MBRS1035 thru MBRS10150 Taiwan Semiconductor CREAT BY ART FEATURES Surface Mount Schottky Barrier Rectifiers - Low power loss, high efficiency - Ideal for automated placement - Guardring for overvoltage protection - High surge current capability - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA TO-263AB (D2PAK) Case: TO-263AB (D2PAK) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Polarity: As marked Weight: 1.37 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER SYMBOL MBRS MBRS MBRS MBRS MBRS MBRS MBRS 1035 1045 1050 1060 1090 10100 10150 Unit Maximum repetitive peak reverse voltage VRRM 35 45 50 60 90 100 150 V Maximum RMS voltage VRMS 24 31 35 42 63 70 105 V Maximum DC blocking voltage VDC 35 45 50 60 90 100 150 V Maximum average forward rectified current IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 120 A Peak repetitive reverse surge Current (Note 1) IRRM Maximum instantaneous forward voltage (Note 2) IF=10A, TJ=25℃ IF=10A, TJ=125℃ IF=20A, TJ=25℃ IF=20A, TJ=125℃ Maximum reverse current @ rated VR TJ=25 ℃ TJ=100 ℃ TJ=125 ℃ Voltage rate of change (Rated VR) Typical thermal resistance Operating junction temperature range Storage temperature range VF 1 0.5 A - 0.80 0.85 1.05 0.57 0.70 0.71 - 0.84 0.95 - - 0.72 0.85 - - V 0.1 IR 15 10 - mA 5 dV/dt 10000 RθJC 2 RθJA 60 TJ - 55 to +175 O C - 55 to +175 O C TSTG V/μs O C/W Note 1: 2.0us Pulse Width, f=1.0KHz Note 2: Pulse Test : 300us Pulse Width, 1% Duty Cycle Document Number: DS_D1309055 Version: I13 MBRS1035 thru MBRS10150 Taiwan Semiconductor ORDERING INFORMATION PART NO. AEC-Q101 PACKING CODE GREEN COMPOUND QUALIFIED MBRS10xx (Note 1) PACKAGE PACKING D2PAK 800 / 13" Paper reel CODE RN Prefix "H" Suffix "G" C0 2 50 / Tube D PAK Note 1: "xx" defines voltage from 35V (MBRS1035) to 150V (MBRS10150) EXAMPLE AEC-Q101 PREFERRED P/N PART NO. MBRS1060 RN MBRS1060 RN MBRS1060 RNG MBRS1060 RN MBRS1060HRN MBRS1060 GREEN COMPOUND PACKING CODE QUALIFIED H CODE G DESCRIPTION Green compound RN AEC-Q101 qualified RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE 10 8 6 4 RESISTIVE OR INDUCTIVELOAD WITH HEATSINK 2 0 50 60 70 80 90 100 110 120 130 140 150 160 170 180 PEAK FORWARD SURGE CURRENT (A) AVERAGE FORWARD A CURRENT (A) 12 FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PER LEG 160 8.3ms Single Half Sine Wave JEDEC Method 140 120 100 80 60 40 1 10 CASE TEMPERATURE (oC) FIG. 3 TYPICAL FORWARD CHARACTERISTICS PER LEG FIG. 4 TYPICAL REVERSE CHARACTERISTICS PER LEG 100 100 INSTANTANEOUS REVERSE A CURRENT (mA) TJ=100℃ INSTANTANEOUS FORWARD A CURRENT (A) 100 NUMBER OF CYCLES AT 60 Hz 10 TJ=150℃ 1 10 TJ=100℃ 1 TJ=25℃ 0.1 TJ=25℃ 0.01 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 FORWARD VOLTAGE (V) Document Number: DS_D1309055 0.8 0.9 1 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Version: I13 MBRS1035 thru MBRS10150 Taiwan Semiconductor FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE PER LEG FIG. 5 TYPICAL JUNCTION CAPACITANCE 500 MBRS1035-MBRS1045 400 100 f=1.0MHz Vsig=50mVp-p TRANSIENT THERMAL IMPEDANCE A (℃/W) JUNCTION CAPACITANCE (pF) A 600 10 MBRS1050-MBRS1060 300 200 MBRS1090-MBRS10150 100 1 0.1 0 0.01 0.1 1 10 100 0.01 0.1 1 10 100 T-PULSE DURATION(s) REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A - 10.5 - 0.413 B 14.60 15.88 0.575 0.625 C 2.41 2.67 0.095 0.105 D 0.68 0.94 0.027 0.037 E 2.29 2.79 0.090 0.110 F 4.44 4.70 0.175 0.185 G 1.14 1.40 0.045 0.055 H 1.14 1.40 0.045 0.055 I 8.25 9.25 0.325 0.364 J 0.36 0.53 0.014 0.021 K 2.03 2.79 0.080 0.110 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 10.8 0.425 B 8.3 0.327 C 1.1 0.043 D 3.5 0.138 E 16.9 0.665 F 9.5 0.374 G 2.5 0.098 MARKING DIAGRAM P/N = Specific Device Code G = Green Compound YWW = Date Code F = Factory Code Document Number: DS_D1309055 Version: I13 MBRS1035 thru MBRS10150 Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1309055 Version: I13