NSC ADC081S021CIMF Single channel, 50 to 200ksps, 8-bit a/d converter Datasheet

ADC081S021
Single Channel, 50 to 200 ksps, 8-Bit A/D Converter
General Description
Features
The ADC081S021 is a low-power, single channel CMOS
8-bit analog-to-digital converter with a high-speed serial interface. Unlike the conventional practice of specifying performance at a single sample rate only, the ADC081S021 is
fully specified over a sample rate range of 50 ksps to 200
ksps. The converter is based upon a successiveapproximation register architecture with an internal trackand-hold circuit.
The output serial data is straight binary, and is compatible
with several standards, such as SPI™, QSPI™,
MICROWIRE, and many common DSP serial interfaces.
n
n
n
n
n
The ADC081S021 operates with a single supply that can
range from +2.7V to +5.25V. Normal power consumption
using a +3.6V or +5.25V supply is 1.3 mW and 7.7 mW,
respectively. The power-down feature reduces the power
consumption to as low as 2.6 µW using a +5.25V supply.
The ADC081S021 is packaged in 6-lead LLP and SOT-23
packages. Operation over the industrial temperature range
of −40˚C to +85˚C is guaranteed.
Specified over a range of sample rates.
6-lead LLP and SOT-23 packages
Variable power management
Single power supply with 2.7V - 5.25V range
SPI™/QSPI™/MICROWIRE/DSP compatible
Key Specifications
n
n
n
n
DNL
INL
SNR
Power Consumption
— 3.6V Supply
— 5.25V Supply
+0.04/-0.03 LSB (typ)
+0.04/-0.03 LSB (typ)
49.6 dB (typ)
1.3 mW (typ)
7.7 mW (typ)
Applications
n Portable Systems
n Remote Data Acquisition
n Instrumentation and Control Systems
Pin-Compatible Alternatives by Resolution and Speed
All devices are fully pin and function compatible.
Resolution
Specified for Sample Rate Range of:
50 to 200 ksps
200 to 500 ksps
500 ksps to 1 Msps
ADC121S021
ADC121S051
ADC121S101
10-bit
ADC101S021
ADC101S051
ADC101S101
8-bit
ADC081S021
ADC081S051
ADC081S101
12-bit
Connection Diagram
20145405
Ordering Information
Order Code
Temperature Range
Description
Top Mark
ADC081S021CISD
−40˚C to +85˚C
6-Lead LLP Package
X9C
ADC081S021CISDX
−40˚C to +85˚C
6-Lead LLP Package, Tape & Reel
X9C
ADC081S021CIMF
−40˚C to +85˚C
6-Lead SOT-23 Package
X09C
ADC081S021CIMFX
−40˚C to +85˚C
6-Lead SOT-23 Package, Tape & Reel
X09C
ADC081S021EVAL
SOT-23 Evaluation Board
TRI-STATE ® is a trademark of National Semiconductor Corporation
QSPI™ and SPI™ are trademarks of Motorola, Inc.
© 2006 National Semiconductor Corporation
DS201454
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ADC081S021 Single Channel, 50 to 200 ksps, 8-Bit A/D Converter
January 2006
ADC081S021
Block Diagram
20145407
Pin Descriptions and Equivalent Circuits
Pin No.
Symbol
Description
ANALOG I/O
3
VIN
Analog input. This signal can range from 0V to VA.
DIGITAL I/O
4
SCLK
Digital clock input. This clock directly controls the conversion and readout processes.
5
SDATA
Digital data output. The output samples are clocked out of this pin on falling edges of
the SCLK pin.
6
CS
Chip select. On the falling edge of CS, a conversion process begins.
1
VA
Positive supply pin. This pin should be connected to a quiet +2.7V to +5.25V source
and bypassed to GND with a 1 µF capacitor and a 0.1 µF monolithic capacitor located
within 1 cm of the power pin.
2
GND
The ground return for the supply and signals.
PAD
GND
For package suffix CISD(X) only, it is recommended that the center pad should be
connected to ground.
POWER SUPPLY
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2
Operating Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Operating Temperature Range
VA Supply Voltage
Voltage on Any Analog Pin to GND
−0.3V to (VA +0.3V)
Voltage on Any Digital Pin to GND
−0.3V to 6.5V
Package Input Current (Note 3)
Power Consumption at TA = 25˚C
0V to VA
Clock Frequency
1 MHz to 4 MHz
Sample Rate
See (Note 4)
ESD Susceptibility (Note 5)
Human Body Model
Machine Model
−0.3V to 5.25V
Analog Input Pins Voltage Range
± 10 mA
± 20 mA
Input Current at Any Pin (Note 3)
+2.7V to +5.25V
Digital Input Pins Voltage Range
(regardless of supply voltage)
−0.3V to 6.5V
Analog Supply Voltage VA
−40˚C ≤ TA ≤ +85˚C
up to 200 ksps
Package Thermal Resistance
θJA
Package
3500V
300V
6-lead LLP
94˚C / W
Junction Temperature
+150˚C
6-lead SOT-23
265˚C / W
Storage Temperature
−65˚C to +150˚C
Soldering process must comply with National Semiconductor’s Reflow Temperature Profile specifications. Refer to
www.national.com/packaging. (Note 6)
ADC081S021 Converter Electrical Characteristics (Notes 7, 9)
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Typical
Limits
(Note 9)
8
Bits
± 0.03
± 0.3
LSB (max)
Units
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
VA = +2.7V to +3.6V
INL
Integral Non-Linearity
VA = +4.75V to +5.25V
VA = +2.7V to +3.6V
DNL
VOFF
GE
Differential Non-Linearity
Offset Error
Gain Error
VA = +4.75V to +5.25V
VA = +2.7V to +3.6V
± 0.03
+0.04
−0.03
−0.01
VA = +4.75V to +5.25V
+0.03
VA = +2.7V to +3.6V
+0.04
VA = +4.75V to +5.25V
+0.1
VA = +2.7V to +3.6V
TUE
+0.04
−0.03
Total Unadjusted Error
VA = +4.75V to +5.25V
+0.055
−0.065
+0.03
−0.06
± 0.3
± 0.2
± 0.2
± 0.2
± 0.2
± 0.4
± 0.4
± 0.3
± 0.3
LSB (max)
LSB (min)
LSB (max)
LSB (max)
LSB (min)
LSB (max)
LSB (max)
LSB (max)
LSB (max)
LSB (max)
LSB (min)
LSB (max)
LSB (min)
DYNAMIC CONVERTER CHARACTERISTICS
SINAD
Signal-to-Noise Plus Distortion Ratio
VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS
49.5
49
dBFS (min)
SNR
Signal-to-Noise Ratio
VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS
49.6
49
dBFS (min)
THD
Total Harmonic Distortion
VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS
−77
−65
dBFS (max)
SFDR
Spurious-Free Dynamic Range
VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS
68
65
dBFS (min)
ENOB
Effective Number of Bits
VA = +2.7 to 5.25V
fIN = 100 kHz, −0.02 dBFS
7.9
7.8
Bits (min)
3
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ADC081S021
Absolute Maximum Ratings (Notes 1, 2)
ADC081S021
ADC081S021 Converter Electrical Characteristics (Notes 7, 9)
(Continued)
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Typical
Limits
(Note 9)
Units
DYNAMIC CONVERTER CHARACTERISTICS
IMD
FPBW
Intermodulation Distortion, Second
Order Terms
VA = +5.25V
fa = 103.5 kHz, fb = 113.5 kHz
−83
dBFS
Intermodulation Distortion, Third
Order Terms
VA = +5.25V
fa = 103.5 kHz, fb = 113.5 kHz
−82
dBFS
VA = +5V
11
MHz
VA = +3V
8
MHz
-3 dB Full Power Bandwidth
ANALOG INPUT CHARACTERISTICS
VIN
Input Range
IDCL
DC Leakage Current
CINA
Input Capacitance
0 to VA
V
±1
µA (max)
Track Mode
30
pF
Hold Mode
4
pF
DIGITAL INPUT CHARACTERISTICS
VIH
Input High Voltage
VIL
Input Low Voltage
IIN
Input Current
CIND
Digital Input Capacitance
VA = +5.25V
2.4
VA = +3.6V
2.1
V (min)
VA = +5V
0.8
V (max)
VA = +3V
V (min)
0.4
V (max)
± 0.1
±1
µA (max)
2
4
pF (max)
ISOURCE = 200 µA
VA − 0.07
VA − 0.2
V (min)
ISOURCE = 1 mA
VA − 0.1
0.4
V (max)
VIN = 0V or VA
DIGITAL OUTPUT CHARACTERISTICS
VOH
Output High Voltage
VOL
Output Low Voltage
IOZH,
IOZL
TRI-STATE ® Leakage Current
COUT
ISINK = 200 µA
0.03
ISINK = 1 mA
0.1
± 0.1
TRI-STATE ® Output Capacitance
2
Output Coding
V
V
± 10
µA (max)
4
pF (max)
Straight (Natural) Binary
POWER SUPPLY CHARACTERISTICS
VA
Supply Voltage
Supply Current, Normal Mode
(Operational, CS low)
IA
Supply Current, Shutdown (CS high)
Power Consumption, Normal Mode
(Operational, CS low)
PD
Power Consumption, Shutdown (CS
high)
2.7
V (min)
5.25
V (max)
VA = +5.25V,
fSAMPLE = 200 ksps
1.47
2.2
mA (max)
VA = +3.6V,
fSAMPLE = 200 ksps
0.36
0.9
mA (max)
fSCLK = 0 MHz, VA = +5.25V
fSAMPLE = 0 ksps
500
nA
VA = +5.25V, fSCLK = 4 MHz,
fSAMPLE = 0 ksps
60
µA
VA = +5.25V
7.7
11.6
mW (max)
VA = +3.6V
1.3
3.24
mW (max)
fSCLK = 0 MHz, VA = +5.25V
fSAMPLE = 0 ksps
2.6
µW
fSCLK = 4 MHz, VA = +5.25V,
fSAMPLE = 0 ksps
315
µW
AC ELECTRICAL CHARACTERISTICS
fSCLK
Clock Frequency
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(Note 8)
4
1.0
MHz (min)
4.0
MHz (max)
(Continued)
The following specifications apply for VA = +2.7V to 5.25V, fSCLK = 1 MHz to 4 MHz, fSAMPLE = 50 ksps to 200 ksps,
CL = 15 pF, unless otherwise noted. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.
Symbol
Parameter
Conditions
Typical
Limits
(Note 9)
Units
AC ELECTRICAL CHARACTERISTICS
fS
Sample Rate
tCONV
Conversion Time
DC
SCLK Duty Cycle
tACQ
(Note 8)
fSCLK = 4 MHz
50
Track/Hold Acquisition Time
Throughput Time
Acquisition Time + Conversion Time
50
ksps (min)
200
ksps (max)
16
SCLK cycles
40
% (min)
60
% (max)
400
ns (max)
20
SCLK cycles
50
ns (min)
tQUIET
(Note 10)
tAD
Aperture Delay
3
ns
tAJ
Aperture Jitter
30
ps
ADC081S021 Timing Specifications
The following specifications apply for VA = +2.7V to 5.25V, GND = 0V, fSCLK = 1.0 MHz to 4.0 MHz, CL = 25 pF,
fSAMPLE = 50 ksps to 200 ksps, Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25˚C.
Symbol
Limits
Units
tCS
Minimum CS Pulse Width
Parameter
Conditions
Typical
10
ns (min)
tSU
CS to SCLK Setup Time
10
ns (min)
tEN
Delay from CS Until SDATA TRI-STATE ®
Disabled (Note 11)
20
ns (max)
tACC
Data Access Time after SCLK Falling Edge
(Note 12)
VA = +2.7V to +3.6V
40
ns (max)
VA = +4.75V to +5.25V
20
ns (max)
tCL
SCLK Low Pulse Width
0.4 x
tSCLK
ns (min)
tCH
SCLK High Pulse Width
0.4 x
tSCLK
ns (min)
tH
SCLK to Data Valid Hold Time
7
ns (min)
tDIS
tPOWER-UP
SCLK Falling Edge to SDATA High
Impedance (Note 13)
VA = +2.7V to +3.6V
VA = +4.75V to +5.25V
VA = +2.7V to +3.6V
VA = +4.75V to +5.25V
Power-Up Time from Full Power-Down
5
ns (min)
25
ns (max)
6
ns (min)
25
ns (max)
5
ns (min)
1
µs
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supply (that is, VIN < GND or VIN > VA), the current at that pin should be limited to 10 mA. The 20
mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two. The Absolute
Maximum Rating specification does not apply to the VA pin. The current into the VA pin is limited by the Analog Supply Voltage specification.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/θJA. The values
for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through zero ohms
Note 6: Reflow temperature profiles are different for lead-free and non-lead-free packages.
Note 7: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 8: This is the frequency range over which the electrical performance is guaranteed. The device is functional over a wider range which is specified under
Operating Ratings.
Note 9: Data sheet min/max specification limits are guaranteed by design, test, or statistical analysis.
Note 10: Minimum Quiet Time required by bus relinquish and the start of the next conversion.
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ADC081S021
ADC081S021 Converter Electrical Characteristics (Notes 7, 9)
ADC081S021
ADC081S021 Timing Specifications
(Continued)
Note 11: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V.
Note 12: Measured with the timing test circuit shown in Figure 1 and defined as the time taken by the output signal to cross 1.0V or 2.0V.
Note 13: tDIS is derived from the time taken by the outputs to change by 0.5V with the timing test circuit shown in Figure 1. The measured number is then adjusted
to remove the effects of charging or discharging the output capacitance. This means that tDIS is the true bus relinquish time, independent of the bus loading.
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ADC081S021
Timing Diagrams
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FIGURE 1. Timing Test Circuit
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FIGURE 2. ADC081S021 Serial Timing Diagram
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ADC081S021
MISSING CODES are those output codes that will never
appear at the ADC outputs. The ADC081S021 is guaranteed
not to have any missing codes.
Specification Definitions
ACQUISITION TIME is the time required to acquire the input
voltage. That is, it is time required for the hold capacitor to
charge up to the input voltage.
OFFSET ERROR is the deviation of the first code transition
(000...000) to (000...001) from the ideal (i.e. GND + 1 LSB).
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the
sampling frequency, not including harmonics or d.c.
APERTURE DELAY is the time between the fourth falling
SCLK edge of a conversion and the time when the input
signal is acquired or held for conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the
variation in aperture delay from sample to sample. Aperture
jitter manifests itself as noise in the output.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD)
Is the ratio, expressed in dB, of the rms value of the input
signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics
but excluding d.c.
CONVERSION TIME is the time required, after the input
voltage is acquired, for the ADC to convert the input voltage
to a digital word.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the desired signal amplitude to the amplitude of the peak spurious spectral component, where a spurious spectral component is any signal
present in the output spectrum that is not present at the input
and may or may not be a harmonic.
DUTY CYCLE is the ratio of the time that a repetitive digital
waveform is high to the total time of one period. The specification here refers to the SCLK.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion
or
SINAD.
ENOB
is
defined
as
(SINAD − 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB or dBc, of the rms total of the first five
harmonic components at the output to the rms level of the
input signal frequency as seen at the output. THD is calculated as
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
GAIN ERROR is the deviation of the last code transition
(111...110) to (111...111) from the ideal (VREF − 1 LSB), after
adjusting for offset error.
INTEGRAL NON-LINEARITY (INL) is a measure of the
deviation of each individual code from a line drawn from
negative full scale (1⁄2 LSB below the first code transition)
through positive full scale (1⁄2 LSB above the last code
transition). The deviation of any given code from this straight
line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the second and third
order intermodulation products to the sum of the power in
both of the original frequencies. IMD is usually expressed in
dB.
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where Af1 is the RMS power of the input frequency at the
output and Af2 through Af6 are the RMS power in the first 5
harmonic frequencies.
THROUGHPUT TIME is the minimum time required between
the start of two successive conversion. It is the acquisition
time plus the conversion time.
TOTAL UNADJUSTED ERROR is the worst deviation found
from the ideal transfer function. As such, it is a comprehensive specification which includes full scale error, linearity
error, and offset error.
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ADC081S021
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated.
INL
fSCLK = 1 MHz
DNL
fSCLK = 1 MHz
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20145421
INL
fSCLK = 4 MHz
DNL
fSCLK = 4 MHz
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20145461
DNL vs. Clock Frequency
INL vs. Clock Frequency
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20145466
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ADC081S021
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated. (Continued)
Total Unadjusted Error vs. Clock Frequency
VA = 3.0V or 5.0V
SNR vs. Clock Frequency
20145467
20145463
SINAD vs. Clock Frequency
SFDR vs. Clock Frequency
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Spectral Response, VA = 5V
fSCLK = 1 MHz
THD vs. Clock Frequency
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10
Spectral Response, VA = 5V
fSCLK = 4 MHz
Power Consumption vs. Throughput,
fSCLK = 4 MHz
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ADC081S021
Typical Performance Characteristics TA = +25˚C, fSAMPLE = 50 ksps to 200 ksps,
fSCLK = 1 MHz to 4 MHz, fIN = 100 kHz unless otherwise stated. (Continued)
ADC081S021
Figure 4 shows the device in hold mode: switch SW1 connects the sampling capacitor to ground, maintaining the
sampled voltage, and switch SW2 unbalances the comparator. The control logic then instructs the charge-redistribution
DAC to add or subtract fixed amounts of charge from the
sampling capacitor until the comparator is balanced. When
the comparator is balanced, the digital word supplied to the
DAC is the digital representation of the analog input voltage.
The device moves from hold mode to track mode on the 13th
rising edge of SCLK.
Applications Information
1.0 ADC081S021 OPERATION
The ADC081S021 is a successive-approximation analog-todigital converter designed around a charge-redistribution
digital-to-analog converter core. Simplified schematics of the
ADC081S021 in both track and hold modes are shown in
Figure 3 and Figure 4, respectively. In Figure 3, the device is
in track mode: switch SW1 connects the sampling capacitor
to the input, and SW2 balances the comparator inputs. The
device is in this state until CS is brought low, at which point
the device moves to hold mode.
20145409
FIGURE 3. ADC081S021 in Track Mode
20145410
FIGURE 4. ADC081S021 in Hold Mode
mode on the 13th rising edge of SCLK (see Figure 2). The
SDATA pin will be placed back into TRI-STATE after the 16th
falling edge of SCLK, or at the rising edge of CS, whichever
occurs first. After a conversion is completed, the quiet time
(tQUIET) must be satisfied before bringing CS low again to
begin another conversion.
Sixteen SCLK cycles are required to read a complete
sample from the ADC081S021. The sample bits (including
leading or trailing zeroes) are clocked out on falling edges of
SCLK, and are intended to be clocked in by a receiver on
subsequent rising edges of SCLK. The ADC081S021 will
produce three leading zero bits on SDATA, followed by eight
data bits, most significant first. After the data bits, the
ADC081S021 will clock out four trailing zeros.
If CS goes low before the rising edge of SCLK, an additional
(fourth) zero bit may be captured by the next falling edge of
SCLK.
2.0 USING THE ADC081S021
The serial interface timing diagram for the ADC081S021 is
shown in Figure 2. CS is chip select, which initiates conversions on the ADC081S021 and frames the serial data transfers. SCLK (serial clock) controls both the conversion process and the timing of serial data. SDATA is the serial data
out pin, where a conversion result is found as a serial data
stream.
Basic operation of the ADC081S021 begins with CS going
low, which initiates a conversion process and data transfer.
Subsequent rising and falling edges of SCLK will be labelled
with reference to the falling edge of CS; for example, "the
third falling edge of SCLK" shall refer to the third falling edge
of SCLK after CS goes low.
At the fall of CS, the SDATA pin comes out of TRI-STATE
and the converter moves from track mode to hold mode. The
input signal is sampled and held for conversion on the falling
edge of CS. The converter moves from hold mode to track
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5.0 ANALOG INPUTS
(Continued)
An equivalent circuit for the ADC081S021’s input is shown in
Figure 7. Diodes D1 and D2 provide ESD protection for the
analog inputs. At no time should the analog input go beyond
(VA + 300 mV) or (GND − 300 mV), as these ESD diodes will
begin to conduct, which could result in erratic operation.
3.0 ADC081S021 TRANSFER FUNCTION
The output format of the ADC081S021 is straight binary.
Code transitions occur midway between successive integer
LSB values. The LSB width for the ADC081S021 is VA/256.
The ideal transfer characteristic is shown in Figure 5. The
transition from an output code of 0000 0000 to a code of
0000 0001 is at 1/2 LSB, or a voltage of VA/512. Other code
transitions occur at steps of one LSB.
The capacitor C1 in Figure 7 has a typical value of 4 pF, and
is mainly the package pin capacitance. Resistor R1 is the on
resistance of the track / hold switch, and is typically 500
ohms. Capacitor C2 is the ADC081S021 sampling capacitor
and is typically 26 pF. The ADC081S021 will deliver best
performance when driven by a low-impedance source to
eliminate distortion caused by the charging of the sampling
capacitance. This is especially important when using the
ADC081S021 to sample AC signals. Also important when
sampling dynamic signals is an anti-aliasing filter.
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20145411
FIGURE 7. Equivalent Input Circuit
FIGURE 5. Ideal Transfer Characteristic
6.0 DIGITAL INPUTS AND OUTPUTS
4.0 TYPICAL APPLICATION CIRCUIT
A typical application of the ADC081S021 is shown in
Figure 6. Power is provided in this example by the National
Semiconductor LP2950 low-dropout voltage regulator, available in a variety of fixed and adjustable output voltages. The
power supply pin is bypassed with a capacitor network located close to the ADC081S021. Because the reference for
the ADC081S021 is the supply voltage, any noise on the
supply will degrade device noise performance. To keep noise
off the supply, use a dedicated linear regulator for this device, or provide sufficient decoupling from other circuitry to
keep noise off the ADC081S021 supply pin. Because of the
ADC081S021’s low power requirements, it is also possible to
use a precision reference as a power supply to maximize
performance. The three-wire interface is shown connected to
a microprocessor or DSP.
The ADC081S021 digital inputs (SCLK and CS) are not
limited by the same maximum ratings as the analog inputs.
The digital input pins are instead limited to +5.25V with
respect to GND, regardless of VA, the supply voltage. This
allows the ADC081S021 to be interfaced with a wide range
of logic levels, independent of the supply voltage.
7.0 MODES OF OPERATION
The ADC081S021 has two possible modes of operation:
normal mode, and shutdown mode. The ADC081S021 enters normal mode (and a conversion process is begun) when
CS is pulled low. The device will enter shutdown mode if CS
is pulled high before the tenth falling edge of SCLK after CS
is pulled low, or will stay in normal mode if CS remains low.
Once in shutdown mode, the device will stay there until CS is
brought low again. By varying the ratio of time spent in the
normal and shutdown modes, a system may trade-off
throughput for power consumption, with a sample rate as low
as zero.
7.1 Normal Mode
The fastest possible throughput is obtained by leaving the
ADC081S021 in normal mode at all times, so there are no
power-up delays. To keep the device in normal mode continuously, CS must be kept low until after the 10th falling
edge of SCLK after the start of a conversion (remember that
a conversion is initiated by bringing CS low).
If CS is brought high after the 10th falling edge, but before
the 16th falling edge, the device will remain in normal mode,
but the current conversion will be aborted, and SDATA will
return to TRI-STATE (truncating the output word).
Sixteen SCLK cycles are required to read all of a conversion
word from the device. After sixteen SCLK cycles have
20145413
FIGURE 6. Typical Application Circuit
13
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ADC081S021
Applications Information
ADC081S021
Applications Information
To enter shutdown mode, a conversion must be interrupted
by bringing CS high anytime between the second and tenth
falling edges of SCLK, as shown in Figure 8. Once CS has
been brought high in this manner, the device will enter
shutdown mode, the current conversion will be aborted and
SDATA will enter TRI-STATE. If CS is brought high before the
second falling edge of SCLK, the device will not change
mode; this is to avoid accidentally changing mode as a result
of noise on the CS line.
(Continued)
elapsed, CS may be idled either high or low until the next
conversion. If CS is idled low, it must be brought high again
before the start of the next conversion, which begins when
CS is again brought low.
After sixteen SCLK cycles, SDATA returns to TRI-STATE.
Another conversion may be started, after tQUIET has
elapsed, by bringing CS low again.
7.2 Shutdown Mode
Shutdown mode is appropriate for applications that either do
not sample continuously, or it is acceptable to trade throughput for power consumption. When the ADC081S021 is in
shutdown mode, all of the analog circuitry is turned off.
20145416
FIGURE 8. Entering Shutdown Mode
20145417
FIGURE 9. Entering Normal Mode
When the VA supply is first applied, the ADC081S021 may
power up in either of the two modes: normal or shutdown. As
such, one dummy conversion should be performed after
start-up, as described in the previous paragraph. The part
may then be placed into either normal mode or the shutdown
mode, as described in Sections 7.1 and 7.2.
When the ADC081S021 is operated continuously in normal
mode, the maximum throughput is fSCLK / 20. Throughput
may be traded for power consumption by running fSCLK at its
maximum specified rate and performing fewer conversions
per unit time, raising the ADC081S021 CS line after the 10th
and before the 15th fall of SCLK of each conversion. A plot of
typical power consumption versus throughput is shown in
the Typical Performance Curves section. To calculate the
power consumption for a given throughput, multiply the fraction of time spent in the normal mode by the normal mode
power consumption and add the fraction of time spent in
shutdown mode multiplied by the shutdown mode power
consumption. Note that the curve of power consumption vs.
throughput is essentially linear. This is because the power
consumption in the shutdown mode is so small that it can be
ignored for all practical purposes.
To exit shutdown mode, bring CS back low. Upon bringing
CS low, the ADC081S021 will begin powering up (power-up
time is specified in the Timing Specifications table). This
microsecond of power-up delay results in the first conversion
result being unusable. The second conversion performed
after power-up, however, is valid, as shown in Figure 9.
If CS is brought back high before the 10th falling edge of
SCLK, the device will return to shutdown mode. This is done
to avoid accidentally entering normal mode as a result of
noise on the CS line. To exit shutdown mode and remain in
normal mode, CS must be kept low until after the 10th falling
edge of SCLK. The ADC081S021 will be fully powered-up
after 16 SCLK cycles.
8.0 POWER MANAGEMENT
The ADC081S021 takes time to power-up, either after first
applying VA, or after returning to normal mode from shutdown mode. This corresponds to one "dummy" conversion
for any SCLK frequency within the specifications in this
document. After this first dummy conversion, the
ADC081S021 will perform conversions properly. Note that
the tQUIET time must still be included between the first
dummy conversion and the second valid conversion.
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14
noise in the substrate that will degrade noise performance if
that current is large enough. The larger the output capacitance, the more current flows through the die substrate and
the greater is the noise coupled into the analog channel,
degrading noise performance.
To keep noise out of the power supply, keep the output load
capacitance as small as practical. It is good practice to use a
100 Ω series resistor at the ADC output, located as close to
the ADC output pin as practical. This will limit the charge and
discharge current of the output capacitance and maintain
noise performance.
(Continued)
9.0 POWER SUPPLY NOISE CONSIDERATIONS
The charging of any output load capacitance requires current from the power supply, VA. The current pulses required
from the supply to charge the output capacitance will cause
voltage variations on the supply. If these variations are large
enough, they could degrade SNR and SINAD performance
of the ADC. Furthermore, discharging the output capacitance when the digital output goes from a logic high to a logic
low will dump current into the die substrate, which is resistive. Load discharge currents will cause "ground bounce"
15
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ADC081S021
Applications Information
ADC081S021
Physical Dimensions
inches (millimeters) unless otherwise noted
6-Lead LLP
Order Number ADC081S021CISD or ADC081S021CISDX
NS Package Number SDB06A
6-Lead SOT-23
Order Number ADC081S021CIMF, ADC081S021CIMFX
NS Package Number MF06A
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16
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the right at any time without notice to change said circuitry and specifications.
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ADC081S021 Single Channel, 50 to 200 ksps, 8-Bit A/D Converter
Notes
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