TSC ES2JAR3G Surface mount super fast rectifier Datasheet

ES2AA thru ES2JA
Taiwan Semiconductor
CREAT BY ART
Surface Mount Super Fast Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Low profile package
- Built-in strain rellef
- Super fast recovery time for high efficiency
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
Case: DO-214AC (SMA)
DO-214AC (SMA)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - Green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25oC unless otherwise noted)
PARAMETER
SYMBOL
ES
ES
ES
ES
ES
ES
2AA
2BA
2CA
2DA
2FA
ES
ES
2GA 2HA
2JA
UNIT
Maximum repetitive peak reverse voltage
VRRM
50
100
150
200
300
400
500
600
V
Maximum RMS voltage
VRMS
35
70
105
140
210
280
350
420
V
Maximum DC blocking voltage
VDC
50
100
150
200
300
400
500
600
V
Maximum average forward rectified current
IF(AV)
2
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
50
A
Maximum instantaneous forward voltage (Note 1)
@2A
Maximum reverse current @ rated VR
TJ=25 oC
o
TJ=125 C
VF
Trr
Typical junction capacitance (Note 3)
Cj
Operating junction temperature range
Storage temperature range
1.3
1.7
V
10
IR
Maximum reverse recovery time (Note 2)
Typical thermal resistance
0.95
μA
350
35
25
ns
20
pF
RθJL
RθJA
20
75
TJ
- 55 to +150
O
C
TSTG
- 55 to +150
O
C
O
C/W
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note 3: Measured at 1 MHz and Applied VR=4.0 Volts
Document Number: DS_D1407006
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
PACKING
GREEN COMPOUND
QUALIFIED
CODE
R3
CODE
Prefix "H"
ES2xA
(Note 1)
PACKING
SMA
1,800 / 7" Plastic reel
R2
SMA
7,500 / 13" Paper reel
M2
SMA
7,500 / 13" Plastic reel
Folded SMA
1,800 / 7" Plastic reel
Folded SMA
7,500 / 13" Paper reel
F4
Folded SMA
7,500 / 13" Plastic reel
E3
Clip SMA
1,800 / 7" Plastic reel
E2
Clip SMA
7,500 / 13" Plastic reel
F3
Suffix "G"
F2
N/A
PACKAGE
Note 1: "xx" defines voltage from 50V (ES2AA) to 600V (ES2JA)
EXAMPLE
AEC-Q101
PREFERRED P/N
PART NO.
ES2JA R3
ES2JA
R3
ES2JA R3G
ES2JA
R3
ES2JAHR3
ES2JA
GREEN COMPOUND
PACKING CODE
QUALIFIED
H
CODE
G
DESCRIPTION
Green compound
R3
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25oC unless otherwise noted)
FIG.1 MAXIMUM FORWARD CURRENT
DERATING CURVE
1
RESISTER OR
INDUCTIVE LOAD
0
80
90
100
110
120
130
140
150
PEAK FORWARD SURGE CURRENT (A)
LEAD TEMPERATURE (oC)
INSTANTANEOUS REVERSE CURRENT (μA)
2
FIG. 3 MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
60
8.3ms Single Half Sine Wave
50
40
30
20
10
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1407006
100
100
TJ=125oC
10
TJ=75oC
1
TJ=25oC
0.1
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 4 TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT (A)
3
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
1000
Pulse Width=300μs
1% Duty Cycle
1
ES2HA-2JA
0.1
ES2FA-2GA
ES2AA-2DA
0.01
0.4
0.6
0.8
1
1.2
1.4
FORWARD VOLTAGE (V)
1.6
1.8
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE (pF)
60
f=1.0MHz
Vsig=50mVp-p
50
40
30
ES2AA-DA
20
ES2FA-JA
10
0
0.1
1
10
REVERSE VOLTAGE (V)
100
PACKAGE OUTLINE DIMENSIONS
DO-214AC (SMA)
Unit (mm)
DIM.
Unit (inch)
Min
Max
Min
Max
A
1.27
1.58
0.050
0.062
B
4.06
4.60
0.160
0.181
C
2.29
2.83
0.090
0.111
D
1.99
2.50
0.078
0.098
E
0.90
1.41
0.035
0.056
F
4.95
5.33
0.195
0.210
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
1.68
0.066
B
1.52
0.060
C
3.93
0.155
D
2.41
0.095
E
5.45
0.215
MARKING DIAGRAM
P/N =
Specific Device Code
G=
Green Compound
YW =
Date Code
F=
Factory Code
Document Number: DS_D1407006
Version: I14
ES2AA thru ES2JA
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1407006
Version: I14
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