ZXTP5401FL 150V, SOT23, PNP High voltage transistor Summary BVCEO > -150V BVEBO > -5V IC(cont) = -600mA PD = 330mW Complementary part number ZXTN5551FL Description C A high voltage PNP transistor in a small outline surface mount package. Features • 150V rating • SOT23 package B E Applications • E High voltage amplification C Ordering information Device Reel size (inches) Tape width (mm) Quantity per reel 7 8 3000 ZXTP5401FLTA B Pinout - top view Device marking P01 Issue 1 - August 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com ZXTP5401FL Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage VCBO -160 V Collector-emitter voltage VCEO -150 V Emitter-base voltage VEBO -5 V IC -600 mA Pulsed collector current ICM -1 A Power dissipation at Tamb =25°C(a) PD 330 mW 2.64 mW/°C Tj, Tstg -55 to 150 °C Symbol Limit Unit R⍜JA 379 °C/W Continuous collector current(a) Linear derating factor Operating and storage temperature range Thermal resistance Parameter Junction to ambient(a) NOTES: (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz weight copper, in still air conditions. Issue 1 - August 2007 © Zetex Semiconductors plc 2007 2 www.zetex.com ZXTP5401FL Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Collector-base breakdown BVCBO voltage -160 Collector-emitter breakdown voltage (base open) BVCEO Emitter-base breakdown voltage BVEBO Collector cut-off current ICBO Collector-emitter saturation voltage VCE(sat) Base-emitter saturation voltage VBE(sat) Static forward current transfer ratio hFE Transition frequency fT Output capacitance COBO Delay time t(d) Rise time Unit Conditions -270 V IC = -100A -150 -240 V IC = -1mA (*) -5 -8.1 V IE = -10A <-1 Max. -50 nA VCB = -120V -50 A VCB = -120V, Tamb= 100°C -50 -200 mV IC = -10mA, IB = -1mA(*) -70 -500 mV IC = -50mA, IB = -5mA(*) -700 1000 mV IC = -10mA, IB = -1mA(*) -750 1000 mV IC = -50mA, IB = -5mA(*) 50 135 60 135 50 130 IC = -1mA, VCE = -5V(*) 240 IC = -10mA, VCE = -5V(*) IC = -50mA, VCE = -5V(*) 100 MHz IC = -10mA, VCE = -10V f = 100MHz pF VCB = -10V, f = 1MHz(*) 386 ns t(r) 202 ns VCC = -50V. IC = 100mA, IB1 = IB2= -10mA. Storage time t(s) 1720 ns Fall time t(f) 275 ns 10 NOTES: (*) Measured under pulsed conditions. Pulse width ⱕ300s; duty cycle ⱕ2%. Issue 1 - August 2007 © Zetex Semiconductors plc 2007 3 www.zetex.com ZXTP5401FL Typical characteristics -0.8 VCE(sat) - (Volts) IC/IB=10 -0.6 -0.4 -0.2 0 -0.0001 -0.001 -0.01 -0.1 -1 IC - Collector Current (Amps) VCE(sat) v IC -1.4 80 -1.2 VCE=-10V 60 VBE(sat) - (Volts) hFE - Normalised Gain (%) 100 40 20 IC/IB=10 -1.0 -0.8 -0.6 0 -0.0001 -0.001 -0.01 -0.1 -0.0001 1 -0.001 -0.01 -0.1 IC - Collector Current (Amps) IC - Collector Current (Amps) hFE v IC VBE(sat) v IC -1 -1.4 VBE - (Volts) -1.2 VCE=-10V -1.0 -0.8 -0.6 -0.0001 -0.001 -0.01 -0.1 -1 IC - Collector Current (Amps) VBE(on) v IC Issue 1 - August 2007 © Zetex Semiconductors plc 2007 4 www.zetex.com ZXTP5401FL Intentionally left blank Issue 1 - August 2007 © Zetex Semiconductors plc 2007 5 www.zetex.com ZXTP5401FL Intentionally left blank Issue 1 - August 2007 © Zetex Semiconductors plc 2007 6 www.zetex.com ZXTP5401FL Package outline - SOT23 E e e1 b 3 leads L1 D E1 A A1 Dim. L c Millimeters Inches Dim. Millimeters Min. Max. Min. Max. A - 1.12 - 0.044 e1 A1 0.01 0.10 0.0004 0.004 E 2.10 2.64 0.083 0.104 b 0.30 0.50 0.012 0.020 E1 1.20 1.40 0.047 0.055 c 0.085 0.20 0.003 0.008 L 0.25 0.60 0.0098 0.0236 D 2.80 3.04 0.110 0.120 L1 0.45 0.62 0.018 0.024 - - - - - e 0.95 NOM Min. 0.037 NOM Max. Inches 1.90 NOM Min. Max. 0.075 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Issue 1 - August 2007 © Zetex Semiconductors plc 2007 7 www.zetex.com ZXTP5401FL Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. 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Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding regulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production has been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet version and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet containing finalized specifications. However, changes to specifications may occur, at any time and without notice. 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