ON MC120932MNR4 /2,/4,/8 1.1 ghz low power prescaler with stand−by mode Datasheet

MC12093
÷2, ÷4, ÷8 1.1 GHz Low
Power Prescaler with
Stand−By Mode
Description
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MARKING
DIAGRAM
8
SO−8
D SUFFIX
CASE 751
8
1
1
DFN8
MN SUFFIX
CASE 506AA
1
Features
•
•
•
•
•
•
•
1.1 GHz Toggle Frequency
Supply Voltage 2.7 V to 5.5 Vdc
Low Power 3.0 mA Typical
Operating Temperature −40°C to 85°C
Divide by 2, 4 or 8 Selected by SW1 and SW2 Pins
On−Chip Termination
Pb−Free Packages are Available
A
L
Y
W
G
SW2
Divide Ratio
L
L
8
H
L
4
L
H
4
H
H
2
4
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
Table 1. FUNCTIONAL TABLE
SW
12093
ALYW
G
6B DG
G
The MC12093 is a single modulus prescaler for low power
frequency division of a 1.1 GHz high frequency input signal.
MOSAIC V™ technology is utilized to achieve low power dissipation
of 6.75 mW at a minimum supply voltage of 2.7 V.
On−chip output termination provides output current to drive a
2.0 pF (typical) high impedance load. If additional drive is required
for the prescaler output, an external resistor can be added parallel from
the OUT pin to GND to increase the output power. Care must be taken
not to exceed the maximum allowable current through the output.
Divide ratio control inputs SW1 and SW2 select the required divide
ratio of ÷2, ÷4, or ÷8.
Stand−By mode is featured to reduce current drain to 50 mA typical
when the standby pin SB is switched LOW disabling the prescaler.
IN
VCC
SW2
OUT
1
8
2
7
3
6
4
5
IN
SB
SW1
Gnd
(Top View)
A LOW on the Stand−By Pin 7 disables the device.
1. SW1 & SW2: H = (VCC − 0.5 V) to VCC; L = Open.
2. SB: H = 2.0 V to VCC, L = GND to 0.8 V.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
IN
÷2
÷4
÷8
Figure 1. Function Chart
© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 6
1
Publication Order Number:
MC12093/D
MC12093
VCC = 2.7 to 5.5 V
C3
C1
VCC
IN
SB
SW1
50W
SW2
IN
OUT
GND
C2
C4
EXTERNAL
COMPONENTS
C1 = C2 = 1000 pF
C3 = 0.1 mF
C4 = 2.0 pF Load
Figure 2. AC Test Circuit
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
N/A
Internal Input Pullup Resistor
N/A
ESD Protection
Human Body Model
Machine Model
Charged Device Model
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
SOIC−8
DFN8
Flammability Rating
Oxygen Index: 28 to 34
Transistor Count
> 4 kV
> 200 V
> 2 kV
Pb Pkg
Pb−Free Pkg
Level 1
Level 1
Level 1
Level 1
UL 94 V−0 @ 0.125 in
125 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Rating
Value
Unit
−0.5 to 6.0
Vdc
VCC
Power Supply Voltage, Pin 2
TA
Operating Temperature Range
−40 to 85
°C
Tstg
Storage Temperature Range
−65 to 150
°C
IO
Maximum Output Current, Pin 4
4.0
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
NOTE: ESD data available upon request.
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2
MC12093
Table 4. ELECTRICAL CHARACTERISTICS (VCC = 2.7 to 5.5 V; TA = −40 to 85°C)
Symbol
Characteristic
Min
Typ
Max
Unit
0.1
1.4
1.1
GHz
ft
Toggle Frequency (Sine Wave)
ICC
Supply Current
−
3.0
4.5
mA
ISB
Stand−By Current
−
120
200
mA
VIH1
Stand−By Input HIGH (SB)
2.0
−
VCC
V
VIL1
Stand−By Input LOW (SB)
Gnd
−
0.8
V
VIH2
Divide Ratio Control Input HIGH (SW1 & SW2)
VCC − 0.5
VCC
VCC + 0.5
V
VIL2
Divide Ratio Control Input LOW (SW1 & SW2)
OPEN
OPEN
OPEN
VOUT
Output Voltage Swing (2.0 pF Load)
Output Frequency 12.5−350 MHz (Note 1)
Output Frequency 350−400 MHz (Note 2)
Output Frequency 400−450 MHz (Note 3)
Output Frequency 450−550 MHz (Note 4)
0.6
0.5
0.4
0.3
0.80
0.70
0.55
0.45
−
−
−
−
VIN
Input Voltage Sensitivity
100
400
−
−
1000
1000
1.
2.
3.
4.
250−1100 MHz
100−250 MHz
Vpp
mVpp
Input frequency 1.1 GHz, ÷8, minimum output frequency of 12.5 MHz.
Input frequency 700−800 MHz, ÷2.
Input frequency 800−900 MHz, ÷2.
Input frequency 900−1100 MHz, ÷2.
ORDERING INFORMATION
Package
Shipping †
SOIC−8
98 Units / Rail
MC12093DG
SOIC−8
(Pb−Free)
98 Units / Rail
MC12093DR2
SOIC−8
2500 / Tape & Reel
SOIC−8
(Pb−Free)
2500 / Tape & Reel
MC120932MNR4
DFN8
1000 / Tape & Reel
MC12093MNR4G
DFN8
(Pb−Free)
1000 / Tape & Reel
Device
MC12093D
MC12093DR2G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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3
MC12093
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AG
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
1
0.25 (0.010)
M
Y
M
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
H
0.10 (0.004)
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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4
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
MC12093
PACKAGE DIMENSIONS
DFN8
CASE 506AA−01
ISSUE C
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
PIN ONE
REFERENCE
2X
0.10 C
2X
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
ÇÇÇÇ
TOP VIEW
0.10 C
0.08 C
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.70
0.90
0.50 BSC
0.20
−−−
0.25
0.35
A
0.10 C
8X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
E
(A3)
SIDE VIEW
A1
C
D2
e
e/2
4
1
8X
L
E2
K
8
5
8X
b
0.10 C A B
0.05 C
NOTE 3
BOTTOM VIEW
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
MOSAIC V is a trademark of Motorola, Inc.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
local Sales Representative.
MC12093/D
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