ON MBRD360T4G Switch-mode power rectifier Datasheet

MBRD320G, MBRD330G,
MBRD340G, MBRD350G,
MBRD360G
Switch-mode
Power Rectifiers
www.onsemi.com
DPAK Surface Mount Package
These state−of−the−art devices are designed for use as output
rectifiers, free wheeling, protection and steering diodes in switching
power supplies, inverters and other inductive switching circuits.
SCHOTTKY BARRIER
RECTIFIERS
3.0 AMPERES, 20 − 60 VOLTS
Features
•
•
•
•
•
Extremely Fast Switching
Extremely Low Forward Drop
Platinum Barrier with Avalanche Guardrings
NRVBD and SBRD Prefixes for Automotive and Other Applications
Requiring Unique Site and Control Change Requirements;
AEC−Q101 Qualified and PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
DPAK
CASE 369C
1
4
3
MARKING DIAGRAM
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
•
•
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes;
260°C Max. for 10 Seconds
ESD Ratings:
♦ Machine Model = C
♦ Human Body Model = 3B
YWW
B
3x0G
Y
WW
B3x0
x
G
= Year
= Work Week
= Device Code
= 2, 3, 4, 5, or 6
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
October, 2016 − Rev. 9
1
Publication Order Number:
MBRD320/D
MBRD320G, MBRD330G, MBRD340G, MBRD350G, MBRD360G
MAXIMUM RATINGS
MBRD/SBRD8
Rating
Symbol
320
330
340
350
360
20
30
40
50
60
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
V
Average Rectified Forward Current (TC = +125°C, Rated VR)
IF(AV)
3
A
Peak Repetitive Forward Current, TC = +125°C
(Rated VR, Square Wave, 20 kHz)
IFRM
6
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
75
A
Peak Repetitive Reverse Surge Current (2 ms, 1 kHz)
IRRM
1
A
Operating Junction Temperature Range (Note 1)
TJ
−65 to +175
°C
Storage Temperature Range
Tstg
−65 to +175
°C
Voltage Rate of Change (Rated VR)
dv/dt
10,000
V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Maximum Thermal Resistance, Junction−to−Case
RqJC
6
°C/W
Maximum Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
80
°C/W
Symbol
Value
Unit
2. Rating applies when surface mounted on the minimum pad size recommended.
ELECTRICAL CHARACTERISTICS
Characteristic
Maximum Instantaneous Forward Voltage (Note 3)
iF = 3 Amps, TC = +25°C
iF = 3 Amps, TC = +125°C
iF = 6 Amps, TC = +25°C
iF = 6 Amps, TC = +125°C
VF
Maximum Instantaneous Reverse Current (Note 3)
(Rated dc Voltage, TC = +25°C)
(Rated dc Voltage, TC = +125°C)
iR
V
0.6
0.45
0.7
0.625
mA
0.2
20
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
www.onsemi.com
2
MBRD320G, MBRD330G, MBRD340G, MBRD350G, MBRD360G
ORDERING INFORMATION
Device
Package
Shipping†
MBRD320G
75 Units / Rail
SBRD8320G*
75 Units / Rail
MBRD320RLG
1,800 Tape & Reel
MBRD320T4G
2,500 Tape & Reel
SBRD8320T4G*
2,500 Tape & Reel
MBRD330G
75 Units / Rail
SBRD8330G*
75 Units / Rail
MBRD330RLG
1,800 Tape & Reel
MBRD330T4G
2,500 Tape & Reel
SBRD8330T4G*
2,500 Tape & Reel
MBRD340G
75 Units / Rail
SBRD8340G*
75 Units / Rail
MBRD340RLG
1,800 Tape & Reel
MBRD340T4G
SBRD8340T4G*
DPAK
(Pb−Free)
2,500 Tape & Reel
2,500 Tape & Reel
MBRD350G
75 Units / Rail
SBRD8350G*
75 Units / Rail
MBRD350RLG
1,800 Tape & Reel
SBRD8350RLG*
1,800 Tape & Reel
MBRD350T4G
2,500 Tape & Reel
SBRD8350T4G*
2,500 Tape & Reel
MBRD360G
75 Units / Rail
SBRD8360G*
75 Units / Rail
MBRD360RLG
1,800 Tape & Reel
SBRD8360RLG*
1,800 Tape & Reel
MBRD360T4G
2,500 Tape & Reel
NRVBD360VT4G*
2,500 Tape & Reel
SBRD8360T4G*
2,500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NRVBD and SBRD Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable.
www.onsemi.com
3
MBRD320G, MBRD330G, MBRD340G, MBRD350G, MBRD360G
TYPICAL CHARACTERISTICS
100
I R , REVERSE CURRENT (mA)
10
40
20
10
TJ = 150°C
125°C
4.0
2.0
1.0
100°C
75°C
0.4
0.2
0.1
0.04
0.02
0.01
0.004
0.002
0.001
25°C
0
40
20
30
50
VR, REVERSE VOLTAGE (VOLTS)
10
70
60
*The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if VR is sufficient below rated VR.
150°C
TJ = 25°C
Figure 2. Typical Reverse Current
125°C
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
100
75°C
1.0
0.1
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
10
SINE
WAVE
9.0
TJ = 150°C
8.0
5
7.0
10
6.0
5.0
dc
IPK/IAV = 20
SQUARE
WAVE
4.0
3.0
2.0
1.0
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage
Figure 3. Average Power Dissipation
www.onsemi.com
4
9.0
10
MBRD320G, MBRD330G, MBRD340G, MBRD350G, MBRD360G
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
TYPICAL CHARACTERISTICS
8.0
RATED VOLTAGE APPLIED
7.0
RqJC = 6°C/W
6.0
TJ = 150°C
SINE
WAVE
OR
SQUARE
WAVE
5.0
4.0
3.0
dc
2.0
1.0
0
80
90
100
110
120
140
130
150
160
TC, CASE TEMPERATURE (°C)
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
Figure 4. Current Derating, Case
4.0
RqJA = 80°C/W
SURFACE MOUNTED ON MIN.
PAD SIZE RECOMMENDED
TJ = 150°C
3.5
3.0
dc
SQUARE WAVE
OR
SINE WAVE
VR = 25 V
2.5
TJ = 125°C
2.0
1.5
TJ = 150°C
1.0
0.5
0
0
20
40
60
100
80
120
140
160
TA, AMBIENT TEMPERATURE (°C)
Figure 5. Current Derating, Ambient
C, CAPACITANCE (pF)
1K
700
500
300
200
TJ = 25°C
100
70
50
30
20
10
0
10
20
30
40
50
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
www.onsemi.com
5
60
70
MBRD320G, MBRD330G, MBRD340G, MBRD350G, MBRD360G
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. OPTIONAL MOLD FEATURE.
A
E
C
A
b3
B
c2
4
L3
Z
D
1
2
H
DETAIL A
3
L4
NOTE 7
b2
e
c
SIDE VIEW
b
TOP VIEW
0.005 (0.13)
M
C
Z
H
L2
GAUGE
PLANE
C
L
L1
DETAIL A
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
BOTTOM VIEW
Z
SEATING
PLANE
BOTTOM VIEW
A1
ALTERNATE
CONSTRUCTIONS
ROTATED 905 CW
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.028 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.114 REF
0.020 BSC
0.035 0.050
−−− 0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.72
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.90 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.102
5.80
0.228
3.00
0.118
1.60
0.063
6.17
0.243
SCALE 3:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
◊
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
6
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBRD320/D
Similar pages