Freescale MPXHZ6130AC6U Media resistant and high silicon pressure sensor for measuring absolute pressure Datasheet

Pressure
Freescale Semiconductor
MPXHZ6130A
Rev 1, 05/2010
Media Resistant and High
Temperature Accuracy Integrated
Silicon Pressure Sensor for
Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPXHZ6130A
Series
15 to 130 kPa (2.2 to 18.9 psi)
0.2 to 4.8 V Output
Application Examples
The MPXHZ6130A series sensor integrates on-chip, bipolar op amp
circuitry and thin film resistor networks to provide a high output signal and
temperature compensation. The sensor's packaging has been designed to
provide resistance to high humidity conditions as well as common automotive
media. The small form factor and high reliability of on-chip integration make
the Freescale Semiconductor, Inc. pressure sensor a logical and economical
choice for the system designer.
The MPXHZ6130A series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output
signal that is proportional to applied pressure.
• Aviation Altimeters
• Industrial Controls
• Engine Control/Manifold Absolute
Pressure (MAP)
• Weather Stations and Weather Reporting
Devices
Features
•
•
•
•
•
•
1.5% Maximum Error Over 0° to 85°C
Resistant to High Humidity and Common Automotive Media
Improved Accuracy at High Temperature
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from -40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Package
Case
Device Name
Options
No.
Super Small Outline Package (MPXHZ6130A Series)
MPXHZ6130A6U
Rail
1317
MPXHZ6130AC6U
Rail
1317A
None
# of Ports
Single
Dual
Gauge
Pressure Type
Differential Absolute
•
•
•
•
SUPER SMALL OUTLINE PACKAGES
MPXHZ6130A6U
CASE 1317
© Freescale Semiconductor, Inc., 2006-2010. All rights reserved.
MPXHZ6130AC6U
CASE 1317A
Device Marking
MPXHZ6130A
MPXHZ6130A
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
15
—
130
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
6.0
10
mAdc
Minimum Pressure Offset(2)
@ VS = 5.0 Volts
(0 to 85°C)
Voff
0.132
0.200
0.268
Vdc
Full Scale Output(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.632
4.700
4.768
Vdc
Full Scale Span(4)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
4.365
4.500
4.635
Vdc
Accuracy(5)
(0 to 85°C)
—
—
—
±1.5
%VFSS
V/P
—
39.2
—
mV/kPa
Response Time(6)
tR
—
1.0
—
ms
Warm-Up Time(7)
—
—
20
—
ms
Offset Stability(8)
—
—
±0.25
—
%VFSS
Sensitivity
1. Device is ratiometric within this specified excitation range.
2. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXHZ6130A
2
Sensors
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
400
kPa
Storage Temperature
Tstg
-40° to +125°
°C
Operating Temperature
TA
-40° to +125°
°C
Output Source Current @ Full Scale Output(2)
I o+
0.5
mAdc
Output Sink Current @ Minimum Pressure Offset(2)
Io -
-0.5
mAdc
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from VOUT to Gnd or VOUT to VS in the application circuit.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
3
Gain Stage #2
and Ground
Reference
Shift
Circuitry
4
VOUT
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXHZ6130A
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
A gel die coat isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
Fluoro Silicone
Gel Die Coat
+5.0 V
Stainless
Steel Cap
Die
Wire Bond
transmitted to the sensor diaphragm. The gel die coat and
durable polymer package provide a media resistant barrier
that allows the sensor to operate reliably in high humidity
conditions as well as environments containing common
automotive media. Contact the factory for more information
regarding media compatibility in your specific application.
P1
Thermoplastic
Case
Lead
Frame
VS Pin 2
MPXHZ6130A
100 nF
to ADC
Vout Pin 4
47 pF
GND Pin 3
51 K
Die Bond
Absolute Element
Sealed Vacuum Reference
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Output (Volts)
5.0
Transfer Function:
4.5
Vout =Vs x (0.007826 xP(kPa) - 0.07739)
4.0 +/- (PE x TM x Vs x 0.007826)
MAX
3.5 PE = +/- 1.725kPa
3.0 TM = 1 @ 0 to 85°C
Vs = 5.0Vdc
2.5
MIN
2.0
TYP
1.5
1.0
140
130
120
110
100
90
80
70
60
50
40
30
20
0
10
0.5
Pressure (ref: to sealed vacuum) in kPa
Figure 4. Output vs. Absolute Pressure
MPXHZ6130A
4
Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPXHZ6130A)
Nominal Transfer Value:
Vout = VS x (0.007826 x P(kPa) - 0.07739)
± (Pressure Error x Temp. factor x 0.007826 x VS)
VS = 5.0 ± 0.25 Vdc
Temperature Error Band
MPXHZ6130A Series
4.0
Break Points
Temp
3.0
Temperature
Error
Factor
Multiplier
- 40
0 to 85
125
2.0
3
1
1.75
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in Cº
NOTE: The Temperature Multiplier is a linear response from 0ºC to -40ºC and from 85ºC to 125ºC
Pressure Error Band
Error Limits for Pressure
3.0
Pressure Error (kPa)
2.0
1.0
0.0
20
40
60
80
100
120
Pressure (in kPa)
-1.0
-2.0
Pressure
15 to 130 (kPa)
Error (Max)
±1.725 (kPa)
-3.0
MPXHZ6130A
Sensors
Freescale Semiconductor
5
Pressure
MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGES
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
0.050
1.27
TYP
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.387
9.83
0.150
3.81
0.027 TYP 8X
0.69
0.053 TYP 8X
1.35
inch
mm
Figure 5. SSOP Footprint (Case 1317 and 1317A)
MPXHZ6130A
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
CASE 1317-04
ISSUE F
SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
CASE 1317A-04
ISSUE D
SUPER SMALL OUTLINE PACKAGE
MPXHZ6130A
10
Sensors
Freescale Semiconductor
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MPXHZ6130A
Rev. 1
05/2010
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