TOSHIBA TA4800AF

TA4800AF
TOSHIBA Bipolar Linear Integrated Circuit
Silicon Monolithic
TA4800AF
1A Output Current Low Dropout Voltage Regulator
The TA4800AF consists of small-surface mount type low-dropout
regulators with an output current of 1 A (maximum). The output
voltage can be arbitrarily set by external resistance.
Features
HSIP5-P-1.27B
•
Maximum output current : 1 A
•
Output voltage
Weight : 0.36 g (Typ.)
: VOUT = 1.5 V ∼ 9.0 V
•
Reference voltage accuracy : VREF ± 2.5% (@Tj = 25°C)
•
Low quiescent current
•
Low standby current (output OFF mode): 0.5 μA (Typ.)
•
Low-dropout voltage
: 850 μA (Typ.) (@VOUT = 3.3 V ,IOUT = 0 A)
: VD = 0.5 V (Max) (@VOUT = 3.3 V, IOUT = 500 mA)
•
Protection function
: Over current protection / thermal shutdown
•
Package type
: Surface-mount New PW-Mold5pin
Pin Assignment
Mark
1
NC
2
3
4
5
IN GND OUT ADJ
Marking
3
4800
Part No. (or abbreviation code)
AF
Lot No.
1 2 3 4 5
A line indicates
lead (Pb) - free package or
lead (Pb) – free finish.
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TA4800AF
Pin Description
Pin No.
Symbol
1
NC
Non-connection
2
IN
Input terminal. Connected by capacitor (CIN) to GND.
3
GND
4
OUT
Output terminal. Connected by capacitor (COUT) to GND.
ADJ
Output voltage feedback to regulator. It is connected to an error amplifier with
VREF=1.245 V (Typ.).
5
Description
Ground terminal
How to Order
Product No.
TA4800AF (T6L1,Q)
Package
Package Type and Capacity
New PW-Mold5pin : Surface-mount
Tape (2000 pcs/reel)
Block Diagram
IN
OUT
Over-current
protection
Overtemperature
protection
ADJ
Control
circuit
Reference
voltage
1.245 V (Typ.)
GND
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TA4800AF
Absolute Maximum Rating (Ta = 25°C)
Symbol
Rating
Unit
Input voltage
VIN
16
V
Output current
IOUT
1
A
Operating junction temperature
Tj(opr)
-40~135
°C
Characteristic
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55~150
°C
Power dissipation
Thermal
resistance
Ta = 25°C
1
PD
Tc= 25°C
W
10
junction-ambient
Rth(j-a)
125
junction-case
Rth(j-c)
12.5
°C/W
Note 1: Do not apply current and voltage (including reverse polarity) to any pin that is not specified.
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Operating Input Voltage Range
Characteristic
Input voltage
Symbol
Min
Typ.
Max
Unit
VIN
2.5(Note2)
⎯
16.0
V
Note 3: This is the voltage at which the IC begins operating. VD must be considered when determining the best
input voltage for the application.
Output Voltage Range
Characteristic
Output voltage
Symbol
Min
Typ.
Max
Unit
VOUT
1.5
⎯
9.0
V
Protection Function (Reference)
Characteristic
Thermal shutdown
Thermal shutdown hysteresis width
Symbol
TSD
TSD(hys)
Peak circuit current
IPEAK
Short circuit current
ISC
Test Condition
VIN = 4.3 V
Min
Typ.
Max
Unit
150
170
⎯
°C
°C
⎯
15
⎯
VIN = 5.3 V, Tj = 25°C
⎯
1.7
⎯
VIN = 8.3 V, Tj = 25°C
⎯
2.0
⎯
VIN = 5.3 V, Tj = 25°C
⎯
1.1
⎯
VIN = 16V , Tj = 25°C
⎯
0.7
⎯
A
A
Note 4: Ensure that the devices operate within the limits of the maximum rating when in actual use.
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TA4800AF
Electrical Characteristics
(Unless otherwise specified, VEN = VIN, VOUT = 3.3 V, CIN = 0.33 μF, COUT = 3.3 μF, Tj = 25°C)
Characteristic
Reference voltage
Symbol
VREF
Test Condition
VIN = 4.3 V
Min
Typ.
Max
Unit
1.214
1.245
1.276
V
⎯
8
24
mV
mV
Line regulation
Reg・line
4.3 V <
= VIN <
= 8.3 V,
IOUT = 500 mA
Load regulation
Reg・load
VIN = 4.3 V, 5 mA <
=1A
= IOUT <
⎯
5
20
4.3 V <
= VIN <
= 8.3 V,
IOUT = 0 A
⎯
0.85
1.70
4.3 V <
= VIN <
= 8.3 V,
IOUT = 1 A
⎯
10
20
VIN = 2.1 V, IOUT = 0 A
⎯
3.3
4.0
VIN = 3.5 V, IOUT = 1 A
⎯
17.0
28.5
Quiescent current
Starting quiescent current
IB
IBstart
mA
mA
Output noise voltage
VNO
VIN = 5.3 V, IOUT = 50 mA,
10 Hz <
=f<
= 100 kHz
⎯
100
⎯
μVrms
Ripple rejection
R.R.
VIN = 5.3 V, IOUT = 50 mA,
f = 120 Hz
⎯
63
⎯
dB
Dropout voltage
VD
IOUT = 500 mA
⎯
0.32
0.50
IOUT = 1 A
⎯
0.69
⎯
VIN = 5.3 V, IOUT = 5 mA,
0°C <
= Tj <
= 125°C
⎯
0.3
⎯
Average temperature
coefficient of output voltage
TCVO
4
V
mV/°C
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TA4800AF
Electrical Characteristics Common to All Products
• Tj = 25°C in the measurement conditions of each item is the standard condition when a pulse test is carried
out, and any drift in the electrical characteristic due to a rise in the junction temperature of the chip may be
disregarded.
Standard Application Circuit
CIN
0.33 μF
IN
OUT
TA4800AF
GND
R1
COUT
3.3 μF
ADJ
Load
R2
• Be sure to connect a capacitor near the input terminal and output terminal between both terminals and GND.
The use of a monolithic ceramic capacitor (B Characteristic or X7R) of low ESR (equivalent series resistance)
is recommended. The IC may oscillate due to external conditions (output current, temperature, or the type of
the capacitor used). The type of capacitor required must be determined by the actual application circuit in
which the IC is used.
Setting Output Voltage
• The output voltage is determined by the equation shown below. When you control the output voltage with R1,
a recommended value to use for R2 is 5 kΩ. R1 and R2must be placed as close as possible to each other, and
the board trace to the ADJ terminal must be kept as short as possible.
R1
VOUT = VREF × ( 1 +
)
R2
The notice in case of application
• The IC might be destroyed if a voltage greater than the input terminal voltage is applied to the output
terminal, or if the input terminal is connected to GND during operation. To prevent such an occurrence,
connect a diode as in the following diagram.
CIN
0.33 μF
IN
OUT
TA4800AF
GND
R1
ADJ
COUT
3.3 μF
Load
R2
• There is a possibility that internal parasitic devices may be generated when momentary transients cause a
terminal’s potential to fall below that of the GND terminal. In such case, that the device could be destroyed.
The voltage of each terminal and any state must therefore never fall below the GND potential.
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TA4800AF
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Condition:
Number of IC = 1
Reflow soldering on
a ceramic substrate
VIN = 5.3 V
VOUT = 3.3V
8
6
4
2
0
3.4
VOUT
(V)
Ta = Tc
10
VOUT – Tj
3.5
Output voltage
Allowable power dissipation
PDmax
(W)
PDmax – Ta
50 × 50 × 0.8 mmt
30 × 30 × 0.8 mmt
100 mA
I OUT = 5 mA
3.3
500 mA
3.2
Single
0
20
40
60
80
100
Ambient temperature
120
Ta
140
3.1
−50
160
0
50
100
Junction temperature
(°C)
VOUT – VIN
Tj
150
(°C)
I B – VIN
4
20
I OUT = 500 mA
10 mA
100 mA
Quiescent current
Output voltage
I B (mA)
3
VOUT
(V)
Tj = 25°C
2
1
VOUT = 3.3V
0
Tj = 25°C
0
2
4
6
Input voltage
VIN
15
10
I OUT = 500 mA
5
100 mA
0
8
0
2
(V)
4
Input voltage
I B – Tj
6
VIN
(V)
30
VIN = 5.3 V
Tj = 25°C
I B (mA)
VIN = 5.3 V
20
Quiescent current
I B (mA)
8
I B – IOUT
30
Quiescent current
10 mA
I OUT = 1 A
10
20
10
0A
0
−50
0
50
Junction temperature
100
Tj
0
150
(°C)
0
200
400
Output curren
6
600
I OUT
800
1000
(mA)
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TA4800AF
VOUT – I OUT
VOUT – I OUT
(V)
4
3.3
Output voltage
Output voltage
3
VOUT
3.4
VOUT
(V)
3.5
3.2
VIN = 5.3 V
VOUT = 3.3V
Tj = 25°C
3.1
0
200
400
600
Output curren
I OUT
800
2
1
VIN = 5.3 V
VOUT = 3.3V
Tj = 25°C
0
1000
0
(mA)
0.5
1
Output curren
VD – I OUT
(A)
(V)
85℃
25℃
0.4
0.2
0
200
400
600
I OUT
800
I OUT = 1 A
0.6
VD
125℃
Dropout voltage
(V)
Tj = −40℃
0.6
VD
Dropout voltage
I OUT
2.5
0.8
Output curren
0.4
500 mA
0.2
100 mA
0
−50
1000
(mA)
0
50
100
Junction temperature
I PEAK – Tj
Tj
150
(°C)
I PEAK – VD
3.0
I PEAK (A)
2.5
I PEAK (A)
2
VD – Tj
0.8
0
1.5
2.0
2.5
2.0
Peak output current
Peak output current
1.5
1.0
0.5
VIN = 5.3 V
0
-50
0
50
Junction temperature
100
Tj
1.5
1.0
0.5
Ta = 25℃
0
150
(°C)
0
5
10
Dropout voltage
7
15
VD
20
(V)
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TA4800AF
Package Dimensions
HSIP5-P-1.27B
Unit : mm
1.5±0.2
0.7±0.1
0.8max
0.5±0.1
0.5±0.1
0.6max
2.3±0.2
0.7max
1.1±0.2
0.1±0.1
0.6±0.1
0.6max
9.5±0.3
5.5±0.2
1.5±0.2
6.5±0.2
5.2±0.2
1.27
Weight: 0.36 g (Typ.)
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TA4800AF
RESTRICTIONS ON PRODUCT USE
20070701-EN
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his
document shall be made at the customer’s own risk.
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patents or other rights of
TOSHIBA or the third parties.
• Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses
occurring as a result of noncompliance with applicable laws and regulations.
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