TI1 DRV2603 Haptic driver with auto resonance tracking for linear resonance actuators (lra) and optimized drive for eccentric rotating mass actuators (erm) Datasheet

DRV2603
www.ti.com
SLOS786 – APRIL 2012
Haptic Driver with Auto Resonance Tracking for Linear Resonance Actuators (LRA) and
Optimized Drive for Eccentric Rotating Mass Actuators (ERM)
FEATURES
DESCRIPTION
•
The DRV2603 is a haptic driver designed specifically
to solve common obstacles in driving both Linear
Resonance Actuator (LRA) and Eccentric Rotating
Mass (ERM) haptic elements. The DRV2603 is also
designed for low latency, has excellent efficiency, and
plenty of drive strength for actuators commonly used
in the portable market.
1
•
•
•
•
•
•
•
•
•
Flexible Haptic/Vibra Driver
– LRA (Linear Resonance Actuator)
– ERM (Eccentric Rotating Mass)
Auto Resonance Tracking for LRA
– No Frequency Calibration Required
– Automatic Drive Commutation
– Automatic Braking Algorithm
– Wide Input PWM Frequency Range
Constant Vibration Strength Over Supply
Automatic Input Level Translation
0% to 100% Duty Cycle Control Range
Fast Start Up Time
Differential Drive from Single-Ended Input
Wide Supply Voltage Range of 2.5 V to 5.2 V
1.8 V Compatible, 5 V Tolerant Digital Pins
Available in a 2 mm × 2 mm × 0.75 mm
leadless QFN package (RUN)
LRA actuators typically have a narrow frequency
band over which they have an adequate haptic
response. This frequency window is typically ±2.5 Hz
wide or less, so driving an LRA actuator presents a
challenge. The DRV2603 solves this problem by
employing
auto
resonance
tracking,
which
automatically detects and tracks the optimum
commutation frequency. This means that any input
PWM frequency within the input range (10 kHz to 250
kHz) will automatically produce the correct resonant
output frequency. As an additional benefit, the
DRV2603 implements an optimal braking algorithm to
stop the LRA from ringing out, leaving the user with a
crisp haptic sensation.
For both ERM and LRA actuators, the DRV2603
automatic input level translation solves issues with
low voltage PWM sources without adding additional
external components, so if the digital I/O levels vary,
the output voltage does not change. The DRV2603
also has supply correction that ensures no supply
regulation is required for constant vibration strength,
allowing an efficient, direct-battery connection.
APPLICATIONS
•
•
•
Mobile Phones
Tablets
Touch Enabled Devices
VDD
DRV2603
2.5 V – 5.2 V
VDD
Gate
Drive
Supply
Correction
EN
LRA / ERM
PWM
Level
Correction
Control
Engine
OUT+
LRA or
DC Motor
Back-EMF
Detection
Gate
Drive
OUT-
GND
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
Copyright © 2012, Texas Instruments Incorporated
PRODUCT PREVIEW
Check for Samples: DRV2603
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jul-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
DRV2603RUNR
ACTIVE
QFN
RUN
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DRV2603RUNT
ACTIVE
QFN
RUN
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DRV2603RUNR
QFN
RUN
10
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
DRV2603RUNT
QFN
RUN
10
250
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DRV2603RUNR
QFN
RUN
10
3000
210.0
185.0
35.0
DRV2603RUNT
QFN
RUN
10
250
210.0
185.0
35.0
Pack Materials-Page 2
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