BAT42 / BAT43 Taiwan Semiconductor Small Signal Product Hermetically Sealed Glass Fast Switching Schottky Barrier Diode FEATURES - Low forward voltage drop - Through-hole device type mounting - Hermetically sealed glasss - Compression bonded construction - Solder hot dip tin (Sn) lead finish - All external surfaces are corrosion resistant and leads are readily solderable DO-35 Hermetically Sealed Glass MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL VALUE UNIT PD 200 mW VRRM 30 V VR 30 V Average Forward Rectified Current IF(AV) 200 mA Peak Forward Surge Current IFSM 4 TJ , TSTG -65 to +125 Power Dissipation Repetitive Peak Reverse Voltage Maximum DC Blocking Voltage Operating and Storage Temperature Range MIN MAX UNIT BV 30 - V IF=200mA - 1.00 IF=10mA - 0.40 IR=100μA BAT42 IF=50mA Forward Voltage Drop All Types - 0.65 - 1.00 IF=2mA 0.26 0.33 IF=15mA - 0.45 IF=200mA BAT43 C SYMBOL PARAMETER Breakdown Voltage A o VF V VR=25V IR 500 nA f=1.0MHz CJ 7 (Typ) pF trr (Note 1) Reverse Recovery Time Note 1: Reverse recovery test conditions: IF=IR=10mA, IRR=1mA, RL=100Ω 5 (Typ) ns Maximum Peak Reverse Current Junction Capacitance Document Number: DS_S1412008 VR=1V, Version: C14 BAT42 / BAT43 Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 2 Typical Reverse Characteristics Fig.1 Admissible Power Dissipation VS. Ambient Temperature 250 1000 200 IF - Forward Current (mA) Ptot - Power Dissipation (mW) 125 °C 150 100 50 0 0 25 50 75 100 125 TA - Ambient Temperature 150 175 200 100 -40 °C 10 1 25 °C 0.1 0.01 0 400 600 800 1000 1200 VF - Instantaneous Forward Voltage (mV) Fig. 3 Typical Reverse Characteristics Fig. 4 TypicalCapacitance VS. Reverse Applied Voltage 1000 18 16 125 °C 100 14 100 °C 10 Capacitance (pF) IR - Reverse Leakage Current (uA) 200 (oC) 75 °C 50 °C 1 25 °C 12 10 8 6 4 0.1 2 0 0.01 0 10 20 30 VR - Reverse Voltage (V) Document Number: DS_S1412008 40 50 0 10 20 30 40 50 60 VR - Reverse Voltage (V) Version: C14 BAT42 / BAT43 Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING PACKING CODE SUFFIX (Note 2) CODE SUFFIX PART NO. BAT4x (Note1) R0 -xx 10K / 14" Reel DO-35 G A0 PACKING PACKAGE 5K / Box (Ammo) Note 1: "x" is Device Code from "2" thru "3". Note 2: Part No. Suffix „-xx “ would be used for special requirement EXAMPLE PREFERRED P/N PART NO. BAT42 R0G BAT42 BAT42-L0 R0G BAT42 PART NO. SUFFIX -L0 PACKING CODE PACKING CODE SUFFIX DESCRIPTION R0 G Multiple manufacture source Green compound R0 G Define manufacture source Green compound PACKAGE OUTLINE DIMENSION DIM. Unit (mm) Unit (inch) Min Max Min Max A 0.34 0.60 0.013 0.024 B 2.90 5.08 0.114 0.200 C 25.40 38.10 1.000 1.500 D 1.30 2.28 0.051 0.090 MARKING DIAGRAM "x" is Device Code from "2" thru "3". Document Number: DS_S1412008 Version: C14 BAT42 / BAT43 Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1412008 Version: C14