AD AD585 High speed, precision sample-and-hold amplifier Datasheet

This specification documents the detail requirements for space qualified product manufactured on Analog
Devices, Inc.'s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing
flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a
part of this specification. http://www.analog.com/aerospace. This data sheet specifically details the space
grade version of this product. A more detailed operational description and a complete data sheet for
commercial product grades can be found at www.analog.com/AD585.
:
Part Number
Description
AD585-703M
AD585-713M
High Speed, Precision Sample-and-Hold Amplifier
Radiation Tested, High Speed, Precision Sample-and-Hold Amplifier
.
Letter
M
Descriptive designator
GDFP1-F14
Case Outline (Lead Finish per MIL-PRF-38535)
14-Lead ceramic flat pack (CERPAK)
Figure 1 - Terminal connections.
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• AD585S: High Speed, Precision Sample-and-Hold
Amplifier Aerospace Data Sheet
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Supply voltage ...............................................................................................................±18V
Logic inputs ..................................................................................................................... ±VS
Analog inputs................................................................................................................... ±VS
RIN, RFB pins .................................................................................................................... ±VS
Output short circuit to ground ................................................................................. Indefinite
TTL logic reference short circuit to ground ............................................................ Indefinite
Storage temperature range .........................................................................-65°C to +150°C
Ambient operating temperature range (TA) ................................................ -55°C to +125°C
Junction Temperature (TJ) ........................................................................................ +150°C
Lead temperature (soldering, 10 seconds) .............................................................. +300°C
1/ Unless otherwise specified, all voltages are referenced to ground.
.
Supply voltage range:
+VS ................................................................................................... +5V to +18Vdc
-V S ............................................................................................ -12V dc to -18V dc
:
Thermal Resistance, cerpak (M) Package
Junction-to-Case (ΘJC) = 60°/W Max
Junction-to-Ambient (ΘJA) = 140°/W Max
:
TABLE I NOTES:
1/
2/
3/
4/
5/
VS = ±15 V, CH = Internal, RL = Infinite, A = +1, Hold active, sample mode unless otherwise noted.
Tested in hold mode.
Guaranteed if not tested to the limits specified.
Doubles every 10°C.
VOUT = 20 Vp-p. Slew rate = slew current/CH.
:
1/
PDA applies to Subgroup 1 only. Deltas excluded from PDA
2/
See table III for delta limits.
.
:
5.1
HTRB is not applicable for this drawing.
5.2
Burn-in is per MIL-STD-883 Method 1015 test condition D.
5.3
Steady state life test is per MIL-STD-883 Method 1005.
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