Rohm BU4231 Low voltage free delay time setting cmos voltage detector ic sery Datasheet

Voltage Detector IC Series
Low Voltage Free Delay Time Setting
CMOS Voltage Detector IC Series
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
No.09006ECT02
●Description
ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with
a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection
voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand.
●Features
1) Detection voltage from 0.9V to 4.8V in 0.1V increments
2) Highly accurate detection voltage: ±1.0%
3) Ultra-low current consumption
4) Nch open drain output
(BU42□□G/F/FVE)and CMOS output (BU43□□G/F/FVE)
5) Small surface package
SSOP5: BU42□□G,BU43□□G
SOP4: BU42□□F,BU43□□F
VSOF5: BU42□□FVE,BU43□□FVE
●Applications
All electronics devices that use microcontrollers and logic circuits.
●Selection Guide
Part Number : BU4
1
2
No.
Specifications
①
Output Circuit Format
2:Open Drain Output, 3:CMOS Output
②
Detection Voltage
Example VDET: Represented as 0.1V steps in the
range from 0.9V to 4.8V
(Displayed as 0.9 in the case of 0.9V)
③
Package
G:SSOP5(SMP5C2)/ F :SOP4/ FVE:VSOF5(EMP5)
3
Description
● Lineup
Making
Detection
voltage
Part
Number
Making
Detection
voltage
Part
Number
Making
Detection
voltage
Part
Number
Making
Detection
voltage
Part
Number
ZR
ZQ
ZP
ZN
ZM
ZL
ZK
ZJ
ZH
ZG
ZF
ZE
ZD
ZC
ZB
ZA
YZ
YY
YX
YW
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
BU4248
BU4247
BU4246
BU4245
BU4244
BU4243
BU4242
BU4241
BU4240
BU4239
BU4238
BU4237
BU4236
BU4235
BU4234
BU4233
BU4232
BU4231
BU4230
BU4229
YV
YU
YT
YS
YR
YQ
YP
YN
YM
YL
YK
YJ
YH
YG
YF
YE
YD
YC
YB
YA
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
BU4228
BU4227
BU4226
BU4225
BU4224
BU4223
BU4222
BU4221
BU4220
BU4219
BU4218
BU4217
BU4216
BU4215
BU4214
BU4213
BU4212
BU4211
BU4210
BU4209
1H
1G
1F
1E
1D
1C
1B
1A
0Z
0Y
0X
0W
0V
0U
0T
0S
0R
0Q
0P
0N
4.8V
4.7V
4.6V
4.5V
4.4V
4.3V
4.2V
4.1V
4.0V
3.9V
3.8V
3.7V
3.6V
3.5V
3.4V
3.3V
3.2V
3.1V
3.0V
2.9V
BU4348
BU4347
BU4346
BU4345
BU4344
BU4343
BU4342
BU4341
BU4340
BU4339
BU4338
BU4337
BU4336
BU4335
BU4334
BU4333
BU4332
BU4331
BU4330
BU4329
0M
0L
0K
0J
0H
0G
0F
0E
0D
0C
0B
0A
ZZ
ZY
ZX
ZW
ZV
ZU
ZT
ZS
2.8V
2.7V
2.6V
2.5V
2.4V
2.3V
2.2V
2.1V
2.0V
1.9V
1.8V
1.7V
1.6V
1.5V
1.4V
1.3V
1.2V
1.1V
1.0V
0.9V
BU4328
BU4327
BU4326
BU4325
BU4324
BU4323
BU4322
BU4321
BU4320
BU4319
BU4318
BU4317
BU4316
BU4315
BU4314
BU4313
BU4312
BU4311
BU4310
BU4309
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© 2009 ROHM Co., Ltd. All rights reserved.
1/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
●Absolute maximum ratings (Ta=25°C)
Parameter
Power Supply Voltage
Nch Open Drain Output
Output Voltage
CMOS Output
*1*4
SSOP5
Power
*2*4
SOP4
Dissipation
*3*4
VSOF5
Operating Temperature
Ambient Storage Temperature
*1
*2
*3
*4
Symbol
VDD-GND
VOUT
Pd
Topr
Tstg
Technical Note
Limits
-0.3 ~ +7
GND-0.3 ~ +7
GND-0.3 ~ VDD+0.3
540
400
210
-40 ~ +125
-55 ~ +125
Unit
V
V
mW
°C
°C
When used at temperatures higher than Ta=25°C, the power is reduced by 5.4mW per 1°C above 25°C.
When used at temperatures higher than Ta=25°C, the power is reduced by 4.0mW per 1°C above 25°C.
When used at temperatures higher than Ta=25°C, the power is reduced by 2.1mW per 1°C above 25°C.
When a ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board)is mounted.
●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)
Parameter
Detection Voltage
Symbol
VDET
Circuit Current when ON
Idd1
Circuit Current when OFF
Idd2
Operating Voltage Range
Vopl
‘High’ Output Current (Pch)
IOH
‘Low’ Output Current (Nch)
Iol
Leak Current when OFF
‘High’ Output Current (Pch)
Ileak
Ioh
CT pin Threshold Voltage
Vcth
Output Delay Resistance
Rct
CT pin Output Current
Ict
Detection Voltage
Temperature coefficient
Hysteresis Voltage
Condition
Min.
Vdet(T)
Vdet(T)
×1.01
0.70
0.90
2.0
20
1.0
3.6
1.7
2.0
Vdd
×0.35
Vdd
×0.40
9
5
200
0.15
0.20
0.25
0.30
0.35
0.40
0.30
0.35
0.40
0.45
0.50
0.55
4.0
100
3.3
6.5
0
0
3.4
4.0
Vdd
×0.45
Vdd
×0.50
10
40
400
0.88
1.05
1.23
1.40
1.58
1.75
1.40
1.58
1.75
1.93
2.10
2.28
0.1
1
Vdd
×0.55
Vdd
×0.60
11
-
-
±30
-
VDET≤1.0V
Vdet
×0.03
Vdet
×0.05
Vdet
×0.08
VDET≥1.1V
Vdet
×0.03
Vdet
×0.05
Vdet
×0.07
VDET =0.9-1.3V
VDET =1.4-2.1V
VDET =2.2-2.7V
VDD=VDET-0.2V
VDET =2.8-3.3V
VDET =3.4-4.2V
VDET =4.3-4.8V
VDET =0.9-1.3V
VDET =1.4-2.1V
VDET =2.2-2.7V
VDD=VDET+2.0V
VDET =2.8-3.3V
VDET =3.4-4.2V
VDET =4.3-4.8V
VOL≤0.4V, Ta=25~125°C, RL=470kΩ
VOL≤0.4V, Ta=-40~25°C, RL=470kΩ
VDS=0.5V VDD=6.0V VDET=4.0-4.8V
VDS=0.05V VDD=0.85V
VDS=0.5V VDD=1.5V VDET=1.7-4.8V
VDS=0.5V VDD=2.4V VDET=2.7-4.8V
VDD=VDS=7V Ta=-40~85°C
VDD=VDS=7V Ta=85~125°C
VDS=0.5V VDD=4.8V VDET=0.9-3.9V
VDS=0.5V VDD=6.0V VDET=4.0-4.8V
VDD=VDET×1.1, VDET=0.9-2.5V Ta=25°C
RL=470kΩ
VDD=VDET×1.1, VDET=2.6-4.8V Ta=25°C
RL=470kΩ
VDD=VDET×1.1 VCT=0.5V Ta=25°C
VCT=0.1V VDD=0.85V
VCT=0.5V VDD=1.5V VDET=1.7-4.8V
*1
Vdet/∆T Ta=-40°C ~125°C
∆VDET
Max.
Vdet(T)
×0.99
VDD=HL, Ta=25°C, RL=470kΩ
VDD=LHL
Ta=-40~125°C
RL=470kΩ
Limit
Typ.
Unit
V
µA
µA
V
mA
µA
mA
µA
mA
V
MΩ
µA
ppm/°C
V
*1: Designed guarantee. (Outgoing inspection is not done all products.)
VDET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step)
RL: Pull-up resistor to be connected between VOUT and power supply.
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© 2009 ROHM Co., Ltd. All rights reserved.
2/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
●Block Diagrams
BU42□□G/F/FVE
BU43□□G/F/FVE
VDD
VDD
VOUT
VOUT
Vref
Vref
CT
GND
CT
GND
Fig.1
Fig.2
TOP VIEW
TOP VIEW
TOP VIEW
SSOP5
SOP4
VSOF5
PIN No.
Symbol
Function
PIN No.
Symbol
Function
PIN No.
Symbol
Function
1
VOUT
Reset output
1
GND
GND
1
VOUT
Reset output
2
VDD
Power supply voltage
2
VDD
Power supply voltage
2
SUB
3
GND
GND
4
N.C.
Unconnected terminal
5
CT
Capacitor connection
terminal for output delay time
3
CT
4
VOUT
Capacitor connection terminal
for output delay time
Reset output
3
CT
Substrate*
Capacitor connection terminal
for output delay time
4
VDD
Power supply voltage
5
GND
GND
*Connect the substrate to VDD
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© 2009 ROHM Co., Ltd. All rights reserved.
3/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
"LOW" OUTPUT CURRENT : IOL [mA]
0.5
0.4
0.3
0.2
0.1
0.0
1
2
3
4
5
6
7
VDD =1.2V
1
0
0.0
1.0
1.5
2.0
2.5
VDD =4.8V
10
5
0
0
1
2
3
4
5
6
Fig.4 “LOW” Output Current
Fig.5 “High” Output Current
5
4
3
2
1
1
2
700
1.0
3
4
5
6
【BU4216F】
0.8
0.6
0.4
0.2
0.0
0.0
7
0.5
1.0
1.5
2.0
【BU4216F】
600
500
400
300
200
100
0
2.5
0
0.5
1
1.5
2
2.5
VDD SUPPLY VOLTAGE : VDD [V]
VDD SUPPLY VOLTAGE : VDD [V]
Fig.6 I/O Characteristics
Fig.7 Operating Limit Voltage
Fig.8 Ct Terminal Current
1.5
High to low(VDET)
【BU4216F】
1.0
-40
0
40
80
120
CIRCUIT CURRENT WHEN ON : IDD1 [μA]
Low to high(VDET+ΔVDET)
0.5
【BU4216F】
0.4
0.3
0.2
0.1
0.0
-40
TEMPERATURE : Ta[℃]
40
80
120
120
TEMPERATURE : Ta[℃]
Fig.12 Operating Limit Voltage
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© 2009 ROHM Co., Ltd. All rights reserved.
RESISTANCE OF CT : RCT [MΩ]
0.5
80
0.6
0.4
0.2
0.0
-40
0
80
120
10000
【BU4216F】
16
14
12
10
8
6
4
2
0
-40
40
Fig.11 Circuit Current when OFF
18
【BU4216F】
40
【BU4216F】
0.8
TEMPERATURE : Ta[℃]
Fig.10 Circuit Current when ON
1.0
0
1.0
TEMPERATURE : Ta[℃]
Fig.9 Detecting Voltage
Release Voltage
0.0
-40
0
CIRCUIT CURRENT WHEN OFF : IDD2 [μA]
VDD SUPPLY VOLTAGE :VDD [V]
2.0
MINIMUM OPERATING VOLTAGE : V OPL[V]
0.5
15
Fig.3 Circuit Current
OUTPUT VOLTAGE : VOUT [V]
OUTPUT VOLTAGE : VOUT [V]
2
VDD =6.0V
DRAIN-SOURCE VOLTAGE : VDS[V]
0
DETECTION VOLTAGE : VDET[V]
3
【BU4318G】
20
DRAIN-SOURCE VOLTAGE : VDS[V]
【BU4216F】
0
4
25
VDD SUPPLY VOLTAGE :VDD [V]
7
6
【BU4216F】
CT OUTPUT CURRENT : ICT [μA]
0
5
0
40
80
120
TEMPERATURE : Ta[℃]
Fig.13 Ct Terminal Circuit Resistance
4/11
【BU4216F】
1000
DELAY TIME : TPLH [ms]
CIRCUIT CURRENT : IDD [μA]
0.6
"HIGH" OUTPUT CURRENT : IOH [mA]
●Reference Data (Unless specified otherwise, Ta=25°C)
100
10
1
0.1
0.01
0.001
0.0001
0.001
0.01
0.1
CAPACITANCE OF CT : CCT[μF]
Fig.14 Delay Time (TPLH) and
CT Terminal External Capacitance
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
●Setting of Detector Delay Time
This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal.
Delay time at the rise of VDD TPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release
voltage(VDET+∆VDET)
VDD-VCTH
TPLH=-1×CCT×RCT×ln
CCT:
RCT:
VDD
CT pin Externally Attached Capacitance
CT pin Internal Impedance(P.2 RCT refer.) Ln:
VCTH:
CT pin Threshold Voltage(P.2 VCTH refer.)
Natural Logarithm
●Reference Data of Falling Time (TPHL) Output
Examples of Falling Time (TPHL) Output
Part Number
TPHL [µs]
BU4245G
275.7
BU4345G
359.3
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
●Explanation of Operation
For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as
threshold voltages. When the voltage applied to the Vdd pins reaches the applicable threshold voltage, the Vout terminal
voltage switches from either “High” to “Low” or from “Low” to “High”. BU42□□G/F/FVE and BU43□□G/F/FVE have delay
time function which set TPLH (Output “Low””High”) using an external capacitor (CCT). Because the BU42□□G/F/FVE
series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The
output “High” voltage (VOUT) in this case becomes VDD or the voltage of the other power supply].
VDD
VDD
VDD
Q2
R1
R1
RESET
Vref
VDD
Vref
RESET
VOUT
R2
R2
Q1
VOUT
Q1
Q3
Q3
R3
R3
GND
GND
CT
Fig.15 (BU42□□ type internal block diagram)
CT
Fig.16 (BU43□□ type internal block diagram)
●Timing Waveforms
Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output
voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in
Fig.15 and 16).
① When the power supply is turned on, the output is unsettled from
after over the operating limit voltage (VOPL) until TPHL. There fore it is
VDET+ΔVDET
possible
that the reset signal is not outputted when the rise time of
⑤
VDET
VDD
is
faster
than TPHL.
VDD
VOPL
②
When
V
DD is greater than VOPL but less than the reset release
0V
voltage (VDET+∆VDET), the CT terminal (VCT) and output (VOUT)
voltages will switch to L.
1/2 VDD
③ If VDD exceeds the reset release voltage (VDET+VDET), then VOUT
VCT
switches from L to H (with a delay to the CT terminal).
④ If VDD drops below the detection voltage (VDET) when the power
supply is powered down or when there is a power supply fluctuation,
TPLH
TPHL
TPLH
VOUT switches to L (with a delay of TPHL).
TPHL
VOUT
⑤ The potential difference between the detection voltage and the
release voltage is known as the hysteresis width (VDET). The system
① ②
③ ④
is designed such that the output does not flip-flop with power supply
Fig.17
fluctuations within this hysteresis width, preventing malfunctions due
to noise.
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© 2009 ROHM Co., Ltd. All rights reserved.
5/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
●Circuit Applications
1) Examples of a common power supply detection reset circuit
VDD1
VDD2
RL
Microcontroller
RST
BU42□□□
CIN
CT
CL
(Capacitor for
noise filtering)
GND
Fig.18 Open collector Output type
VDD1
Application examples of BU42□□G/F/FVE series
(Open Drain output type) and BU43□□G/F/FVE series
(CMOS output type) are shown below.
CASE1:The power supply of the microcontroller (Vdd2)
differs from the power supply of the reset detection
(Vdd1).
Use the Open Drain Output Type (BU42□□G/FVE)
attached a load resistance (RL) between the output and
Vdd2. (As shown Fig.18)
CASE2:The power supply of the microcontroller (Vdd1) is
same as the power supply of the reset detection (Vdd1).
Use CMOS output type (BU43□□G/FVE) or Open Drain
Output Type (BU42□□G/FVE) attached a load
resistance (RL) between the output and Vdd1.
(As shown Fig.19)
Microcontroller
CIN
CT
When a capacitance CL for noise filtering is connected to
the Vout pin (the reset signal input terminal of the
microcontroller), please take into account the waveform
of the rise and fall of the output voltage (Vout).
RST
BU43□□□
CL
(Capacitor for
noise filtering)
GND
Fig.19 CMOS Output type
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© 2009 ROHM Co., Ltd. All rights reserved.
6/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
2) Examples of the power supply with resistor dividers
In applications where the power supply input terminal (VDD) of an IC with resistor dividers, it is possible that a through
current will momentarily flow into the circuit when the output logic switches, resulting in malfunctions (such as output
oscillatory state).
(Through-current is a current that momentarily flows from the power supply (VDD) to ground (GND) when the output level
switches from “High” to “Low” or vice versa.)
V1
IDD
R2
I1
R1
Through
Current
VDD
BU42□□
BU43□□
CIN
VOUT
CL
GND
VDD
VDET
0
Fig.20
A voltage drop of [the through-current (I1)] × [input resistor (R2)] is caused by the through current, and the input voltage
to descends, when the output switches from “Low” to “High”. When the input voltage decreases and falls below the
detection voltage, the output voltage switches from “High” to “Low”. At this time, the through-current stops flowing through
output “Low”, and the voltage drop is eliminated. As a result, the output switches from “Low” to “High”, which again
causes the through current to flow and the voltage drop. This process is repeated, resulting in oscillation.
Consider the use of BU42□□ when the power supply input it with resistor dividers.
VDD - IDD Peak Current Ta=25°C
10
0.1
0.01
VDD3V
VDD6V
VDD7V
VDD4V
2.5
IDD peak Current[mA]
1
IDD-peak[mA]
Temp - IDD(BU42xx)
BU43xx
BU42xx
BD52xx
BD53xx
2.0
1.5
1.0
0.5
0.0
0.001
3
4
5
6
7
VDD[V]
8
9
10
-50 -30 -10
10
30 50
Temp
70
90
110 130
Fig.21 Current Consumption vs. Power Supply Voltage
* This data is for reference only.
The figures will vary with the application, so please confirm actual operating conditions before use.
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© 2009 ROHM Co., Ltd. All rights reserved.
7/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
●Notes for use
1. Absolute maximum range
Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the
failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given
when a specific mode to be beyond absolute maximum ratings is considered.
2 . GND potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins that are over ground even if include transient feature.
3 . Electrical Characteristics
Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature,
supply voltage, and external circuit.
4 . Bypass Capacitor for Noise Rejection
Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF.
If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point.
5 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the
IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is
mistaken the IC may be destroyed.
6 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
7 . The VDD line inpedance might cause oscillation because of the detection current.
8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.
9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition.
10. Case of needless Delay time, recommended to insert more 470kΩ resister between VDD and CT.
Recommended value of RL Resistar is over 50kΩ (VDET=1.5~4.8V),over 100kΩ (VDET=0.9~1.4V).
12. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause
unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed
between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the VDD terminal would be
recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor
should be less than 1/10 of the assumed leak resistance.
The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time
that is decided by τ × RCT × CCT changes.
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© 2009 ROHM Co., Ltd. All rights reserved.
8/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
13.
Technical Note
Delay time (tPLH)
tPLH = τ × RCT × CCT (sec)
τ: time constant
RCT : 10MΩ (typ.) (built-in resistor)
CCT : capacitor connected CT pin.
Recommended value of CCT capacitor is over 100pF.
The reference value
6
(τ × RCT) ×10
VDET = 0.9 to 2.5V
6
6
6
Ta = 25°C
(min. = 5.1 × 10 typ.= 6.0 × 10 max = 6.9 × 10 )
6
6
6
Ta = -25 to 125°C (min. = 3.3 × 10 typ. = 6.0 × 10 max = 8.7 × 10 )
VDET = 2.6 to 4.8V
6
6
6
Ta = 25°C
(min. = 5.9 × 10 typ.= 6.9 × 10 max = 7.9 × 10 )
6
6
6
Ta = -25 to 125°C (min. = 3.8 × 10 typ.= 6.9 × 10 max = 10.0 × 10 )
14. External parameters
The recommended parameter range for CT is 100pF~0.1µF. For RL, the recommended range is 50kΩ~1MΩ. There
are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications.
15. CT pin discharge
Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input
pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.
16. Power on reset operation
Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation.
17. Precautions for board inspection
Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC.
Therefore, be certain to use proper discharge procedure before each process of the test operation.
To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any
equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer
and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is
OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup.
18. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic
unsettled, the couple capacitance, GND pattern of width and leading line must be considered.
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© 2009 ROHM Co., Ltd. All rights reserved.
9/11
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
●Part Number Selection
B
U
4
2
0
BU42: Adjustable Delay Time
CMOS Reset IC
Open Drain Type
Output Type
BU43: Adjustable Delay Time
CMOS Reset IC
CMOS Output Type
9
G
Detection voltage
09 : 0.9V (0.1V step)
48 : 4.8V
-
Package
G: SSOP5
F: SOP4
FVE: VSOF5
T
R
Taping Specifications
TR: Embossed tape and reel
SSOP5
5
4
1
2
0.2Min.
+0.2
1.6 −0.1
2.8±0.2
<Tape and Reel information>
+6°
4° −4°
2.9±0.2
3
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
+0.05
0.13 −0.03
+0.05
0.42 −0.04
0.05±0.05
1.1±0.05
1.25Max.
)
0.95
0.1
Direction of feed
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
SOP4
+6°
4° –4°
1.3
4
3
0.9±0.05
1
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
2
0.05
+0.05
0.13 –0.03
1pin
S
0.05±0.05
1.05Max.
2.1±0.2
0.27±0.15
+0.2
1.25 –0.1
<Tape and Reel information>
2.0±0.2
+0.05
0.42 –0.04
0.1
S
+0.05
0.32 –0.04
Direction of feed
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
10/11
∗ Order quantity needs to be multiple of the minimum quantity.
2009.11 - Rev.C
BU42□□G series, BU42□□F series, BU42□□FVE series,
BU43□□G series, BU43□□F series, BU43□□FVE series
Technical Note
VSOF5
<Tape and Reel information>
1.2 ± 0.05
1.6 ± 0.05
4
(MAX 1.28 include BURR)
5
0.2MAX
1.6±0.05
1.0±0.05
Tape
Embossed carrier tape
Quantity
3000pcs
Direction
of feed
TR
The direction is the 1pin of product is at the upper right when you hold
( reel on the left hand and you pull out the tape on the right hand
)
1pin
1
2
3
0.6MAX
0.13±0.05
0.5
Direction of feed
0.22±0.05
(Unit : mm)
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© 2009 ROHM Co., Ltd. All rights reserved.
Reel
11/11
∗ Order quantity needs to be multiple of the minimum quantity.
2009.11 - Rev.C
Notice
Notes
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consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
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The Products specified in this document are intended to be used with general-use electronic
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The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
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The Products are not designed or manufactured to be used with any equipment, device or
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