TD62S050AFM Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Collector-emitter voltage VCEO 50 V Output withstand voltage VCE (SUS) 50 V Output current IOUT 500 mA Input voltage VIN -0.5~30 V Clamp diode reverse voltage VR 50 V Clamp diode forward current IF 500 mA PD (Note 4) 0.78 W Rth (j-a) (Note 4) 160 Power dissipation °C/W Saturated thermal resistance Rth (j-c) (Note 5) 25 Operating temperature Topr -40~85 °C Storage temperature Tstg -55~150 °C Note 4: 114.3 ´ 76.2 ´ 1.6 mm glass epoxy film substrate Cu heat dissipation pattern 100 mm 2 Note 5: When an infinite heat sink is mounted. Recommended Operating Condition (Ta = -40~85°C) Characteristics Symbol Test Condition Min Typ. Max Unit Output withstand voltage VCEO ¾ 0 ¾ 50 V Output current IOUT ¾ ¾ 220 mA Input voltage VIN 0 ¾ 24 V 2.8 ¾ 24 Ta = 60°C, Tj = 105°C ¾ IOUT = 400 mA, hFE = 800 Output ON VIN (ON) Output OFF VIN (OFF) ¾ 0 ¾ 0.7 Clamp diode reverse voltage VR ¾ ¾ ¾ 50 V Clamp diode forward current IF ¾ ¾ ¾ 350 mA Min Typ. Max Unit VCE = 50 V, VIN = OPEN ¾ ¾ 10 mA IOUT = 300 mA, IIN = 500 mA ¾ 1.1 1.3 IOUT = 200 mA, IIN = 350 mA ¾ 1.0 1.2 Input voltage V Electrical Characteristics (Ta = 25°C) Symbol Test Circuit ICEX 1 VCE (sat) 2 hFE 2 VCE = 2.0 V, IOUT = 350 mA 1000 ¾ ¾ IIN (ON) 3 VIN = 2.4 V, IOUT = 350 mA ¾ 0.4 0.7 4 VCE = 2 V, hFE = 800 IOUT = 350 mA ¾ ¾ 2.6 VIN (ON) IOUT = 200 mA ¾ ¾ 2.2 Clamp diode leakage current IR 5 VR = 50 V ¾ ¾ 10 mA Clamp diode forward voltage VF 6 IF = 350 mA ¾ 1.6 2.0 V Turn-on delay tON VOUT = 50 V, RL = 125 W, CL = 15 pF ¾ 0.02 7 ¾ ¾ 1.0 ¾ Characteristics Output leakage current Output saturation voltage DC current amplification ratio Input current Output ON Output ON Input voltage Output ON Turn-off delay tOFF Test Condition 2 V mA V ms 2001-12-05 TD62S050AFM Test Circuit 2. VCE (sat)、hFE 1. ICEX OPEN OPEN ICEX OPEN IIN IOUT VCE VIN VCE, VCE (sat) 3. IIN (ON) 4. VIN (ON) OPEN OPEN IOUT IIN (ON) IOUT VIN VIN (ON) 5. IR VCE 6. VF VF IR OPEN IF OPEN VR OPEN OPEN 7. tON, tOFF INPUT OPEN tr VOUT tf 5V Pulse generator (Note 6) 90% 90% INPUT RL OUTPUT 50% 50% 10% CL = 15 pF (Note 7) 50 ms tON 10% tOFF 0 VOH Note 6: Pulse width 50 ms, Duty cycle 10% Output impedance 50 W, tr < = 5 ns, tf < = 10 ns 90% OUTPUT 10% VOL Note 7: CL includes probe and jig capacitance. Caution on Application 1. The device does not include protectors such as an overcurrent protector and an overvoltage protector. Applying excessive current or voltage may damage the device. Thus, design with great care to prevent excessive current or voltage from being applied to the device. The device may also be damaged by short-circuits between outputs and power supply/ground. Take care when designing output, VCC and GND line. 2. Be sure to mount the device in the correct orientation. Make sure that the positive and negative power supply pins are connected the right way round. Otherwise, the absolute maximum current and power dissipation ratings may be exceeded and the device may break down or undergo performance degradation, causing it to catch fire or explode, and resulting in injury. 3 2001-12-05 TD62S050AFM Package Dimensions Weight: 0.017 g (typ.) 4 2001-12-05 TD62S050AFM Preliminary land pattern 0.7 1.3 0.7 1.6 0.25 0.7 1.6 0.6 2.2 0.6 Unit : mm Preliminary PCB trace dimension 5 mm 10 mm 5 2001-12-05 TD62S050AFM RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 6 2001-12-05