ON MRA4007 Surface mount standard recovery power rectifier Datasheet

MRA4003T3 Series
Surface Mount Standard
Recovery Power Rectifier
SMA Power Surface Mount Package
Features construction with glass passivation. Ideally suited for
surface mounted Automotive application.
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Stable, High Temperature, Glass Passivated Junction
Mechanical Characteristics
• Case: Molded Epoxy
Epoxy meets UL 94 V−0 @ 0.125 in
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STANDARD RECOVERY
RECTIFIERS
1.0 AMPERES
300−1000 VOLTS
• Weight: 70 mg (Approximately)
• Finish: All External Surfaces are Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 seconds in Solder Bath
Polarity: Band in Plastic Body Indicates Cathode Lead
Marking: MRA4003T3 = R13
Marking MRA4004T3 = R14
MRA4005T1 = R15
Marking: MRA4005T3 = R15
Marking: MRA4006T3 = R16
Marking: MRA4007T3 = R17
CASE 403D
SMA
PLASTIC
MARKING DIAGRAM
R1x
ALYW
ORDERING INFORMATION
Device
Package
Shipping†
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
MRA4005T1
SMA
1500/Tape & Reel
MRA4005T3
SMA
5000/Tape & Reel
MRA4006T3
SMA
5000/Tape & Reel
MRA4007T3
SMA
5000/Tape & Reel
SMA
(Pb−Free)
5000/Tape & Reel
MRA4003T3
MRA4003T3G
MRA4004T3
MRA4004T3G
MRA4007T3G
R1x
A
L
Y
W
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
†For information on tape and reel specifications, including part orientation and
tape sizes, please refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Please See the Table on the Following Page
 Semiconductor Components Industries, LLC, 2004
July, 2004 − Rev. 3
1
Publication Order Number:
MRA4003T3/D
MRA4003T3 Series
MAXIMUM RATINGS
Value
Rating
Symbol
MRA4003T3
MRA4004T3
MRA4005T1,
MRA4005T3
VRRM
VRWM
VR
300
400
600
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Avg. Rectified Forward Current
(At Rated VR, TL = 150°C)
MRA4006T3
MRA4007T3
Unit
800
1000
Volts
IO
1
Amp
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TL = 150°C)
IFRM
2
Amps
Non−Repetitive Peak Surge Current
(Surge applied at rated load conditions,
halfwave, single phase, 60 Hz)
IFSM
30
Amps
Tstg, TC
−55 to 150
°C
TJ
−55 to 175
°C
Storage/Operating Case Temperature
Operating Junction Temperature
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
RθJL
RθJA
16.2
88.3
°C/W
Thermal Resistance, Junction−to−Lead (Note 1)
Thermal Resistance, Junction−to−Ambient (Note 2)
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Symbol
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 1 A)
(IF = 2 A)
VF
Maximum Instantaneous Reverse Current (at rated DC voltage)
IR
TJ = 25°C
TJ = 100°C
1.1
1.18
1.04
1.12
10
50
Unit
Volts
A
100E−6
10
TJ = 150°C
1.0
−40°C
0.1
100°C
25°C
IR , REVERSE CURRENT (AMPS)
IF, INSTANTANEOUS FORWARD CURRENT (AMPS
1. Minimum Pad Size
2. 1 inch Pad Size
3. Pulse Test: Pulse Width ≤ 250 µs, Duty Cycle ≤ 2%.
TJ = 150°C
10E−6
1.0E−6
100°C
100E−9
0.01
25°C
10E−9
1.0E−9
0.4
0.6
0.8
1.0
1.2
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0
Figure 1. Typical Forward Voltage
50
100
150
200
250 300
350
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current
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2
400
1.6
PFO , AVERAGE POWER DISSIPATION (WATTS)
IO, AVERAGE FORWARD CURRENT (AMPS)
MRA4003T3 Series
dc
1.4
Square Wave
1.2
1.0
Ipk/IO = 0.8
5
10
0.6
20
0.4
Freq = 20 kHz
0.2
0
0
20
80
40
60
100
120
TL, LEAD TEMPERATURE (°C)
140
1.8
dc
1.6
1.4
Square Wave
1.2
Ipk/IO = 1.0
5
0.8
10
0.6
20
0.4
0.2
0
0
160
Figure 3. Current Derating per Leg
0.5
1.0
1.5
IO, AVERAGE FORWARD CURRENT (AMPS)
2.0
Figure 4. Forward Power Dissipation per Leg
C, CAPACITANCE (pF)
100
TJ = 25°C
10
1
0
20
40 60 80 100 120 140 160
VR, REVERSE VOLTAGE (VOLTS)
180 200
r(t), TRANSIENT THERMAL RESISTANCE
(NORMALIZED)
Figure 5. Capacitance
1.0
RJL (Min Pad Board)
RJA (1 inch Pad Board)
0.1
RJL(t) = RJL * r(t)
0.01
0.001
10E−6
100E−6
1E−3
10E−3
100E−3
1E+0
t, TIME (s)
Figure 6. Thermal Response
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3
10E+0
100E+0
1E+3
10E+3
MRA4003T3 Series
PACKAGE DIMENSIONS
SMA
PLASTIC PACKAGE
CASE 403D−02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 403D−01 OBSOLETE, NEW STANDARD IS
403D−02.
S
A
D
DIM
A
B
C
D
H
J
K
S
B
POLARITY INDICATOR OPTIONAL
AS NEEDED
INCHES
MIN
MAX
0.160
0.180
0.090
0.115
0.075
0.095
0.050
0.064
0.002
0.006
0.006
0.016
0.030
0.060
0.190
0.220
MILLIMETERS
MIN
MAX
4.06
4.57
2.29
2.92
1.91
2.41
1.27
1.63
0.05
0.15
0.15
0.41
0.76
1.52
4.83
5.59
C
K
J
H
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MRA4003T3/D
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