o
s
x
COM2
COM3
d
h
l
p
t
y
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
07h
1Eh
01h
3
06h
・・・・・・・・
00h
SEG7
・・・・・・・・
SEG30
SEG31
SEG32
SEG33
SEG34
As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes
CSB=”L”→”H” before 4bits data transfer.
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© 2009 ROHM Co., Ltd. All rights reserved.
10/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
* BU9795AFV
As SEG0, SEG1, SEG2, SEG3, SEG31, SEG32, SEG33, SEG34 are not output, these address will be
dummy address.
Dummy data
BIT
Dummy data
DDRAM address
06h
1Eh
1Fh
20h
21h
22h
01h
02h
03h
04h
05h
0
a
e
i
m
q
u
COM0
1
b
f
j
n
r
v
COM1
2
c
g
k
o
s
x
3
d
h
l
p
t
y
COM2
COM3
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
07h
・・・・・・・・
00h
SEG7
・・・・・・・・
SEG30
SEG31
SEG32
SEG33
SEG34
As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes
CSB=”L”→”H” before 4bits data transfer.
* BU9795AGUW
As SEG0, SEG1, SEG33, SEG34 are not output, these address will be dummy address.
Dummy data
BIT
Dummy data
DDRAM address
06h
1Eh
1Fh
20h
21h
22h
01h
02h
03h
04h
05h
0
a
e
i
m
q
u
COM0
1
b
f
j
n
r
v
COM1
2
c
g
k
o
s
x
3
d
h
l
p
t
y
COM2
COM3
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
07h
・・・・・・・・
00h
SEG7
・・・・・・・・
SEG30
SEG31
SEG32
SEG33
SEG34
As data transfer to DDRAM happens every 4bit data, it will be cancelled if it changes
CSB=”L”→”H” before 4bits data transfer.
○ Reset (initial)
condition
Initial condition after execute Software Reset is as follows.
・ Display is OFF.
・ DDRAM address is initialized (DDRAM Data is not initialized).
・ Refer to Command Description about initialize value of register.
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© 2009 ROHM Co., Ltd. All rights reserved.
11/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●
Cautions of Power-On condition
This LSI has “P.O.R” (Power-On Reset) circuit and Software Reset function.
Please keep the following recommended Power-On conditions in order to power up properly.
1. Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure
P.O.R operation.
tF
VDD
Recommendation condition of tR,tF,tOFF,Vbot
tR
tOFF
Power
tR
tF
tOFF
Vbot
Less than 1ms
Less than 1ms
More than
Less than 0.1V
150ms
Vbot
ON/OFF
Fig. 5 Power on-off waveform
2.
If it is difficult to meet above conditions, execute the following sequence after Power-On.
Because it doesn’t accept the command in power off, it is necessary to care that correspondence
by software reset doesn’t become alternative to POR function completely.
(1)
CSB=”L”→”H” condition
VDD
CS B
Fig. 6 CSB Timing
(2)
After CSB”H”→“L”, execute Software Reset (ICSET command).
● IO Circuit
(BU9795AKV /AFV /AGUW)
VDD
VDD
VLCD
TEST
VSS
VSS
VDD
VDD
CSB, SD, SCL
OSCIN
VSS
VSS
VDD
VDD
INHb
VSS
VSS
Fig. 7
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© 2009 ROHM Co., Ltd. All rights reserved.
IO circuit
12/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
● Notes for Application (BU9795AKV /BU9795AFV / BU9795AGUW)
In case, BU9795AKV/ BU9795AFV/ BU9795AGUW used at VLCD≠VSS, voltage gap occur between SEG line to COM1 – 3
line at Display off state. Because of this voltage gap, there is possibility to display LCD for a moment.
To avoid this phenomenon, please decide VDD and VLCD level to satisfy Voff voltage lower than OFF level (OFF level = 1V at
the example explained below).
condition : VDD=5.0V
VLCD=2.0V
1/3bias
DDRAM data ALL "H"
Frame inversion
In case, VLCD voltage different from VSS level(VLCD≠VSS)
In this case, volatage gap occur, between SEG line to COM 1-3 line.
Because of this gap, there is possibility to display LCD for a moment.
1Frame
Send "Display off" command
VDD (5V)
Output VLCD level at display off
(All SEG terminal)
SEG0 Output
VLCD (2V)
VLCD-VSS=2V
VSS
COM0 Output
VDD (5V)
Output VLCD level at display off
(Only COM0 terminal)
VLCD (2V)
VLCD-VSS=2V
VSS
COM1 Output
VDD (5V)
VLCD (2V)
Output VSS level at display off
(at COM 1-3 terminal)
VLCD-VSS=2V
VSS
Display on
Voltage gap of
COM0-SEG0
Display off
3V
2V
the volatage between COM0 to SEG0
is 0V at display off.
1V
0V
-1V
-2V
-3V
Display off
Display on
Voltage gap of
COM1-SEG0
3V
2V
ON level
the volatage between COM1 to SEG0
is -2V at display off.
1V
OFF level
0V
-1V
Voff
-2V
-3V
Voltage gap occur between COM1 to SEG0 at display off.
So, there is possibility to display LCD.
(Only at COM 1-3 line)
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© 2009 ROHM Co., Ltd. All rights reserved.
13/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Notes for use
(1)
Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices,
thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings
is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.
(2)
Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The electrical characteristics are
guaranteed under the conditions of each parameter.
(3)
Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due to the reverse connection,
such as mounting an external diode between the power supply and the IC’s power supply terminal.
(4)
Power supply line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard, or the digital block power
supply and the analog block power supply, even though these power supplies has the same level of potential, separate the power supply pattern for
the digital block from that for the analog block, thus suppressing the diffraction of digital noises to the analog block power supply resulting from
impedance common to the wiring patterns. For the GND line, give consideration to design the patterns in a similar manner.
Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal. At the same time, in order to use
an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of
capacity dropout at a low temperature, thus determining the constant.
(5)
GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure
no terminals are at a potential lower than the GND voltage including an actual electric transient.
(6)
Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the ICs. Furthermore,
if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the GND terminal,
the ICs can break down.
(7)
Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(8)
Inspection with set PCB
On the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress. Therefore, be sure to discharge
from the set PCB by each process. Furthermore, in order to mount or dismount the set PCB to/from the jig for the inspection process, be sure to turn OFF
the power supply and then mount the set PCB to the jig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount
it from the jig. In addition, for protection against static electricity, establish a ground for the assembly process and pay thorough attention to the
transportation and the storage of the set PCB.
(9)
Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can
cause interference with circuit operation, thus resulting in a malfunction and then breakdown of the input terminal. Therefore, pay thorough attention
not to handle the input terminals, such as to apply to the input terminals a voltage lower than the GND respectively, so that any parasitic element will
operate. Furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of
electrical characteristics.
(10)
Ground wiring pattern
If small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GND pattern from the small-signal
GND pattern and establish a single ground at the reference point of the set PCB so that resistance to the wiring pattern and voltage fluctuations due to
a large current will cause no fluctuations in voltages of the small-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of
external parts as well.
(11)
External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal capacitance
due to DC bias and changes in the capacitance due to temperature, etc.
(12)
No Connecting input terminals
In terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstable state brings the inside
gate voltage of p-channel or n-channel transistor into active. As a result, battery current may increase. And unstable state can also causes
unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connected to the power supply or GND line.
(13)
Rush current
When power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current may flow
instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.
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© 2009 ROHM Co., Ltd. All rights reserved.
14/15
2009.07 - Rev.B
Technical Note
BU9795AKV, BU9795AFV, BU9795AGUW
●Ordering part number
B
D
9
Part No.
7
9
5
A
K
Part No.
V
-
Package
KV: VQFP48C
FV: SSOP-B40
GUW:
VBGA048W040
E
2
Packaging and forming specification
E2: Embossed tape and reel
VQFP48C
<Tape and Reel information>
9.0±0.2
7.0±0.1
25
36
Embossed carrier tape
Quantity
1500pcs
0.5±0.15
0.75
48
13
1
12
0.75
1.0±0.2
24
7.0 ± 0.1
9.0 ± 0.2
37
Tape
E2
Direction
of feed
direction is the 1pin of product is at the upper left when you hold
( The
)
reel on the left hand and you pull out the tape on the right hand
+0.05
0.145 -0.03
1.6MAX
1PIN MARK
0.1 ± 0.05
1.4 ± 0.05
4 +6
–4
0.5±0.1
0.08 S
+0.05
0.22 -0.04
0.08
Direction of feed
1pin
M
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SSOP-B40
<Tape and Reel information>
13.6 ± 0.2
(MAX 13.95 include BURR)
0.5 ± 0.2
1
2000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
20
0.15 ± 0.1
0.1
1.8 ± 0.1
Embossed carrier tape
Quantity
21
5.4 ± 0.2
7.8 ± 0.3
40
Tape
0.1
S
0.65
0.22 ± 0.1
0.08
M
1pin
Reel
(Unit : mm)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
VBGA048W040
<Tape and Reel information>
4.0 ± 0.1
4.0±0.1
P=0.5×6
A 0.5
G
F
E
D
C
B
A
B
12 3 4 5 6 7
2500pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
S
0.5
P=0.5 × 6
0.08 S
0.5±0.1
48- φ 0.295±0.05
φ 0.05 M S AB
Embossed carrier tape (with dry pack)
Quantity
0.5 ± 0.1
0.10
0.9MAX
1PIN MARK
Tape
1pin
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
15/15
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
2009.07 - Rev.B
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller,
fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of
any of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
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http://www.rohm.com/contact/
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