ON MMBZ27VCLT1 40 watt peak power zener transient voltage suppressor Datasheet

MMBZ15VDLT1,
MMBZ27VCLT1
Preferred Devices
40 Watt Peak Power
Zener Transient Voltage
Suppressors
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SOT–23 Dual Common Cathode Zeners
for ESD Protection
1
These dual monolithic silicon zener diodes are designed for
applications requiring transient overvoltage protection capability. They
are intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment and other applications. Their dual junction common
cathode design protects two separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
3
2
PIN 1. ANODE
2. ANODE
3. CATHODE
3
Specification Features:
• SOT–23 Package Allows Either Two Separate Unidirectional
•
•
•
•
2
SOT–23
CASE 318
STYLE 9
MARKING DIAGRAM
xxx
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
Package designed for optimal automated board assembly
Small package size for high density applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel.
Replace the “T1” with “T3” in the Device Number to order the
13 inch/10,000 unit reel.
xxx
M
M
•
•
•
1
Configurations or a Single Bidirectional Configuration
Working Peak Reverse Voltage Range – 12.8 V, 22 V
Standard Zener Breakdown Voltage Range – 15 V, 27 V
Peak Power – 40 Watts @ 1.0 ms (Bidirectional),
per Figure 5. Waveform
ESD Rating of Class N (exceeding 16 kV) per the Human
Body Model
Maximum Clamping Voltage @ Peak Pulse Current
Low Leakage < 100 nA
Flammability Rating UL 94V–O
= 15D or 27C
= Date Code
ORDERING INFORMATION
Device
Package
Shipping
MMBZ15VDLT1
SOT–23
3000/Tape & Reel
MMBZ15VDLT3
SOT–23
10,000/Tape & Reel
MMBZ27VCLT1
SOT–23
3000/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2001
April, 2001 – Rev. 5
1
Publication Order Number:
MMBZ15VDLT1/D
MMBZ15VDLT1, MMBZ27VCLT1
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Power Dissipation @ 1.0 ms (Note 1.) @ TL ≤ 25°C
Rating
Ppk
40
Watts
Total Power Dissipation on FR–5 Board (Note 2.) @ TA = 25°C
Derate above 25°C
°PD°
225
1.8
°mW°
mW/°C
Thermal Resistance Junction to Ambient
RθJA
556
°C/W
Total Power Dissipation on Alumina Substrate (Note 3.) @ TA = 25°C
Derate above 25°C
°PD°
300
2.4
°mW
mW/°C
Thermal Resistance Junction to Ambient
RθJA
417
°C/W
TJ, Tstg
– 55 to +150
°C
TL
230
°C
Junction and Storage Temperature Range
Lead Solder Temperature – Maximum (10 Second Duration)
1. Non–repetitive current pulse per Figure 5. and derate above TA = 25°C per Figure 6.
2. FR–5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
VBR
IF
VC VBR VRWM
IR VF
IT
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
Test Current
IPP
Maximum Temperature Coefficient of VBR
IF
Forward Current
VF
Forward Voltage @ IF
Uni–Directional TVS
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2
V
MMBZ15VDLT1, MMBZ27VCLT1
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3)
(VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage
VBR (Note 4.) (V)
VC @ IPP (Note 5.)
@ IT
VC
IPP
VBR
VRWM
IR @ VRWM
Device
Device
Marking
Volts
nA
Min
Nom
Max
mA
V
A
mV/C
MMBZ15VDLT1
15D
12.8
100
14.3
15
15.8
1.0
21.2
1.9
12
(VF = 1.1 V Max @ IF = 200 mA)
Breakdown Voltage
VBR (Note 4.) (V)
VC @ IPP (Note 5.)
@ IT
VC
IPP
VBR
VRWM
IR @ VRWM
Device
Device
Marking
Volts
nA
Min
Nom
Max
mA
V
A
mV/C
MMBZ27VCLT1
27C
22
50
25.65
27
28.35
1.0
38
1.0
26
4. VBR measured at pulse test current IT at an ambient temperature of 25°C.
5. Surge current waveform per Figure 5. and derate per Figure 6.
TYPICAL CHARACTERISTICS
MMBZ15VDLT1
MMBZ27VCLT1
16
BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T )
BREAKDOWN VOLTAGE (VOLTS) (VBR @ I T )
17
BIDIRECTIONAL
15
14
UNIDIRECTIONAL
13
-40
+25
+85
TEMPERATURE (°C)
+125
29
BIDIRECTIONAL
28
27
26
25
-55
Figure 1. Typical Breakdown Voltage
versus Temperature
+25
+85
TEMPERATURE (°C)
Figure 2. Typical Breakdown Voltage
versus Temperature
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3
+125
MMBZ15VDLT1, MMBZ27VCLT1
10000
IR (nA)
100
10
1
0.1
0.01
-40
+25
+85
TEMPERATURE (°C)
+125
Figure 3. Typical Leakage Current
versus Temperature
250
ALUMINA SUBSTRATE
VALUE (%)
150
100
PEAK VALUE IPP
100
200
HALF VALUE
50
IPP
2
FR-5 BOARD
tP
50
0
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO
50% OF IPP.
tr ≤ 10 s
0
25
50
75
100
125
TEMPERATURE (°C)
150
0
175
0
1
Figure 4. Steady State Power Derating Curve
PEAK PULSE DERATING IN % OF PEAK POWER
OR CURRENT @ TA = 25 ° C
PD , POWER DISSIPATION (mW)
300
2
3
t, TIME (ms)
Figure 5. Pulse Waveform
100
90
80
70
60
50
40
30
20
10
0
0
25
4
50
75
100
125
150
TA, AMBIENT TEMPERATURE (°C)
Figure 6. Pulse Derating Curve
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4
175
200
MMBZ15VDLT1, MMBZ27VCLT1
INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
0.8
inches
mm
SOT–23
SOT–23 POWER DISSIPATION
SOLDERING PRECAUTIONS
The power dissipation of the SOT–23 is a function of the
drain pad size. This can vary from the minimum pad size
for soldering to a pad size given for maximum power
dissipation. Power dissipation for a surface mount device is
determined by TJ(max), the maximum rated junction
temperature of the die, RθJA, the thermal resistance from
the device junction to ambient, and the operating
temperature, TA. Using the values provided on the data
sheet for the SOT–23 package, PD can be calculated as
follows:
PD =
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
• Always preheat the device.
• The delta temperature between the preheat and
soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed
260°C for more than 10 seconds.
• When shifting from preheating to soldering, the
maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied
during cooling.
TJ(max) – TA
RθJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 225 milliwatts.
PD = 150°C – 25°C = 225 milliwatts
556°C/W
The 556°C/W for the SOT–23 package assumes the use
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225
milliwatts. There are other alternatives to achieving higher
power dissipation from the SOT–23 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad. Using a
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
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5
MMBZ15VDLT1, MMBZ27VCLT1
Transient Voltage Suppressors – Surface Mount
40 Watts Peak Power
SOT–23
TO–236AB
CASE 318–08
ISSUE AF
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
3
1
V
B S
2
G
C
D
H
J
K
DIM
A
B
C
D
G
H
J
K
L
S
V
INCHES
MIN
MAX
0.1102 0.1197
0.0472 0.0551
0.0350 0.0440
0.0150 0.0200
0.0701 0.0807
0.0005 0.0040
0.0034 0.0070
0.0140 0.0285
0.0350 0.0401
0.0830 0.1039
0.0177 0.0236
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
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6
MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013
0.100
0.085
0.177
0.35
0.69
0.89
1.02
2.10
2.64
0.45
0.60
MMBZ15VDLT1, MMBZ27VCLT1
Notes
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7
MMBZ15VDLT1, MMBZ27VCLT1
Thermal Clad is a trademark of the Bergquist Company
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
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MMBZ15VDLT1/D
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