NJRC NJG1308F-C2 Driver-amplifier gaas mmic Datasheet

NJG1308F
DRIVER-AMPLIFIER GaAs MMIC
nGENERAL DESCRIPTION
NJG1308F is a GaAs MMIC Driver-Amplifier for 800MHz1.9 GHz band of Cellular phone System.
It features a low current consumption and a high gain.
Small MTP6 package is adopted.
nPACKAGE OUTLINE
NJG1308F
nFEATURES
lLow supply voltage operation
lLow current consumption
lHigh gain
lPout at 1dB Gain Compression point
lpackage
+3.0V typ.
15mA typ. @Pout=+8dBm
18dB typ. @f=938MHz
16dB @f=1441MHz
14dB @f=1900MHz
+12dBm typ. @f=938MHz
+11dBm typ. @f=1441/1900MHz
MTP6
nPIN CONFIGURATION
F TYPE
(Top View)
Note:
1
6
2
5
3
4
Pin connection
1.RFin
2.GND
3.BPC
4.RFout & VDD
5.GND
6.GND
is a package orientation mark.
-1-
NJG1308F
nABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain Voltage
Input Power
Power Dissipation
Operating Temperature
Storage Temperature
SYMBOL
VDD
Pin
PD
Topr
Tstg
(Ta=+25°C, Zs=Zl=50Ω)
RATINGS
UNITS
6
V
15
dBm
300
mW
-40~+85
°C
-55~+150
°C
CONDITIONS
VDD=3V
nELECTRICAL CHARACTERISTICS 1(Application circuit 1)
PARAMETER
Operating Frequency
Drain Voltage
Operating Current
Small Signal Gain
Gain Flatness
Pout at 1dB Gain
Compression point
Adjacent Channel
Leakage Power
(PDC Regulation)
Input VSWR
Output VSWR
SYMBOL
Freq
VDD
IDD
Gain
Gflat
P-1dB
Pacp
VSWRi
VSWRo
CONDITIONS
VDD=3.0V
VDD=3.0V, Pout=+8dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V
VDD=3.0V, Pout=+8dBm
offset=50kHz
Pin;π/4 DQPSK
VDD=3.0V
VDD=3.0V
MIN
915
2.7
15
-
(Ta=+25°C, Zs=Zl=50Ω)
TYP MAX UNITS
938
960
MHz
3.0
5.0
V
15
21
mA
18
21
dB
0.5
dB
-
+12
-
dBm
-
-60
-
dBc
-
1.5
1.5
-
nELECTRICAL CHARACTERISTICS 2 (Application circuit 2)
PARAMETER
Operating Frequency
Drain Voltage
Operating Current
Small Signal Gain
Gain Flatness
Pout at 1dB Gain
Compression point
Adjacent Channel
Leakage Power
(PDC Regulation)
Input VSWR
Output VSWR
-2-
SYMBOL
freq
VDD
IDD
Gain
Gflat
P-1dB
Pacp
VSWRi
VSWRo
CONDITIONS
VDD=3.0V
VDD=3.0V, Pout=+8dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V
VDD=3.0V, Pout=+8dBm
offset=50kHz
Pin; π/4 DQPSK
VDD=3.0V
VDD=3.0V
MIN
1429
2.7
13
-
(Ta=+25°C, Zs=Zl=50Ω)
TYP MAX UNITS
1441 1453
MHz
3.0
5.0
V
15
21
mA
16
19
dB
0.5
dB
-
+11
-
dBm
-
-60
-
dBc
-
1.5
1.5
-
NJG1308F
nELECTRICAL CHARACTERISTICS 3 (Application circuit 3)
PARAMETER
Operating Frequency
Drain Voltage
Operating Current
Small Signal Gain
Gain Flatness
Pout at 1dB Gain
Compression point
Adjacent Channel
Leakage Power
(PHS Regulation)
Input VSWR
Output VSWR
SYMBOL
freq
VDD
IDD
Gain
Gflat
P-1dB
Pacp
VSWRi
VSWRo
CONDITIONS
VDD=3.0V
VDD=3.0V, Pout=+8dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V
VDD=3.0V, Pout=+8dBm
offset=600kHz
Pin; π/4 DQPSK
VDD=3.0V
VDD=3.0V
(Ta=+25°C, Zs=Zl=50Ω)
MIN TYP MAX UNITS
1890 1900 1920
MHz
2.7
3.0
5.0
V
15
21
mA
11
14
17
dB
0.5
dB
-
+11
-
dBm
-
-60
-
dBc
-
1.5
1.5
-
nELECTRICAL CHARACTERISTICS 4 (Application Circuit 4)
PARAMETER
Operating Frequency
Supply Voltage
Operating Current
Power Gain
Gain Flatness
Pout at 1dB
Compression point
Input VSWR
Output VSWR
SYMBOL
freq
VDD
IDD
Gain
Gflat
CONDITIONS
VDD=3.0V
VDD=3.0V, Pout=+8dBm
VDD=3.0V, Pin=-10dBm
VDD=3.0V, Pin=-10dBm
(Ta=+25°C, Zs=Zl=50Ω)
MIN TYP MAX UNITS
1750 1765 1780
MHz
2.7
3.0
5.0
V
15
mA
14
dB
0.5
dB
P-1Db
VDD=3.0V
-
+11
-
VSWRI
VSWRo
VDD=3.0V
VDD=3.0V
-
1.5
1.5
-
dBm
-3-
NJG1308F
nTYPICAL CHARACTERISTICS 1 (Application Circuit 1)
-4-
NJG1308F
nTYPICAL CHARACTERISTICS 2 (Application Circuit 2)
-5-
NJG1308F
nTYPICAL CHARACTERISTICS 3 (Application Circuit 3)
-6-
NJG1308F
nTYPICAL CHARACTERISTICS 4 (Application Circuit 4)
S21,S11,S22,S12 vs. FREQUENCY
(V =3V)
DD
20
-10
S21
10
-20
0
-30
S22
-10
-40
S11
-20
-30
0.5
S12 (dB)
S21,S11,S22 (dB)
S12
-50
-60
1
1.5
2
2.5
Frequency (GHz)
3
-7-
NJG1308F
nTYPICAL CHARACTERISTICS
Scattering Parameters (VDD=3V)
Freq.
S 11
mag
(U)
0.865
0.853
0.834
0.810
0.788
0.757
0.729
0.700
0.672
0.645
0.618
0.589
0.563
0.541
0.519
0.502
0.489
0.490
0.502
0.536
0.592
0.669
0.760
0.851
0.920
0.951
(GHz)
0.50
0.60
0.70
0.80
0.90
1.00
1.10
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
2.60
2.70
2.80
2.90
3.00
S 21
ang
(deg)
-26.1
-32.2
-38.2
-43.7
-48.5
-52.8
-56.7
-60.3
-63.1
-65.6
-67.7
-69.0
-69.7
-69.8
-69.6
-67.9
-65.9
-62.3
-58.9
-55.6
-53.5
-53.8
-56.9
-62.8
-70.6
-79.2
mag
(U)
4.892
5.060
5.093
5.046
4.974
4.801
4.650
4.457
4.271
4.083
3.893
3.687
3.509
3.317
3.122
2.904
2.696
2.432
2.150
1.814
1.409
0.933
0.461
0.575
1.154
1.703
S 12
ang
(deg)
174.0
163.2
152.9
143.5
134.5
126.4
118.6
111.5
104.6
98.0
91.3
85.2
79.3
72.9
66.5
60.0
53.6
46.6
39.1
31.9
24.6
21.3
41.1
106.1
113.3
105.2
mag
(U)
0.029
0.030
0.033
0.035
0.036
0.038
0.039
0.041
0.043
0.045
0.046
0.049
0.051
0.055
0.058
0.060
0.063
0.065
0.065
0.066
0.062
0.056
0.050
0.048
0.060
0.081
ang
(deg)
52.0
48.7
46.2
46.4
44.5
43.5
42.7
44.0
43.3
44.6
44.0
43.8
42.4
40.3
38.3
35.8
31.4
25.7
17.4
8.5
-5.9
-24.0
-54.3
-96.7
-140.4
-172.8
S 22
mag
(U)
0.718
0.681
0.648
0.626
0.603
0.590
0.580
0.579
0.577
0.581
0.588
0.597
0.612
0.630
0.650
0.671
0.700
0.728
0.764
0.795
0.828
0.846
0.842
0.800
0.731
0.624
ang
(deg)
-56.5
-63.4
-69.6
-74.9
-78.8
-82.4
-85.6
-88.8
-90.9
-93.6
-96.0
-98.5
-100.8
-103.7
-106.9
-110.2
-114.5
-119.5
-125.8
-132.8
-142.1
-153.2
-166.5
178.6
161.6
144.2
nPIN CONNECTIONS AND FUNCTIONAL BLOCK DIAGRAM
VDD
RF OUT
4
RF IN
1
AMP
ZO=50Ω
3
ZO=50Ω
ZL=50Ω
ZS=50Ω
6
-8-
5
2
NJG1308F
nAPPLICATION CIRCUIT1
nAPPLICATION CIRCUIT 2
-9-
NJG1308F
nAPPLICATION CIRCUIT 3
nAPPLICATION CIRCUIT 4
- 10 -
NJG1308F
nRECOMMENDED PCB DESIGN
VDD
RFin
C1
L1
R1
GND
C3
C2
NJG
1308F
C4
C6
L2
L3
RFout
C5
GND
PCB:FR-4 22.5x20.0mm, t=0.5mm
MICROSTRIP LINE WIDTH=1.0mm (Zo=50Ω)
CHIP SIZE:1608
Notes:
[1] Following chip capacitor should be connected near to each terminal as bypass capacitor.
(1) C3
(2) C4
[2] Following chip capacitors are necessary to block DC bias.
(3) C1
(4) C6
[3] Chip parts list.
Parts ID
Comment
C1~C6
MURATA GRM39 Series
L1~L3
TAIYO-YUDEN HK1608 Series
- 11 -
NJG1308F
nPACKAGE OUTLINE (MTP6)
Lead material
Lead surface finish
Molding material
UNIT
Weight
Cautions on using this product
This product contains Gallium-Arsenide (GaAs) which is a harmful material.
• Do NOT eat or put into mouth.
• Do NOT dispose in fire or break up this product.
• Do NOT chemically make gas or powder with this product.
• To waste this product, please obey the relating law of your country.
This product may be damaged with electric static discharge (ESD) or spike voltage. Please handle
with care to avoid these damages.
- 12 -
: Copper
: Solder plating
: Epoxy resin
: mm
: 14mg
[CAUTION]
The specifications on this databook are only
given for information , without any guarantee
as regards either mistakes or omissions. The
application circuits in this databook are
described only to show representative usages
of the product and not intended for the
guarantee or permission of any right including
the industrial rights.
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