TI1 OPA343 Single-supply, rail-to-rail operational amplifier Datasheet

OPA
OPA343
OPA2343
OPA4343
OPA
234
3
434
®
3
OPA
434
3
www.ti.com
SINGLE-SUPPLY, RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
microAmplifier ™ Series
FEATURES
APPLICATIONS
●
●
●
●
●
●
●
● DRIVING A/D CONVERTERS
● PCMCIA CARDS
● DATA ACQUISITION
● AUDIO PROCESSING
● COMMUNICATIONS
● ACTIVE FILTERS
● TEST EQUIPMENT
RAIL-TO-RAIL INPUT/OUTPUT
MICRO SIZE PACKAGES
WIDE BANDWIDTH: 5.5MHz
HIGH SLEW RATE: 6V/µs
LOW THD+NOISE: 0.0007% (f = 1kHz)
LOW QUIESCENT CURRENT: 850µA/chan
SINGLE, DUAL, AND QUAD VERSIONS
The OPA343 series operates on a single supply as low as
2.5V, and input common-mode voltage range extends
500mV beyond the supply rails. Output voltage swings to
within 1mV of the supply rails with a 100kΩ load. They
offer excellent dynamic response (BW = 5.5MHz,
SR = 6V/µs), yet quiescent current is only 850µA. Dual
and quad designs feature completely independent circuitry
for lowest crosstalk and freedom from interaction.
The single (OPA343) packages are the tiny SOT-23-5
surface mount and SO-8 surface mount. The dual
(OPA2343) comes in the miniature MSOP-8 surface
mount and SO-8 surface mount. The quad (OPA4343)
packages are the space-saving SSOP-16 surface mount,
SO-14 surface mount, and TSSOP-14 surface mount. All
are specified from –40°C to +85°C and operate from
–55°C to +125°C. A SPICE macromodel is available for
design analysis.
DESCRIPTION
OPA343 series rail-to-rail CMOS operational amplifiers
are designed for low-cost, miniature applications. They
are optimized for low-voltage, single-supply operation.
Rail-to-rail input/output and high-speed operation make
them ideal for driving sampling Analog-to-Digital (A/D)
converters. They are also well suited for general-purpose
and audio applications as well as providing I/V conversion at the output of Digital-to-Analog (D/A) converters.
Single, dual, and quad versions have identical specifications for design flexibility.
OPA343
OPA343
NC
1
8
NC
–In
2
7
V+
Out 1
5
V+
4
–In
V– 2
+In
3
6
Output
V–
4
5
NC
+In 3
OPA4343
OPA4343
SOT-23-5
Out A
1
16
Out D
Out A
1
14
Out D
–In A
2
15
–In D
–In A
2
13
–In D
+In A
3
14
+In D
+In A
3
12
+In D
+V
4
13
–V
12
+In C
SO-8
OPA2343
A
Out A
1
–In A
2
+In A
V–
3
A
B
4
A
D
D
8
V+
7
Out B
V+
4
11
V–
+In B
5
–In B
+In B
5
10
+In C
–In B
6
11
–In C
–In B
6
9
–In C
Out B
7
10
Out C
Out B
7
8
Out C
NC
8
9
NC
6
5
+In B
B
B
SO-8, MSOP-8
Copyright © 2000, Texas Instruments Incorporated
C
TSSOP-14
SBOS090A
C
SSOP-16
Printed in U.S.A. October, 2000
SPECIFICATIONS: VS = 2.7V to 5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C. VS = 5V.
At TA = +25°C, RL = 10kΩ connected to VS /2 and VOUT = VS /2, unless otherwise noted.
OPA343NA, UA
OPA2343EA, UA
OPA4343EA, UA, NA
PARAMETER
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
vs Power Supply
Over Temperature
Channel Separation, dc
INPUT BIAS CURRENT
Input Bias Current
Over Temperature
Input Offset Current
NOISE
Input Voltage Noise, f = 0.1 to 50kHz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
CONDITION
VOS
dVOS/dT
PSRR
MIN
VS = 5V
VS = 2.7V to 5.5V, VCM = 0V
VS = 2.7V to 5.5V, VCM = 0V
mV
µV/°C
µV/V
µV/V
µV/V
±0.2
en
in
8
25
3
VCM
CMRR
AOL
GBW
SR
THD+N
Over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT-23-5 Surface Mount
MSOP-8 Surface Mount
SO-8 Surface Mount
SSOP-16 Surface Mount
SO-14 Surface Mount
TSSOP-14 Surface Mount
±8
IOS
OUTPUT
Voltage Output Swing from Rail(3)
Over Temperature
POWER SUPPLY
Specified Voltage Range
Operating Voltage Range
Quiescent Current (per amplifier)
Over Temperature
±2
±3
40
±0.2
Over Temperature
Over Temperature
Short-Circuit Current
Capacitive Load Drive
UNITS
IB
Over Temperature
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
Total Harmonic Distortion + Noise
MAX
200
200
0.2
–0.3V < VCM < (V+) – 1.8V
VS = 5V, –0.3V < VCM < 5.3V
VS = 2.7V, –0.3V < VCM < 3V
–0.3
74
60
54
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
Over Temperature
TYP(1)
RL = 100kΩ, 5mV < VO < (V+) – 5mV
RL = 100kΩ, 5mV < VO < (V+) – 5mV
RL = 10kΩ, 50mV < VO < (V+) – 50mV
RL = 10kΩ, 50mV < VO < (V+) – 50mV
RL = 2kΩ, 200mV < VO < (V+) – 200mV
RL = 2kΩ, 200mV < VO < (V+) – 200mV
100
100
100
100
92
92
±10
µVrms
nV/√Hz
fA/√Hz
(V+) + 0.3
V
dB
dB
dB
1013 || 3
1013 || 6
Ω || pF
Ω || pF
120
dB
dB
dB
dB
dB
dB
117
110
5.5
6
1
1.6
0.2
0.0007
RL = 100kΩ, AOL ≥ 100dB
RL = 100kΩ, AOL ≥ 100dB
RL = 10kΩ, AOL ≥ 100dB
RL = 10kΩ, AOL ≥ 100dB
RL = 2kΩ, AOL ≥ 92dB
RL = 2kΩ, AOL ≥ 92dB
1
MHz
V/µs
µs
µs
µs
%
10
40
5
5
50
50
200
200
mV
mV
mV
mV
mV
mV
mA
5
1.25
1.4
V
V
mA
mA
+85
+125
+150
°C
°C
°C
±50
See Typical Curve
ISC
CLOAD
IQ
pA
pA
pA
92
75
70
G=1
VS = 5V, G = 1, CL = 100pF
VS = 5V, 2V Step, CL = 100pF
VS = 5V, 2V Step, CL = 100pF
VIN • G = VS
VS = 5V, VO = 3Vp-p(2), G = 1, f = 1kHz
VS
±10
±60
2.7
2.5 to 5.5
0.85
IO = 0, VS = +5V
IO = 0, VS = +5V
–40
–55
–65
θJA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
200
150
150
100
100
125
NOTES: (1) VS = +5V. (2) VOUT = 0.25V to 3.25V. (3) Output voltage swings are measured between the output and power supply rails.
2
OPA343, 2343, 4343
SBOS090A
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage ................................................................................... 7.5V
Signal Input Terminals, Voltage(2) ..................... (V–) –0.5V to (V+) +0.5V
Current(2) .................................................... 10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ..................................................... –65°C to +150°C
Junction Temperature ...................................................................... 150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Input terminals are diode-clamped to the power
supply rails. Input signals that can swing more than 0.5V beyond the supply
rails should be current-limited to 10mA or less. (3) Short-circuit to ground,
one amplifier per package.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER
Single
OPA343NA
5-Lead SOT-23-5
331
–40°C to +85°C
B43
"
"
"
"
"
OPA343UA
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
OPA343NA/250
OPA343NA /3K
OPA343UA
OPA343UA /2K5
Tape and Reel
Tape and Reel
Rails
Tape and Reel
OPA2343EA /250
OPA2343EA/2K5
OPA2343UA
OPA2343UA/2K5
Tape and Reel
Tape and Reel
Rails
Tape and Reel
OPA4343EA /250
OPA4343EA /2K5
OPA4343UA
OPA4343UA /2K5
OPA4343NA/250
OPA4343NA/2K5
Tape and Reel
Tape and Reel
Rails
Tape and Reel
Tape and Reel
Tape and Reel
SO-8 Surface-Mount
182
–40°C to +85°C
OPA343UA
"
"
"
"
"
Dual
OPA2343EA
MSOP-8 Surface-Mount
337
–40°C to +85°C
C43
"
"
"
"
"
OPA2343UA
"
SO-8 Surface-Mount
182
–40°C to +85°C
OPA2343UA
"
"
"
"
SSOP-16 Surface-Mount
322
–40°C to +85°C
OPA4343EA
"
"
"
"
SO-14 Surfac-Mount
235
–40°C to +85°C
OPA4343UA
"
"
"
"
TSSOP-14 Surface-Mount
"
357
"
–40°C to +85°C
"
OPA4343NA
"
Quad
OPA4343EA
"
OPA4343UA
"
OPA4343NA
"
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces
of “OPA2343EA/2K5” will get a single 2500 piece Tape and Reel.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility
for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or
licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support
devices and/or systems.
OPA343, 2343, 4343
SBOS090A
3
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = +5V, and RL = 10kΩ connected to VS/2, unless otherwise noted.
POWER-SUPPLY and COMMON-MODE
REJECTION vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
160
0
100
PSRR
140
80
–90
60
40
–135
PSRR, CMRR (dB)
–45
100
Phase (°)
Voltage Gain (dB)
120
80
20
60
40
CMRR
VCM = –0.3V to (V+) –1.8V
20
0
–180
–20
0
0.1
1
10
100
1k
10k
100k
1M
10M
1
10
100
Frequency (Hz)
1k
10k
100k
1M
Frequency (Hz)
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
140
1k
10k
10
100
1
10
Channel Separation (dB)
100
Voltage Noise
Current Noise (fA√Hz)
Voltage Noise (nV√Hz)
Current Noise
1k
1
10
100
1k
10k
100k
120
Dual and quad devices.
G = 1, all channels.
Quad measured channel A to D
or B to C—other combinations
yield improved rejection.
110
100
0.1
1
130
10
1M
100
1k
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
CLOSED-LOOP OUTPUT IMPEDANCE
vs FREQUENCY
5k
G = 100
RL = 600
0.01
G = 10
RL = 10k
RL = 600
0.001
RL = 2k
G=1
RL = 10k
0.0001
Output Resistance (Ω)
4k
RL = 2k
THD+N (%)
100k
Frequency (Hz)
0.1
G = 10
3k
2k
G=1
1k
0
20
100
1k
Frequency (Hz)
4
10k
Frequency (Hz)
10k
20k
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
OPA343, 2343, 4343
SBOS090A
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = +5V, and RL = 10kΩ connected to VS/2, unless otherwise noted.
OPEN-LOOP GAIN AND POWER-SUPPLY REJECTION
vs TEMPERATURE
COMMON-MODE REJECTION vs TEMPERATURE
100
130
AOL, PSRR (dB)
110
RL = 100kΩ
90
RL = 10kΩ
80
CMRR (dB)
AOL
120
RL = 2kΩ
100
70
60
PSRR
90
VS = 2.7V to 5V, VCM = –0.3V to (V+) –1.8V
VS = 5V, VCM = –0.3V to 5.3V
VS = 2.7V, VCM = –0.3V to 3V
50
40
80
–75
–50
–25
0
25
50
75
100
–75
125
–50
–25
50
75
100
125
900
Per Amplifier
Per Amplifier
1000
Quiescent Current (µA)
Quiescent Current (µA)
25
QUIESCENT CURRENT vs SUPPLY VOLTAGE
QUIESCENT CURRENT vs TEMPERATURE
1100
900
800
700
600
850
800
750
700
–75
–50
–25
0
25
50
75
100
2.0
125
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
Temperature (°C)
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
SHORT-CIRCUIT CURRENT vs TEMPERATURE
60
100
Short-Circuit Current (mA)
–ISC
90
Short-Circuit Current (mA)
0
Temperature (°C)
Temperature (°C)
80
70
60
50
+ISC
40
30
20
–ISC
50
+ISC
40
10
30
0
–75
–50
–25
0
25
50
Temperature (°C)
OPA343, 2343, 4343
SBOS090A
75
100
125
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Supply Voltage (V)
5
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = +5V, and RL = 10kΩ connected to VS/2, unless otherwise noted.
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
1000
1.0
0.6
100
Input Bias Current (pA)
Input Bias Current (pA)
0.8
10
1
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0.1
–1.0
–60
–40
–20
0
20
40
60
80
100
–1
0
1
Temperature (°C)
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
+25°C
–55°C
Output Voltage (Vp-p)
Output Voltage (V)
3
2
+125°C
±10 ±20
±30 ±40
±50 ±60
±70 ±80 ±90 ±100
VS = 2.7V
3
2
1M
10M
Frequency (Hz)
OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
30
25
Typical production
distribution of
packaged units.
Percent of Amplifiers (%)
Percent of Amplifiers (%)
6
4
Output Current (mA)
25
5
Maximum output
voltage without
slew rate-induced
distortion.
0
100k
0
0
4
1
–55°C
+25°C
VS = 5.5V
5
4
1
3
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
6
5
+125°C
2
Common-Mode Voltage (V)
20
15
10
5
0
Typical production
distribution of
packaged units.
20
15
10
5
0
–8 –7 –6 –5 –4 –3 –2 –1 0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
9
10 11 12 13 14
Offset Voltage Drift (µV/°C)
Offset Voltage (mV)
6
OPA343, 2343, 4343
SBOS090A
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = +5V, and RL = 10kΩ connected to VS/2, unless otherwise noted.
LARGE-SIGNAL STEP RESPONSE
CL = 100pF
CL = 100pF
1V/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
1µs/div
1µs/div
SETTLING TIME vs CLOSED-LOOP GAIN
SMALL-SIGNAL OVERSHOOT vs LOAD CAPACITANCE
100
60
G = –1
0.01%
Settling Time (µs)
Overshoot (%)
50
G = +1
40
30
G = ±5
20
10
0.1%
1
See text for
reducing overshoot.
10
0.1
0
100
1000
Load Capacitance (pF)
OPA343, 2343, 4343
SBOS090A
10k
1
10
100
1000
Closed-Loop Gain (V/V)
7
APPLICATIONS INFORMATION
OPERATING VOLTAGE
OPA343 series op amps are fabricated on a state-of-the-art
0.6 micron CMOS process. They are unity-gain stable and
suitable for a wide range of general-purpose applications.
Rail-to-rail input/output make them ideal for driving sampling A/D converters. In addition, excellent ac performance
makes them well-suited for audio applications. The class AB
output stage is capable of driving 600Ω loads connected to
any point between V+ and ground.
OPA343 series op amps are fully specified from +2.7V to
+5V. However, supply voltage may range from +2.5V to
+5.5V. Parameters are guaranteed over the specified supply
range—a unique feature of the OPA343 series. In addition,
many specifications apply from –40°C to +85°C. Most
behavior remains virtually unchanged throughout the full
operating voltage range. Parameters which vary significantly with operating voltages or temperature are shown in
the Typical Performance Curves.
Rail-to-rail input and output swing significantly increases
dynamic range, especially in low-supply applications. Figure 1 shows the input and output waveforms for the
OPA343 in unity-gain configuration. Operation is from a
single +5V supply with a 10kΩ load connected to VS /2.
The input is a 5Vp-p sinusoid. Output voltage is approximately 4.98Vp-p.
Power-supply pins should be bypassed with 0.01µF ceramic
capacitors.
VS = +5, G = +1, RL = 10kΩ
5
2V/div
VIN
5
VOUT
RAIL-TO-RAIL INPUT
The input common-mode voltage range of the OPA343
series extends 500mV beyond the supply rails. This is
achieved with a complementary input stage—an N-channel
input differential pair in parallel with a P-channel differential pair, as shown in Figure 2. The N-channel pair is active
for input voltages close to the positive rail, typically (V+)
– 1.3V to 500mV above the positive supply. The P-channel
pair is on for inputs from 500mV below the negative supply
to approximately (V+) – 1.3V.
There is a small transition region, typically (V+) – 1.5V to
(V+) – 1.1V, in which both input pairs are on. This 400mV
transition region can vary ±300mV with process variation.
Thus, the transition region (both stages on) can range from
(V+) – 1.8V to (V+) – 1.4V on the low end, up to (V+)
– 1.2V to (V+) – 0.8V on the high end. Within the 400mV
transition region PSRR, CMRR, offset voltage, offset drift,
and THD may be degraded compared to operation outside
this region.
A double-folded cascode adds the signal from the two input
pairs and presents a differential signal to the class AB output
stage. Normally, input bias current is approximately 200fA,
however, input voltages exceeding the power supplies by
0
FIGURE 1. Rail-to-Rail Input and Output.
V+
Reference
Current
VIN+
VIN–
VBIAS1
Class AB
Control
Circuitry
VO
VBIAS2
V–
(Ground)
FIGURE 2. Simplified Schematic.
8
OPA343, 2343, 4343
SBOS090A
more than 500mV can cause excessive current to flow in or
out of the input pins. Momentary voltages greater than
500mV beyond the power supply can be tolerated if the
current on the input pins is limited to 10mA. This is easily
accomplished with an input resistor, as shown in Figure 3.
Many input signals are inherently current-limited to less
than 10mA, therefore, a limiting resistor is not required.
V+
IOVERLOAD
10mA max
VOUT
OPAx343
VIN
5kΩ
FIGURE 3. Input Current Protection for Voltages Exceeding
the Supply Voltage.
RAIL-TO-RAIL OUTPUT
A class AB output stage with common-source transistors is
used to achieve rail-to-rail output. For light resistive loads
(>50kΩ), the output voltage is typically a few millivolts
from the supply rails. With moderate resistive loads (2kΩ to
50kΩ), the output can swing to within a few tens of millivolts from the supply rails and maintain high open-loop
gain. See the typical performanc curve “Output Voltage
Swing vs Output Current.”
CAPACITIVE LOAD AND STABILITY
OPA343 series op amps can drive a wide range of capacitive
loads. However, all op amps under certain conditions may
become unstable. Op amp configuration, gain, and load
value are just a few of the factors to consider when determining stability. An op amp in unity gain configuration is the
most susceptible to the effects of capacitive load. The
capacitive load reacts with the op amp’s output resistance,
along with any additional load resistance, to create a pole in
the small-signal response which degrades the phase margin.
In unity gain, OPA343 series op amps perform well, with a
pure capacitive load up to approximately 1000pF. Increasing
gain enhances the amplifier’s ability to drive more capacitance. See the typical performance curve “Small-Signal
Overshoot vs Capacitive Load.”
One method of improving capacitive load drive in the unity
gain configuration is to insert a 10Ω to 20Ω resistor in series
with the output, as shown in Figure 4. This significantly
reduces ringing with large capacitive loads. However, if
there is a resistive load in parallel with the capacitive load,
RS creates a voltage divider. This introduces a dc error at the
output and slightly reduces output swing. This error may be
insignificant. For instance, with RL = 10kΩ and RS = 20Ω,
there is only about a 0.2% error at the output.
DRIVING A/D CONVERTERS
OPA343 series op amps are optimized for driving medium
speed (up to 100kHz) sampling A/D converters. However,
they also offer excellent performance for higher-speed
converters. The OPA343 series provides an effective means
of buffering the A/D’s input capacitance and resulting
charge injection while providing signal gain. For applications requiring high accuracy, the OPA340 series is recommended.
Figures 5 and 6 show the OPA343 driving an ADS7816.
The ADS7816 is a 12-bit, micro-power sampling converter
in the tiny MSOP-8 package. When used with the miniature package options of the OPA343 series, the combination is ideal for space-limited and low-power applications.
For further information consult the ADS7816 data sheet.
With the OPA343 in a noninverting configuration, an RC
network at the amplifier’s output can be used to filter high
frequency noise in the signal (see Figure 5). In the inverting configuration, filtering may be accomplished with a
capacitor across the feedback resistor (see Figure 6).
V+
RS
VOUT
OPAx343
VIN
10Ω to
20Ω
RL
CL
FIGURE 4. Series Resistor in Unity-Gain Configuration Improves Capacitive Load Drive.
OPA343, 2343, 4343
SBOS090A
9
+5V
For improved accuracy use OPA340.
0.1µF
0.1µF
1 VREF
8 V+
7
DCLOCK
500Ω
+In
OPA343
ADS7816
12-Bit A/D
2
VIN
–In
Serial
Interface
5
CS/SHDN
3
3300pF
6
DOUT
GND 4
VIN = 0V to 5V for
0V to 5V output.
NOTE: A/D Input = 0 to VREF
RC network filters high frequency noise.
FIGURE 5. OPA343 in Noninverting Configuration Driving ADS7816.
+5V
330pF
0.1µF
For improved accuracy use OPA340.
5kΩ
0.1µF
5kΩ
VIN
1 VREF
8 V+
DCLOCK
+In
OPA343
ADS7816
12-Bit A/D
2
DOUT
–In
CS/SHDN
3
7
6
Serial
Interface
5
GND 4
VIN = 0V to –5V for 0V to 5V output.
NOTE: A/D Input = 0 to VREF
FIGURE 6. OPA343 in Inverting Configuration Driving ADS7816.
Filters 160Hz to 2.4kHz
+5V
10MΩ
VIN
200pF
10MΩ
1/2
OPA2343
243kΩ
1.74MΩ
47pF
1/2
OPA2343
RL
220pF
FIGURE 7. Speech Bandpass Filter.
<1pF (prevents gain peaking)
10MΩ
+V
λ
OPA343
VO
FIGURE 8. Transimpedance Amplifier.
10
OPA343, 2343, 4343
SBOS090A
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA2343EA/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
C43
OPA2343EA/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
C43
OPA2343EA/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
C43
OPA2343EA/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-2-260C-1 YEAR
-40 to 85
C43
OPA2343UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
2343UA
OPA2343UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
2343UA
OPA2343UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
2343UA
OPA2343UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
2343UA
OPA343NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
B43
OPA343NA/250G4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
B43
OPA343NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
B43
OPA343NA/3KG4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
B43
OPA343UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
343UA
OPA343UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
343UA
OPA343UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
343UA
OPA343UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
343UA
OPA4343EA/250
ACTIVE
SSOP
DBQ
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343EA
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA4343EA/250G4
ACTIVE
SSOP
DBQ
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343EA
OPA4343EA/2K5
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343EA
OPA4343EA/2K5G4
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343EA
OPA4343NA/250
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343NA
OPA4343NA/250G4
ACTIVE
TSSOP
PW
14
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343NA
OPA4343NA/2K5
ACTIVE
TSSOP
PW
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA
4343NA
OPA4343UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA4343UA
OPA4343UA/2K5
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
OPA4343UA
OPA4343UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
OPA4343UA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
10-Jun-2014
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OPA2343EA/250
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2343EA/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2343UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA343NA/250
SOT-23
DBV
5
250
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA343NA/3K
SOT-23
DBV
5
3000
178.0
9.0
3.23
3.17
1.37
4.0
8.0
Q3
OPA343UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4343EA/250
SSOP
DBQ
16
250
180.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4343EA/2K5
SSOP
DBQ
16
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4343NA/250
TSSOP
PW
14
250
180.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4343NA/2K5
TSSOP
PW
14
2500
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
OPA4343UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA2343EA/250
VSSOP
DGK
OPA2343EA/2K5
VSSOP
DGK
8
250
366.0
364.0
50.0
8
2500
366.0
364.0
50.0
OPA2343UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA343NA/250
SOT-23
DBV
5
250
180.0
180.0
18.0
OPA343NA/3K
SOT-23
DBV
5
3000
180.0
180.0
18.0
OPA343UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4343EA/250
SSOP
DBQ
16
250
210.0
185.0
35.0
OPA4343EA/2K5
SSOP
DBQ
16
2500
367.0
367.0
35.0
OPA4343NA/250
TSSOP
PW
14
250
210.0
185.0
35.0
OPA4343NA/2K5
TSSOP
PW
14
2500
367.0
367.0
35.0
OPA4343UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Similar pages