Rohm BD00D0AWHFP 2a standard variable output ldo regulator Datasheet

Standard Variable Output LDO Regulators
2A Standard
Variable Output LDO Regulator
BD00D0AWHFP
No.11023EBT04
●Description
The BD00D0AWHFP is low-saturation regulator. The output voltage can be arbitrarily configured using the external
resistance. This IC has a built-in over-current protection circuit that prevents the destruction of the IC due to output short
circuits and a thermal shutdown circuit that protects the IC from thermal damage due to overloading.
●Features
1) Output Current : 2A
2) High Output Voltage Precision : ±1%
3) Low saturation with PDMOS output
4) Built-in over-current protection circuit that prevents the destruction of the IC due to output short circuits
5) Built-in thermal shutdown circuit for protecting the IC from thermal damage due to overloading
6) Low ESR Capacitor
7) HRP5 packaging
●Applications
Audiovisual equipments, FPDs, televisions, personal computers or any other consumer device
●Absolute maximum ratings (Ta=25℃)
Parameter
Symbol
Ratings
Unit
Vcc
-0.3~+35.0
V
VCTL
-0.3~+35.0
V
Pd
1.6
W
Operating Temperature Range
Topr
-40~+105
℃
Storage Temperature Range
Tstg
-55~+150
℃
Tjmax
+150
℃
Supply Voltage
*1
Output Control Voltage
Power Dissipation
*2
Maximum Junction Temperature
*1
Not to exceed Pd.
*2
HRP5: Reduced by 12.8mW / ℃ over Ta = 25℃, when mounted on glass epoxy board: 70mm×70mm×1.6mm.
NOTE: This product is not designed for protection against radioactive rays.
●Operating conditions (Ta=25℃)
Parameter
Symbol
Min.
Max.
Unit
Supply Voltage
Vcc
4.0
25.0
V
Output Control Voltage
VCTL
0
25.0
V
Output Current
Io
0
2.0
A
Output Voltage
Vo
3.0
15.0
V
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1/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Electrical characteristics
(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA,Vo=5.0Vsetting)
(The resistor of between ADJ and Vo =56.7kΩ,ADJ and GND =10kΩ)
Parameter
Symbol
Min
Typ
Max
Unit
Shut Down Current
Isd
-
0
10
µA
Bias Current
Ib
-
0.5
1.0
mA
ADJ Terminal Voltage
VADJ
0.742
0.750
0.758
V
Io=50mA
Dropout Voltage
ΔVd
-
0.40
0.55
V
Vcc=Vo×0.95, Io=1A
Ripple Rejection
R.R.
45
55
-
dB
1
f=120Hz,ein※ =1Vrms,
Io=100mA
Line Regulation
Reg.I
-
20
60
mV
Vcc=6→25V
Load Regulation
Reg.L
-
V
Io=5mA→1A
Tcvo.1
-
+0.04
-
%/℃
Io=5mA,Tj=-40~-20℃
Tcvo.2
-
±0.005
-
%/℃
Io=5mA,Tj=-20~+105℃
CTL ON Mode Voltage
VthH
2.0
-
-
V
ACTIVE MODE
CTL OFF Mode Voltage
VthL
-
-
0.8
V
OFF MODE
CTL Bias Current
ICTL
-
25
50
µA
Temperature Coefficient of
Output Voltage
*1
Vo×0.007 Vo×0.014
Conditions
VCTL=0V
ein : Input Voltage Ripple
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2/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Electrical characteristic curves (Reference data)
(Unless otherwise specified, Ta=25℃, Vcc=10V,VCTL=5V,Io=0mA,Vo=5.0Vsetting)
(The resistor of between ADJ and Vo =56.7kΩ,ADJ and GND =10kΩ)
STANBY CURRENT : Isd [µA]
0.8
CIRCUIT CURRENT: Ib+I
0.6
0.4
0.2
18
6
15
5
OUTPUT VOLTAGE : Vo [V]
FEEDBACK_R [mA]
1.0
12
9
6
3
0.0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
5
5
4
3
2
1
800
3
2
1
700
600
500
400
300
200
100
0
0
10
100
1000
10000
1.0
5
0.8
4
0.6
3
0.4
2
0.2
1
0
-40
0
100000 1000000
FREQUENCY: f [Hz]
0.0
-20
0
20
40
60
80
0
100
400
Fig.8 Output Voltage
Temperature Characteristics
Fig.7 Ripple Rejection
800
1200
1600
2000
OUTPUT CURRENT : Io [mA]
AMBIENT TEMPERATURE : Ta [℃]
100
2000
CIRCUIT CURRENT:Ib+I FEEDBACK_R [mA]
OUTPUT VOLTAGE : Vo [V]
70
10
400
800
1200
1600
OUTPUT CURRENT : Io [mA]
Fig.6 Dropout Voltage
(Vcc=4.75V)
(lo=0mA→2000mA)
6
80
20
0
600
1200
1800
2400
3000
OUTPUT CURRENT : Io [mA]
Fig.5 Load Regulation
Fig.4 Line Regulation
(Io=1000mA)
Fig.9 Circuit Current
(IFEEDBACK_R≒75µA)
6
6
5
5
90
OUTPUT VOLTAGE : Vo [V]
80
70
60
50
40
30
20
OUTPUT VOLTAGE : Vo [V]
RIPPLE REJECTION : R.R. [dB]
Fig.3 Line Regulation
(Io=0mA)
4
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE : Vcc [V]
CIRCUIT CURRENT : ICTL [μA]
0 2 4 6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE : Vcc [V]
0
0
30
1
6 8 10 12 14 16 18 20 22 24
SUPPLY VOLTAGE : Vcc [V]
DROPOUT VOLTAGE : ΔVd [mV]
6
OUTPUT VOLTAGE : Vo [V]
OUTPUT VOLTAGE : Vo [V]
6
40
2
Fig.2 Shut Down Current
Fig.1 Circuit Current
(IFEEDBACK_R≒75µA)
50
3
0
0 2 4
SUPPLY VOLTAGE: Vcc [V]
60
4
4
3
2
1
4
3
2
1
10
0
0
0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE : VCTL[V]
Fig.10 CTL Voltage vs CTL Current
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0 2 4 6 8 10 12 14 16 18 20 22 24
CONTROL VOLTAGE : VCTL [V]
Fig.11 CTL Voltage vs Output Voltage
3/11
0
130
140
150
160
170
180
190
AMBIENT TEMPERATURE : Ta [℃]
Fig.12 Thermal Shutdown
Circuit Characteristics
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Measurement Circuit for Reference Data
A
Vo
Vcc
Vo
Vcc
56.7kΩ
56.7kΩ
1µF
CTL
GND
2.2µF
ADJ
CTL
10kΩ
5V
Vo
Vcc
GND
56.7kΩ
1µF
2.2µF
ADJ
10kΩ
A
CTL
GND
2.2µF
ADJ
V
10kΩ
5V
IFEEDBACK _R
Measurement Circuit of Fig.2
Measurement Circuit of Fig.1
Measurement Circuit of Fig.3
V
Vo
Vcc
Vo
Vcc
56.7kΩ
2.2µF
1µF
CTL
GND
56.7kΩ
2.2µF
1µF
ADJ
CTL
V
GND
ADJ
1µF
~
CTL
GND
CTL
56.7kΩ
1µF
2.2µF
GND
ADJ
CTL
V
2.2µF
GND
ADJ
10V
100mA
10kΩ
5V
Vo
Vcc
10V
10V
A
10kΩ
56.7kΩ
1µF
2.2µF
ADJ
ADJ
Measurement Circuit of Fig.6
Vo
Vcc
56.7kΩ
1Vrms
GND
5V
Measurement Circuit of Fig.5
Vo
Vcc
10kΩ
5V
Measurement Circuit of Fig.4
CTL
4.75V
500mA
10kΩ
2.2µF
1µF
A
10V
5V
Vo
Vcc
56.7kΩ
10kΩ
10kΩ
5V
IFEEDBACK _R
5V
A
Measurement Circuit of Fig.7
Vo
Vcc
Vo
Vcc
56.7kΩ
1µF
A
GND
Vo
Vcc
56.7kΩ
2.2µF
CTL
Measurement Circuit of Fig.9
Measurement Circuit of Fig.8
1µF
ADJ
10V
56.7kΩ
2.2µF
CTL
GND
ADJ
10kΩ
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CTL
GND
ADJ
V
10V
10V
Measurement Circuit of Fig.10
2.2µF
1µF
V
10kΩ
Measurement Circuit of Fig.11
4/11
5V
10kΩ
Measurement Circuit of Fig.12
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Block diagrams
GND
FIN
-
VREF
VREF:Bandgap Reference
OCP:Over Current Protection Circuit
TSD:Thermal Shut Down Circuit
Driver:Power Transistor Driver
Driver
+
OCP
TSD
1
2
3
4
5
CTL
Vcc
GND
Vo
ADJ
Fig.13
Pin No.
Pin Name
1
CTL
Function
Output Control Pin
2
Vcc
Power Supply Pin
3
GND
GND
4
Vo
5
ADJ
Output Pin
Adjustable Pin
Fin
GND
GND
●TOP VIEW〈Package dimension〉
HRP5
8.82 ± 0.1
(6.5)
0.08±0.05
1.2575
1
2
3
4
0.835±0.2
1.523±0.15
8.0±0.13
(7.49)
1.905±0.1
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
5
+5.5°
4.5°−4.5°
+0.1
0.27 −0.05
1.72
0.73±0.1
0.08 S
S
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(Unit : mm)
5/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Input / Output Equivalent Circuit Diagrams
CTL Pin
Vcc Pin
200kΩ
Vcc
1kΩ
CTL
200kΩ
IC
ADJ Pin
Vo Pin
Vcc
Vo
1kΩ
20 kΩ
ADJ
Vo
35kΩ
●Output Voltage Configuration Method
Please connect resistors R1 and R2 (which determines the output voltage) as shown in Fig.14.
Please be aware that the offset due to the current that flows from the ADJ terminal becomes large when resistors with large
values are used. The use of resistors with R1=5kΩ to 10kΩ is recommended.
Vo
R2
IC
Vo ≒ ADJ × (R1+R2) / R1
ADJ≒0.75V
(TYP.)
ADJ pin
R1
Fig.14
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6/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Thermal Design
10
10
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
θja=78.1(℃/W)
8
Power dissipation Pd (W)
Power dissipation Pd (W)
8
6
4
1.6W
③ 7.3W
6
② 5.5W
Mounted on a Rohm standard board
Board size : 70 ㎜×70 ㎜×1.6 ㎜
(board contains a thermal)
①2-layer board
(back surface copper foil area :15 ㎜×15 ㎜)
②2-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
③4-layer board
(back surface copper foil area :70 ㎜×70 ㎜)
①:θja=54.3℃/W
②:θja=22.7℃/W
③:θja=17.1℃/W
4
① 2.3W
2
2
0
0
0
25
50
75
100
125
Temperature atmosphere Ta(℃)
0
150
25
Fig.15
50
75
100
125
Temperature atmosphere Ta(℃)
150
Fig.16 (Reference data)
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.15. and Fig.16.
The IC characteristics are closely related to the temperature at which the IC is used, so it is necessary to operate the IC
at temperatures less than the maximum junction temperature Tjmax.
Fig.15 and Fig.16 shows the acceptable loss and heat reducing characteristics of the HRP5 package. Even when the
ambient temperature Ta is a normal temperature (25℃), the chip (junction) temperature Tj may be quite high so please
operate the IC at temperatures less than the acceptable loss Pd.
The calculation method for power consumption Pc(W) is as follows :(Fig.16③)
Pc=(Vcc-Vo)×Io+Vcc×Ib
Acceptable loss Pd≧Pc
Solving this for load current Io in order to operate within the acceptable loss,
Vcc:
Vo:
Io:
Ib:
Ishort:
Input voltage
Output voltage
Load current
Circuit current
Short current
Pd-Vcc×Ib
(Please refer to Fig.9 for Ib.)
Vcc-Vo
It is then possible to find the maximum load current IoMax with respect to the applied voltage Vcc at the time of thermal
design.
Io≦
Calculation Example)When Ta=85℃,Vcc=10V,Vo=5V
Io≦
3.796-10×Ib
5
Io≦758.2mA
Fig.16③:θja=17.1℃/W → -58.4mW/℃
25℃=7.3W → 85℃=3.796W
(Ib:0.5mA)
Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating
temperature ranges. The power consumption Pc of the IC when there is a short circuit (short between Vo and GND) is :
Pc=Vcc×(Ib+Ishort)
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(Please refer to Fig. 5 for Ishort)
7/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Notes for use
1. Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may
result in damage to the IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode)
when such damage is suffered. If operational values are expected to exceed the maximum ratings for the device, consider
adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external
circuits and other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.
3. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Ensure that no pins are at a voltage below the GND at any time, regardless of transient characteristics.
4. Ground wiring pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately but
connected to a single ground potential within the application in order to avoid variations in the small-signal ground caused
by large currents. Also ensure that the GND traces of external components do not cause variations on GND voltage.
The power supply and ground lines must be as short and thick as possible to reduce line impedance.
5. Inter-pin shorts and mounting errors
Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in
damage to the IC. Shorts between output pins or between output pins and the power supply or GND pins (caused by poor
soldering or foreign objects) may result in damage to the IC.
6. Operation in strong electromagnetic fields
Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications
where strong electromagnetic fields may be present.
7. Testing on application boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance pin may subject the IC to
stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be
turned off completely before connecting or removing it from a jig or fixture during the evaluation process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
8. Thermal consideration
Use a thermal design that allows for a sufficient margin in light of the Pd in actual operating conditions.
Consider Pc that does not exceed Pd in actual operating conditions. (Pd≧Pc)
Tjmax : Maximum junction temperature=150[℃] , Ta : Peripheral temperature[℃] ,
θja : Thermal resistance of package-ambience[℃/W], Pd : Package Power dissipation [W],
Pc : Power dissipation [W], Vcc : Input Voltage, Vo : Output Voltage, Io : Load, Ib : Bias Current
Package Power dissipation
Power dissipation
: Pd (W)=(Tjmax-Ta)/θja
: Pc (W)=(Vcc-Vo)×Io+Vcc×Ib
9. Vcc pin
Insert a capacitor(Vo≧5V:capacitor≧1µF~, Vo<5V:capacitor≧2.2µF~) between the Vcc and GND pins.
The appropriate capacitance value varies by application. Be sure to allow a sufficient margin for input voltage levels.
Electric capacitance
IC
Ceramic capacitors, Low ESR capacitors
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8/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
10. Output pin
It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable
capacitance values range from 2.2µF to 1000µF. Ceramic capacitors can be used as long as their ESR value is low
enough to prevent oscillation (0.001Ω to 20Ω). Abrupt fluctuations in input voltage and load conditions may affect the
output voltage.
Vcc=4V~25V
Vo=3V~15V
Io=0A~2A
Ta=-40℃~+105℃
R1=5kΩ~10kΩ
Vcc=4V~25V
Vo=3V~15V
Ta=-40℃~+105℃
R1=5kΩ~10kΩ
Cin=2.2µF~100µF Cout=2.2µF~100µF
100
100
Unstable operating region
1
Stable operating region
Unstable
operating region
Cin(μF)
Cout_ESR (Ω)
10
10
0.1
Stable operating region
0.01
1
0.001
1
0
400
800
1200
1600
2.2
10
100
2000
Cout(μF)
Io(mA)
Cout_ESR vs Io(reference data)
Cin vs Cout(reference data)
Cout(2.2µF~)
ESR (0.001Ω~)
Vcc
(4~25V)
Vcc
Vo
CTL
ADJ
R2
Cin
(2.2µF~)
GND
Io(ROUT)
VCTL
(5V)
R1
(5k~10kΩ)
※Operation Notes 10
Measurement circuit
11. CTL pin
Do not make voltage level of chip enable pin keep floating level, or in between VthH and VthL. Otherwise, the output
voltage would be unstable or indefinite.
12. For a steep change of the Vcc voltage
Because MOS FET for output Transistor is used when an input voltage change is very steep, it may evoke large current.
When selecting the value of external circuit constants, please make sure that the operation on the actual application takes
these conditions into account.
13. For an infinitesimal fluctuations of output voltage.
At the use of the application that infinitesimal fluctuations of output voltage caused by some factors (e.g. disturbance noise,
input voltage fluctuations, load fluctuations, etc.), please take enough measures to avoid some influence (e.g. insert the
filter, etc.).
14. Over current protection circuit (OCP)
The IC incorporates an integrated over-current protection circuit that operates in accordance with the rated output capacity.
This circuit serves to protect the IC from damage when the load becomes shorted. It is also designed to limit output current
(without latching) in the event of a large and instantaneous current flow from a large capacitor or other component. These
protection circuits are effective in preventing damage due to sudden and unexpected accidents. However, the IC should
not be used in applications characterized by the continuous or transitive operation of the protection circuits.
15. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit, which is designed to turn the IC off completely in the event of
thermal overload. It is not designed to protect the IC from damage or guarantee its operation. ICs should not be used after
this function has activated, or in applications where the operation of this circuit is assumed.
16. Applications or inspection processes where the potential of the Vcc pin or other pins may be reversed from their normal
state may cause damage to the IC's internal circuitry or elements. Use an output pin capacitance of 1000µF or lower in
case Vcc is shorted with the GND pin while the external capacitor is charged. Insert a diode in series with Vcc to prevent
reverse current flow, or insert bypass diodes between Vcc and each pin.
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9/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
17. Positive voltage surges on VCC pin
A power zener diode should be inserted between VCC and GND for protection against voltage surges of more than 35V on
the VCC pin.
Vcc
GND
18. Negative voltage surges on VCC pin
A schottky barrier diode should be inserted between VCC and GND for protection against voltages lower than GND on the
VCC pin.
Vcc
GND
19. Output protection diode
Loads with large inductance components may cause reverse current flow during startup or shutdown.
protection diode should be inserted on the output to protect the IC.
In such cases, a
20. Regarding input pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
PN junctions are formed at the intersection of these P layers with the N layers of other elements, creating parasitic diodes
and/or transistors. For example (refer to the figure below):
○When GND > Pin A and GND > Pin B, the PN junction operates as a parasitic diode
○When GND > Pin B, the PN junction operates as a parasitic transistor
Parasitic diodes occur inevitably in the structure of the IC, and the operation of these parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Accordingly, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Transistor (NPN)
Resistor
B
(Pin B)
(Pin A)
(Pin B)
E
C
B
N
P
P+
N
P
P+
N
P+
N
GND
P+
N
N
Parasitic elements
GND
P
N
P substrate
Parasitic elements
or transistors
C
E
GND
Parasitic elements
or transistors
(Pin A)
Parasitic elements
Example of Simple Monolithic IC Architecture
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10/11
2011.03 - Rev.A
Technical Note
BD00D0AWHFP
●Ordering part number
B
D
0
ROHM
model Name
0
D
Output Voltage
00:Variable
0
A
Current capacity
D0A:2A
W
H
F
P
-
Shutdown switch Package
W:
With
HFP: HRP5
switch
None : Without
switch
T
R
Packaging and forming specification
TR:Embossed tape and reel
HRP5
<Tape and Reel information>
8.82 ± 0.1
(6.5)
0.08±0.05
1.2575
1
2
3
4
0.835±0.2
1.523±0.15
8.0±0.13
(7.49)
1.905±0.1
10.54±0.13
1.017±0.2
9.395±0.125
(MAX 9.745 include BURR)
Tape
Embossed carrier tape
Quantity
2000pcs
Direction
of feed
TR
direction is the 1pin of product is at the upper right when you hold
( The
)
reel on the left hand and you pull out the tape on the right hand
1pin
5
+5.5°
4.5°−4.5°
+0.1
0.27 −0.05
1.72
0.73±0.1
0.08 S
S
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Direction of feed
Reel
(Unit : mm)
11/11
∗ Order quantity needs to be multiple of the minimum quantity.
2011.03 - Rev.A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may
be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to
obtain a license or permit under the Law.
Thank you for your accessing to ROHM product informations.
More detail product informations and catalogs are available, please contact us.
ROHM Customer Support System
http://www.rohm.com/contact/
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
R1120A
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