TD62003,004PA/APA TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62003PA,TD62003APA,TD62004PA,TD62004APA 7CH DARLINGTON SINK DRIVER The TD62003PA / APA Series are high−voltage, high−current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductuve loads. Applications include relay, hammer, lamp and display (LED) drivers. FEATURES l Output current (single output) 500 mA (Max.) l High sustaining voltage output 35 V (Min.) (TD62003PA series) 50 V (Min.) (TD62003APA series) l Output clamp diodes l Inputs compatible with various types of logic. TD62003PA, APA RIN = 2.7 kΩ TD62004PA, APA RIN = 10.5 kΩ Weight: 1.11g ( Typ. ) l Package DIP−16 pin PIN CONNECTION (TOP VIEW) 1 2001-06-28 TD62003,004PA/APA SCHEMATICS (EACH DRIVER) TD62003PA / APA Note: TD62004PA / APA The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25°C) CHARACTERISTIC Output Sustaining Voltage PA APA SYMBOL VCE (SUS) RATING −0.5~35 −0.5~50 UNIT V Output Current IOUT 500 mA / ch Input Voltage VIN −0.5~30 V Clamp Diode Reverse Voltage PA APA 35 VR V 50 Clamp Diode Forward Current IF 500 mA Power Dissipation PD 1.47 W Operating Temperature PA APA Storage Temperature Topr Tstg −30~75 −40~85 −55~150 °C °C RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C for Type−APA and Ta = −30~75°C for Type−PA) CHARACTERISTIC Output Sustaining Voltage PA APA SYMBOL CONDITION Output Current IOUT Tpw = 25 ms 7 Circuits APA Input Voltage TD62004 TD62003 TD62004 Clamp Diode Reverse Voltage PA APA VIN (ON) VR Clamp Diode Forward Current IF Power Dissipation PD Ta = 85°C 2 UNIT ― 35 ― 50 Duty = 10% 0 ― 370 Duty = 50% 0 ― 140 Duty = 10% 0 ― 400 Duty = 50% 0 ― 170 0 ― 24 2.8 ― 24 6.2 ― 24 0 ― 0.7 0 ― 1.0 ― ― 35 ― ― 50 ― ― 350 mA ― ― 0.52 W IOUT = 400 mA, hFE = 800 VIN (OFF) MAX 0 VIN TD62003 TYP. 0 VCE (SUS) PA MIN V mA / ch V V V V 2001-06-28 TD62003,004PA/APA ELECTRICAL CHARACTERISTICS (Ta = 25°C) CHARACTERISTIC SYMBOL TEST CIR− CUIT APA Output Leakage Current ICEX 1 PA MIN TYP. MAX VCE = 50 V, Ta = 25°C ― ― 50 VCE = 50 V, Ta = 85°C ― ― 100 VCE = 35 V, Ta = 25°C ― ― 50 UNIT µA VCE = 35 V, Ta = 75°C ― ― 100 IOUT = 350 mA, IIN = 500 µA ― 1.3 1.6 IOUT = 200 mA, IIN = 350 µA ― 1.1 1.3 IOUT = 100 mA, IIN = 250 µA ― 0.9 1.1 VCE = 2 V, IOUT = 350 mA 1000 ― ― VIN = 2.4 V, IOUT = 350 mA ― 0.4 0.7 VIN = 9.5 V, IOUT = 350 mA ― 0.8 1.3 IOUT = 500 µA, Ta = 75°C 50 65 ― IOUT = 500 µA, Ta = 85°C 50 65 ― IOUT = 350 mA ― ― 2.6 IOUT = 200 mA ― ― 2.0 IOUT = 350 mA ― ― 4.7 IOUT = 200 mA ― ― 4.4 VR = 50 V, Ta = 25°C ― ― 50 VR = 50 V, Ta = 85°C ― ― 100 VR = 35 V, Ta = 25°C ― ― 50 VR = 35 V, Ta = 75°C ― ― 100 IF = 350 mA ― ― 2.0 V ― 15 ― pF VOUT = 35 V, RL = 85 Ω CL = 15 pF ― 0.1 ― APA VOUT = 50 V, RL = 125 Ω CL = 15 pF ― 0.1 ― PA VOUT = 35 V, RL = 85 Ω CL = 15 pF ― 0.2 ― VOUT = 50 V, RL = 125 Ω CL = 15 pF ― 0.2 ― Collector−Emitter Saturation Voltage DC Current Transfer Ratio TD62003 Input Current (Output On) TEST CONDITION TD62004 PA APA VCE (sat) 2 hFE 2 IIN (ON) 3 IIN (OFF) 4 TD62003 Input Voltage (Output On) VIN (ON) VCE = 2 V hFE = 800 5 TD62004 APA Clamp Diode Reverse Current IR 6 Clamp Diode Forward Voltage VF 7 Input Capacitance CIN ― PA PA Turn−On Delay tON Turn−Off Delay tOFF 8 8 APA 3 V mA µA V µA µs 2001-06-28 TD62003,004PA/APA TEST CIRCUIT 1. ICEX 2. VCE (sat), 4. IIN (OFF) 5. VIN (ON) 7. VF hFE 4 3. IIN (ON) 6. IR 2001-06-28 TD62003,004PA/APA 8. tON, tOFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, tr ≤ 5ns, tf ≤ 10ns Note 2: See below INPUT CONDITION TYPE NUMBER RI VIH TD620003PA / APA 0 3V TD620004 / APA 0 8V Note 3: CL includes probe and jig capacitance PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed.Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding. 5 2001-06-28 TD62003,004PA/APA 6 2001-06-28 TD62003,004PA/APA 7 2001-06-28 TD62003,004PA/APA 8 2001-06-28 TD62003,004PA/APA PACKAGE DIMENSIONS DIP16−P−300−2.54A Unit : mm Weight: 1.11 g (Typ.) 9 2001-06-28 TD62003,004PA/APA RESTRICTIONS ON PRODUCT USE 000707EBA · TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. · The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. · The products described in this document are subject to the foreign exchange and foreign trade laws. · The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. · The information contained herein is subject to change without notice. 10 2001-06-28