Rohm BM6201FS 600v prestomosâ ¢ built-in three phase brushless fan motor driver Datasheet

BM6201FS
For air-conditioner fan motor
600V PrestoMOS™ built-in
Three phase brushless fan motor driver
BM6201FS
 General Description
This motor driver IC adopts PrestoMOS™ as the output
transistor, and put in a small full molding package with
the high voltage gate driver chip. The protection circuits
~ overcurrent, overheating, under voltage lock out ~ and
the high voltage bootstrap diode with current regulation
are built into, and provides optimum motor drive system
for a wide variety of applications by the combination with
controller BD6201X series, and enables motor unit
standardization.
 Key Specifications
Output MOSFET voltage:
600V
Driver output current (DC):
±1.5A(Max.)
Driver output current (Pulse):
±2.5A(Max.)
Output MOSFET DC on resistance:
2.7Ω (Typ.)
Operating case temperature:
-20°C to +100°C
Power dissipation:
3.0W
 Package
SSOP-A54_42
 Features
600V PrestoMOS™ built-in
Output current 1.5A
Bootstrap operation by floating high side driver
(including diode)
3.3V logic input compatible
Protection circuits provided: OCP, TSD and UVLO
Fault output (open drain)
W(Typ.) x D(Typ.) x H(Max.)
22.0mm x 14.1mm x 2.4mm
 Applications
Air conditioners; air cleaners; water pumps;
dishwashers; washing machines
General OA equipment
SSOP-A54_42
 Typical Application Circuit
VREG
FG
R8
Q1
C13
R1
VSP
R9
DTR
C7
C14
BD6201X
C1
C2~C4
C8
HW
HV
HU
R2
M
VREG
C11
C5
C9
C10
R5
R4
VCC
GND
R3
C6
BM6201FS
D1
R6
R7
C12
VDC
Fig.1
Application circuit example - BM6201FS & BD6201X
Product structure : Silicon hybrid integrated circuit
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Datasheet
BM6201FS
 Block diagram and pin configuration
VDC
VCC
VDC
VCC
1
FOB
42 41
5
UL
6
VDC
VDC
FOB
BU
3
40
FAULT
UH
VCC
SDB
39
LEVEL SHIFT
&
GATE DRIVER
38
BU
UH
UL
U
U
U
U
FAULT
TRIP
BV
37
BV
VL 13
SDB
36
LEVEL SHIFT
&
GATE DRIVER
35
34
FAULT
TRIP
33
32
V
V
M
VDC
VDC
VDC
VDC
BW
WH
WL
WH 20
W
WL
21
SDB
31
LEVEL SHIFT
&
GATE DRIVER
30
TRIP
29
28
BW
W
W
W
FOB
PGND
FAULT
FOB 23
V
V
VH
VL
VH 12
PGND
VCC
PGND
PGND
VCC 25
GND
GND
27
Fig.2 Block diagram
Fig.3 Pin configuration
 Pin descriptions (NC: No Connection)
Pin
Name
1
VCC
2
NC
3
FOB
4
NC
5
UH
6
UL
7
NC
:
Function
Pin
Name
42
VDC
High voltage power supply
41
VDC
High voltage power supply
40
BU
Phase U high side control input
39
U
Phase U output
Phase U low side control input
38
U
Phase U output
:
37
BV
11
NC
36
V
Phase V output
12
VH
Phase V high side control input
35
V
Phase V output
13
VL
Phase V low side control input
14
NC
Low voltage power supply
Function
Fault signal output (open drain)
Phase U floating power supply
Phase V floating power supply
:
:
34
VDC
High voltage power supply
19
NC
33
VDC
High voltage power supply
20
WH
Phase W high side control input
21
WL
Phase W low side control input
22
NC
32
BW
Phase W floating power supply
23
FOB
31
W
Phase W output
24
NC
30
W
Phase W output
25
VCC
26
NC
29
PGND
Ground (current sense pin)
27
GND
28
PGND
Ground (current sense pin)
Fault signal output (open drain)
Low voltage power supply
Ground
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Datasheet
BM6201FS
 Functional descriptions
1) Control input pins (UH, UL, VH, VL, WH, WL)
Truth table
The input threshold voltage of the control pins are 2.5V and 0.8V, with a hysteresis
voltage of approximately 0.4V. The IC will accept input voltages up to the VCC voltage.
When the same phase control pins are input high at the same time, the high side and low
side gate driver outputs low. However, it wishes measures as the dead time is installed in
the control signals. The control input pins are connected internally to pull-down resistors
(100kΩ nominal). However, when the switching noise on the output stage may affect the
input on these pins and cause undesired operation. In such cases, attaching an external
pull-down resistor (10kΩ recommended) between each control pin and ground, or
connecting each pin to an input voltage of 0.8V or less (preferably GND), is
recommended.
HIN
LIN
HO
LO
L
L
L
L
H
L
H
L
L
H
L
H
H
H
Inhibition
2) Under voltage lock out (UVLO) circuit
To secure the lowest power supply voltage necessary to operate the driver, and to prevent under voltage malfunctions,
the UVLO circuits are independently built into the upper side floating driver and the lower side driver. When the supply
voltage falls to VUVL or below, the controller forces driver outputs low. When the voltage rises to VUVH or above, the UVLO
circuit ends the lockout operation and returns the chip to normal operation. Even if the controller returns to normal
operation, the output begins from the following control input signal.
VCC
VCCUVH
VCCUVL
HIN
LIN
HO
LO
VB
VBUVH
VBUVL
HIN
LIN
HO
LO
Fig.4 Low voltage monitor - UVLO - timing chart
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Datasheet
BM6201FS
3) Bootstrap operation
VB
DX
L
HO
VB
VDC
DX
CB
OFF
H
VS
HO
VDC
CB
ON
VS
VCC
VCC
H
LO
L
ON
Fig.5 Charging period
LO
OFF
Fig.6 Discharging period
The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap
capacitor (CB) as shown in the above figure. In a word, this operation is repeated while the output of an external
transistor is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the
VCC power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V).
The resistance series connection with DX has the impedance of approximate 200Ω.
The capacitance value for the bootstrap is following:
Example)
Floating driver power supply quiescence current IBBQ : 150µA(max.)
Bootstrap diode reverse bias current ILBD : 10µA(max.)
Carrier frequency FPWM : 20kHz
Output MOSFET total gate charge Qg : 25nC(max.)
Floating driver transmission loss QLOSS : 1nC(max.)
Drop voltage of the floating driver power supply dVDROP : 3V
CBOOT » (( IBBQ + ILBD ) / FPWM + 2 x Qg + QLOSS ) / dVDROP ≈ 20nF
The drop voltage can be allowed actually becomes small further by the range of the use power supply voltage, the output
MOSFET on resistance, the forward voltages of the internal boot diode (the drop voltage to the capacitor by the charge
current), and the power supply voltage monitor circuits etc. Please set the tenfold or more the calculation value to the
criterion about the capacitance value to secure the margin in consideration of temperature characteristics and the value
change, etc. Moreover, the example of the mentioned above assumes the synchronous rectification switching. Because
the total gate charge is needed only by the carrier frequency in the upper switching section, for example 150°
commutation driving, it becomes a great capacity shortage in the above settings. Please set it after often confirming
actual application operation.
4) Thermal shutdown (TSD) circuit
The TSD circuit operates when the junction temperature of the gate driver exceeds the preset temperature (150°C
nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,
the chip returns to normal operation when the junction temperature falls below the preset temperature (125°C nominal).
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not use the IC in an environment where activation of the circuit is assumed. Moreover, it is not possible to follow
to the output MOSFET junction temperature rising rapidly because it is a gate driver chip that monitors the temperature
and it is likely not to function effectively.
5) Overcurrent protection (OCP) circuit
The overcurrent protection circuit can be activated by connecting a low value resistor for current detection between the
PGND pin and the GND pin. When the PGND pin voltage reaches or surpasses the threshold value (0.9V nominal), the
gate driver outputs low to the gate of all output MOSFETs, thus initiating the overcurrent protection operation.
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BM6201FS
6) Fault signal output
When the gate driver detects the either state that should be protected, voltage monitor (UVLO), overheating (TSD) or
overcurrent (OCP), the FOB pin outputs low (open drain). When these are detected with either of the gate driver chip
because the FOB pin is wired-OR connection with each phase gate driver chip internally, another phase also entering the
protection operation. Even when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least
the resistor 10kΩ or more. Moreover, the signal from the outside of the chip is not passed built-in analog filter, but the
internal control signals (UVLO / TSD / OCP) passes the filter (2.0µs Min.) for the malfunction prevention by the switching
noise etc.
TSD
OCP
UVLO
FILTER
SHUTDOWN
FOB
FAULT
Fig.7 Fault signal bi-directional input pin interface
The release time of return from the protection operation can be change to insert the external capacitor. Refer to the
formula to the below. 2ms or more is recommended.
2.0
VPU
10
) · R · C [s]
9
8
Release time: t [ms]_
t = - ln ( 1 -
VPU
R
FOB
VPU = 5V
7
6
VPU = 15V
5
4
3
2
C
1
0
0.01
0.1
1
Capacitance: C [µF]
Fig.8 Release time setting application circuit
Fig.9 Release time (reference data @R=100kΩ)
When using controller BD6201X series as a control IC, since the external fault signal input pin of the side of the control
IC has the internal pull-up resistor, it can be directly linked with FOB pin. Refer to figure 10.
BD6201XFS
BM6201FS
VREG
100k
FIB
FOB
C
Fig.10 Interface equivalent circuit
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Datasheet
BM6201FS
7) Switching time
XH, XL
VDS
trr
ton
td(on)
tr
90%
90%
ID
10%
10%
td(off)
tf
toff
Fig.11 Switching time definition
Parameter
High side switching time
Low side switching time
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Symbol
tdH(on)
trH
trrH
tdH(off)
tfH
tdL(on)
trL
trrL
tdL(off)
tfL
Reference
820
110
200
590
20
880
120
180
670
50
6/19
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Conditions
VDC=300V, VCC=15V, ID=0.75A
VIN= 0V↔5V, Inductive load
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Datasheet
BM6201FS
 Absolute maximum ratings (Ta=25°C)
Parameter
Output MOSFET
Ratings
Symbol
Unit
BM6201FS
600*1
VDSS
V
1
Supply voltage
VDC
-0.3 to 600*
V
Output voltage
VU, VV, VW
-0.3 to 600*1
V
1
High side supply pin voltage
High side floating supply voltage
VBU, VBV, VBW
-0.3 to 600*
V
VBU-VU, VBV-VV, VBW-VW
-0.3 to 20
V
Low side supply voltage
VCC
-0.3 to 20
V
All others
VI/O
-0.3 to VCC
V
Driver outputs (DC)
IOMAX(DC)
±1.5*2
A
Driver outputs (Pulse)
IOMAX(PLS)
±2.5*2
A
Fault signal output
Power dissipation
Thermal resistance
Operating case temperature
1
IOMAX(FOB)
5*
mA
3
Pd
3.00*
W
Rthj-c
15
°C/W
TC
-20 to 100
°C
Storage temperature
TSTG
-55 to 150
°C
Junction temperature
Tjmax
150
°C
*1 Do not, however, exceed Pd or ASO.
*2 Pw ≤ 10µs, Duty cycle ≤ 1%
*3 Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/°C above 25°C.
 Operating conditions (Tc=25°C)
Parameter
Supply voltage
Range
Symbol
Min.
Typ.
Max.
Unit
VDC
-
310
400
V
VBU-VU, VBV-VV, VBW-VW
13.5
15
16.5
V
Low side supply voltage
VCC
13.5
15
16.5
V
Minimum input pulse width
TMIN
0.8
-
-
µs
Dead time
TDT
1.5
-
-
µs
Shunt resistor (PGND)
RS
0.4
-
-
Ω
Junction temperature
Tj
-
-
125
°C
High side floating supply voltage
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Datasheet
BM6201FS
 Electrical characteristics (Unless otherwise specified, Ta=25°C and VCC=15V)
Parameter
Symbol
Limits
Min.
Typ.
Max.
Unit
Conditions
Power supply
HS quiescence current
IBBQ
30
70
150
µA
XH=XL=L, each phase
LS quiescence current
ICCQ
0.4
0.9
1.5
mA
XH=XL=L
V(BR)DSS
600
-
-
V
Output MOSFET
D-S breakdown voltage
Leak current
ID=1mA, XH=XL=L
IDSS
-
-
100
µA
VDS=600V, XH=XL=L
RDS(ON)
-
2.7
3.5
Ω
ID=0.75A
VSD
-
1.1
1.5
V
ID=0.75A
Leak current
ILBD
-
-
10
µA
VBX=600V
Forward voltage
VFBD
1.5
1.8
2.1
V
IBD=-5mA, including series-R
Series resistance
RBD
-
200
-
Ω
Input bias current
IXIN
30
50
70
µA
Input high voltage
VXINH
2.5
-
VCC
V
Input low voltage
VXINL
0
-
0.8
V
VBUVH
9.5
10.0
10.5
V
VBX - VX
VBX - VX
DC on resistance
Diode forward voltage
Bootstrap diode
Control inputs
VIN=5V
UVLO
HS release voltage
HS lockout voltage
VBUVL
8.5
9.0
9.5
V
LS release voltage
VCCUVH
11.0
11.5
12.0
V
LS lockout voltage
VCCUVL
10.0
10.5
11.0
V
VSNS
0.8
0.9
1.0
V
Output low voltage
VFOL
-
-
0.8
V
Input high voltage
VFINH
2.5
-
VCC
V
Input low voltage
VFINL
0
-
0.8
V
Noise masking time
TMASK
2.0
-
-
µs
Overcurrent protection
Threshold voltage
Fault output
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Datasheet
BM6201FS
2.0
2.0
1.5
1.5
Supply Current : Icc [mA]
Supply Current : Icc [mA]
 Typical performance curves (Reference data)
1.0
0.5
1.0
0.5
125°C
25°C
-25°C
0.0
0.0
12
14
16
18
20
12
14
16
18
20
Supply Voltage : VCC [V]
Supply Voltage : VCC [V]
Fig.12 Quiscence current
(Low side drivers)
Fig.13 Low side drivers operating current
(FPWM:20kHz, one phase switching)
3.0
120
Supply Current : IQVBX [µA] _
Supply Current : Icc [mA]
125°C
25°C
-25°C
2.5
2.0
1.5
125°C
25°C
-25°C
1.0
100
80
60
40
125°C
25°C
-25°C
20
12
14
16
18
20
12
14
16
18
Supply Voltage : VCC [V]
Supply Voltage : VBX-VX [V]
Fig.14 Low side drivers operating current
(FPWM:20kHz, two phase switching)
Fig.15 Quiescence current
(High side driver, each phase)
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BM6201FS
 Typical performance curves (Reference data) - Continued
250
250
200
150
125°C
25°C
-25°C
Input Current : IHIN/ILIN [µA] _
Supply Current : I QVBX [µA] _
300
200
150
100
50
125°C
25°C
-25°C
0
100
12
14
16
18
0
20
5
Fig.16 High side driver operating current
(FPWM:20kHz, each phase)
15
20
Fig.17 Input bias current
(UH,UL,VH,VL,WH,WL)
20
20
125°C
25°C
-25°C
Internal Logical Voltage : V OUT [V]
Internal Logical Voltage : V OUT [V]
10
Input Voltage : VHIN/VLIN [V]
Supply Voltage : VBX-VX [V]
15
10
5
0
125°C
25°C
-25°C
15
10
5
0
1.0
1.5
2.0
2.5
0.6
0.7
0.8
0.9
1.0
1.1
Input Voltage : VIN [V]
Input Voltage : VPGND [V]
Fig.18 Input threshold voltage
(UH,UL,VH,VL,WH,WL,FOB)
Fig.19 Overcurrent detection voltage
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Datasheet
BM6201FS
 Typical performance curves (Reference data) - Continued
8
Noise Masking Time : TMASK [µs]
Internal Logical Voltage : V OUT [V]
20
15
10
5
6
4
2
TSD
UVLO
OCP
0
0
-25
100 110 120 130 140 150 160 170 180
Fig.20 Thermal shut down
25
50
75
100
125
Fig.21 Noise masking time
1.0
200
0.8
150
Output Voltage : V FOB [V]
Propagation Delay Time : TdFOB [ns]
0
Junction Temperature : Tj [°C]
Junction Temperature : Tj [°C]
100
ON
OFF
50
0.6
0.4
0.2
0
125°C
25°C
-25°C
0.0
-25
0
25
50
75
100
125
0
2
4
6
8
Junction Temperature : Tj [°C]
Output Current : IFOB [mA]
Fig.22 External fault input propagation delay
(FOB)
Fig.23 Fault output on resistance
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Datasheet
BM6201FS
 Typical performance curves (Reference data) - Continued
20
Internal Logical Voltage : V
OUT
[V]
Internal Logical Output Voltage : V OUT [V]
20
125°C
25°C
-25°C
15
125°C
25°C
-25°C
10
5
0
10
5
0
8
9
10
11
12
13
8
9
10
11
12
Supply Voltage : VBX - VX [V]
Supply Voltage : VCC [V]
Fig.24 Under voltage lock out
(High side driver, each phase)
Fig.25 Under voltage lock out
(Low side drivers)
1500
13
1500
Solid : Low side
Dashed : High side
Input/Output Propagation Delay : Td [ns]
Minimum Input Pulse Width : T PWmin [ns]
125°C 125°C
25°C
25°C
-25°C
-25°C
15
1000
500
0
Solid : Td(ON)
Dashed : Td(OFF)
1000
500
0
12
13
14
15
16
17
18
12
Supply Voltage : VCC [V]
14
15
16
17
18
Supply Voltage : VCC [V]
Fig.26 Minimum input pulse width
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Fig.27 Input/Output propagation delay
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Datasheet
BM6201FS
 Typical performance curves (Reference data) - Continued
2.0
125°C
25°C
-25°C
6
Forward Voltage : V SD [V]
Output On Resistance : R DSON [ohm]
8
4
2
1.5
1.0
0.5
-25°C
25°C
125°C
0
0.0
0.0
0.5
1.0
1.5
2.0
0.0
0.5
1.0
1.5
2.0
Drain Current : IDS [A]
Source Current : ISD [A]
Fig.28 Output MOSFET on resistance
Fig.29 Output MOSFET body diode
1.2
4
125°C
25°C
-25°C
3
Voltage : VBOOTR [V]
Forward Voltage : V FBD [V]
1.0
0.8
0.6
0.4
1
-25°C
25°C
125°C
0.2
2
0
0.0
0
2
4
6
8
10
0
Bootstrap Diode Current : IBD [mA]
4
6
8
10
Bootstrap Series Resistor Current : IBR [mA]
Fig.30 Bootstrap diode forward voltage
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Fig.31 Bootstrap series resistor
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Datasheet
BM6201FS
 Typical performance curves (Reference data) - Continued
15
200
125°C
25°C
-25°C
-25°C
25°C
125°C
EON
150
E [µJ]
E [µJ]
10
100
5
50
EOFF
0
0
0.0
0.5
1.0
0.0
1.5
Drain Current : IO [A]
0.5
1.0
1.5
Drain Current : IO [A]
Fig.32 High side switching loss
(VDC=300V)
Fig.33 High side recovery loss
(VDC=300V)
15
200
125°C
25°C
-25°C
-25°C
25°C
125°C
EON
150
E [µJ]
E [µJ]
10
100
5
50
EOFF
0
0
0.0
0.5
1.0
0.0
1.5
Drain Current : IO [A]
1.0
1.5
Drain Current : IO [A]
Fig.34 Low side switching loss
(VDC=300V)
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
0.5
Fig.35 Low side recovery loss
(VDC=300V)
14/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
BM6201FS
 Application circuit example
VREG
FG
R8
Q1
C13
R1
VSP
R9
DTR
IC2
C1
C7
C14
C2~C4
C8
HW
HV
HU
R2
M
VREG
C11
C5
C9
C10
R5
R4
R3
VCC
GND
C6
R6
IC1
D1
R7
C12
VDC
Fig.36
Parts list
Parts
Value
Manufacturer
Application circuit example (150° commutation driver)
Type
Parts
Value
Ratings
Type
IC1
-
ROHM
BM6201FS
C1
0.1µF
50V
Ceramic
IC2
-
ROHM
BD62012FS
C2~4
2200pF
50V
Ceramic
R1
1kΩ
ROHM
MCR18EZPF1001
C5
10µF
50V
Ceramic
R2
150Ω
ROHM
MCR18EZPJ151
C6
10µF
50V
Ceramic
R3
22kΩ
ROHM
MCR18EZPF2202
C7~9
1µF
50V
Ceramic
R4
100kΩ
ROHM
MCR18EZPF1003
C10
0.1µF
50V
Ceramic
R5
100kΩ
ROHM
MCR18EZPF1003
C11
1µF
50V
Ceramic
R6
0.5Ω
ROHM
MCR50JZHFL1R50 x 3
C12
100pF
50V
Ceramic
R7
10kΩ
ROHM
MCR18EZPF1002
C13
0.1µF
630V
Ceramic
R8
0Ω
ROHM
MCR18EZPJ000
C14
0.1µF
50V
Ceramic
R9
0Ω
ROHM
MCR18EZPJ000
HX
-
-
Hall elements
Q1
-
ROHM
DTC124EUA
D1
-
ROHM
KDZ20B
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TSZ22111 · 15 · 001
15/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
BM6201FS
 Interfaces
VREG
UH
UL
VH
VL
WH
WL
BX
VDC
PGND
100k
X
Fig.37 UH, UL, VH, VL, WH, WL
Fig.38 PGND
VCC
VREG
FOB
PGND
GND
Fig.39 FOB
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
Fig.40 VCC, GND, VDC, BX(BU/BV/BW), X(U/V/W)
16/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
BM6201FS
 Notes for use
1) Absolute maximum ratings
Devices may be destroyed when supply voltage or operating temperature exceeds the absolute maximum rating. Because
the cause of this damage cannot be identified as, for example, a short circuit or an open circuit, it is important to consider
circuit protection measures – such as adding fuses – if any value in excess of absolute maximum ratings is to be
implemented.
2) Electrical potential at GND
Keep the GND terminal potential to the minimum potential under any operating condition. In addition, check to determine
whether there is any terminal that provides voltage below GND, including the voltage during transient phenomena.
However, note that even if the voltage does not fall below GND in any other operating condition, it can still swing below
GND potential when the motor generates back electromotive force at the PGND pin. The chip layout in this product is
designed to avoid this sort of electrical potential problem, but pulling excessive current may still result in malfunctions.
Therefore, it is necessary to observe operation closely to conclusively confirm that there is no problem in actual operation.
If there are a small signal GND and a high current GND, it is recommended to separate the patterns for the high current
GND and the small signal GND and provide a proper grounding to the reference point of the set not to affect the voltage at
the small signal GND with the change in voltage due to resistance component of pattern wiring and high current. Also for
GND wiring pattern of the component externally connected, pay special attention not to cause undesirable change to it.
3) High voltage terminal – VDC, BU/U, BV/V and BW/W
When using this IC, the high voltage terminals - VDC, BU/U, BV/V and BW/W - need a resin coating between these pins, it
is judged the inter-pins distance not enough. If any special mode in excess of absolute maximum ratings is to be
implemented with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, if VCC and VDC are short-circuited with
0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
4) Power supply lines
Return current generated by the motor’s Back-EMF requires countermeasures, such as providing a return current path by
inserting capacitors across the power supply and GND (10µF, ceramic capacitor is recommended). In this case, it is
important to conclusively confirm that none of the negative effects sometimes seen with electrolytic capacitors – including a
capacitance drop at low temperatures - occurs. Also, the connected power supply must have sufficient current absorbing
capability. Otherwise, the regenerated current will increase voltage on the power supply line, which may in turn cause
problems with the product, including peripheral circuits exceeding the absolute maximum rating. To help protect against
damage or degradation, physical safety measures should be taken, such as providing a voltage clamping diode across the
power supply and GND.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together. Also, connecting the power supply in reverse polarity can damage the IC.
Take precautions against reverse polarity when connecting the power supply lines, such as establishing an external diode
between the power supply and the IC power supply pin.
7) Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunctions. Use extreme caution with electromagnetic
fields.
8) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a low impedance pin subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
9) Regarding the input pin of the IC
Do not force the voltage to the input pins when the power does not supply to the IC. Also, do not force the voltage to the
input pins exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied
to the IC.
Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority.
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TSZ22111 · 15 · 001
17/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
BM6201FS
 Ordering information
B M 6
2
0
1
ROHM Part Number
BM6201 : 600V/1.5A
BM6202 : 600V/2.5A
F
S
-
Package
FS : SSOP-A54_42
E
2
Packaging specification
E2 : Embossed taping
 Physical dimension, tape and reel information
SSOP-A54_42
<Tape and Reel information>
Tape
Embossed carrier tape
Quantity
1000pcs
Direction
of feed
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
1pin
Reel
)
Direction of feed
∗ Order quantity needs to be multiple of the minimum quantity.
 Marking diagram
SSOP-A54_42
(TOP VIEW)
PRODUCT NAME
BM6201FS
1PIN MARK
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
LOT No.
18/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
BM6201FS
 Revision history
Date
Revision
26.MAR.2012
001
Changes
New release
http://www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 · 15 · 001
19/19
TSZ02201-0828AB400010-1-2
26.MAR.2012 Rev.001
Datasheet
Notice
●General Precaution
1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2) All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
●Precaution on using ROHM Products
1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
2)
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3)
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4)
The Products are not subject to radiation-proof design.
5)
Please verify and confirm characteristics of the final or mounted products in using the Products.
6)
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7)
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8)
Confirm that operation temperature is within the specified range described in the product specification.
9)
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Precaution for Mounting / Circuit board design
1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2)
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
●Precautions Regarding Application Examples and External Circuits
1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2)
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
●Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
●Precaution for Storage / Transportation
1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2)
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3)
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4)
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
●Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
●Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
●Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
●Precaution Regarding Intellectual Property Rights
1) All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2)
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
Datasheet
●Other Precaution
1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2)
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3)
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4)
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5)
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.003
© 2012 ROHM Co., Ltd. All rights reserved.
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