ON NLU1G07 Single non-inverting buffer with open drain output Datasheet

NLU1G07
Single Non-Inverting Buffer
with Open Drain Output
The NLU1G07 MiniGatet is an advanced high−speed CMOS
non−inverting buffer with open drain output in ultra−small footprint.
The NLU1G07 input and output structures provide protection when
voltages up to 7.0 V are applied, regardless of the supply voltage.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
High Speed: tPD = 3.8 ns (Typ) @ VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Power Down Protection Provided on inputs
Balanced Propagation Delays
Overvoltage Tolerant (OVT) Input and Output Pins
Ultra−Small Packages
These are Pb−Free Devices
1
UDFN6
MU SUFFIX
CASE 517AA
JM
UDFN6
1.0 x 1.0
CASE 517BX
XM
UDFN6
1.45 x 1.0
CASE 517AQ
XM
1
NC
1
6
VCC
1
OVT
IN A
2
5
NC
GND
3
4
OUT Y
J
M
= Device Marking
= Date Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 4 of
this data sheet.
Figure 1. Pinout (Top View)
1
IN A
OUT Y
Figure 2. Logic Symbol
PIN ASSIGNMENT
1
NC
2
IN A
3
GND
4
OUT Y
5
NC
6
VCC
FUNCTION TABLE
A
Y
L
H
L
Z
© Semiconductor Components Industries, LLC, 2016
August, 2016 − Rev. 4
1
Publication Order Number:
NLU1G07/D
NLU1G07
MAXIMUM RATINGS
Symbol
Value
Unit
VCC
DC Supply Voltage
−0.5 to +7.0
V
VIN
DC Input Voltage
−0.5 to +7.0
V
DC Output Voltage
−0.5 to +7.0
V
VIN < GND
−20
mA
VOUT < GND
±20
mA
VOUT
Parameter
IIK
DC Input Diode Current
IOK
DC Output Diode Current
IO
DC Output Source/Sink Current
±12.5
mA
ICC
DC Supply Current Per Supply Pin
±25
mA
IGND
DC Ground Current per Ground Pin
±25
mA
TSTG
Storage Temperature Range
−65 to +150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature Under Bias
150
°C
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ILATCHUP
Level 1
Oxygen Index: 28 to 34
ESD Withstand Voltage
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
Latchup Performance Above VCC and Below GND at 125°C (Note 5)
> 2000
> 200
N/A
V
±500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.
2. Tested to EIA / JESD22−A114−A.
3. Tested to EIA / JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA / JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
1.65
5.5
V
VCC
Positive DC Supply Voltage
VIN
Digital Input Voltage
0
5.5
V
Output Voltage
0
5.5
V
−55
+125
°C
0
0
100
20
ns/V
VOUT
TA
Operating Free−Air Temperature
Dt/DV
Input Transition Rise or Fall Rate
VCC = 3.3 V ± 0.3 V
VCC = 5.0 V ± 0.5 V
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2
NLU1G07
DC ELECTRICAL CHARACTERISTICS
Symbol
VIH
VIL
VOL
ILKG
Parameter
Conditions
Low−Level Input
Voltage
Low−Level Input
Voltage
Low−Level
Output Voltage
VCC
(V)
TA = +855C
TA = 25 5C
Min
Typ
Max
Min
1.65
0.75 x
VCC
0.75 x
VCC
2.3 to
5.5
0.70 x
VCC
0.70 x
VCC
Max
TA = −555C
to +1255C
Min
Max
V
1.65
0.25 x
VCC
0.25 x
VCC
0.25 x
VCC
2.3 to
5.5
0.30 x
VCC
0.30 x
VCC
0.30 x
VCC
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0
0
0
Unit
VIN = VIH or VIL
IOL = 50 mA
2.0
3.0
4.5
VIN = VIH or VIL
IOL = 4 mA
IOL = 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
V
V
Z−State Output
Leakage Current
VIN = VIH, VOUT
= VCC or GND
5.5
±0.25
±2.5
±5.0
mA
Input Leakage
Current
0 = VIN = 5.5 V
0 to
5.5
±0.1
±1.0
±1.0
mA
IOFF
Power off Input
Leakage Current
0 VIN,
VOUT = 5.5 V
0.0
0.25
2.5
5
mA
ICC
Quiescent Supply
Current
0 VIN VCC
5.5
1.0
20
40
mA
TA = +855C
TA = −555C
to +1255C
IIN
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol
tPZL
Parameter
Output Enable
Time, Input A to
Output Y
VCC
(V)
Test Condition
3.0 to
3.6
Max
Unit
8.5
10.0
ns
10.6
12.0
14.5
3.8
5.5
6.5
8.0
RL = R1 = 50 W,
CL = 50 pF
5.3
7.5
8.5
10.0
3.0 to
3.6
RL = R1 = 50 W,
CL = 50 pF
7.5
10.6
12.0
14.5
4.5 to
5.5
RL = R1 = 50 W,
CL = 50 pF
5.3
7.5
8.5
10.0
4
10
10
10.0
4.5 to
5.5
tPLZ
Output Disable
Time
CIN
Input Capacitance
CPD
Power Dissipation
Capacitance
(Note 6)
TA = 25 5C
Min
Typ
Max
RL = R1 = 50 W,
CL = 15 pF
5.0
7.1
RL = R1 = 50 W,
CL = 50 pF
7.5
RL = R1 = 50 W,
CL = 15 pF
5.0
18
Min
Max
Min
ns
pF
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without
load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no−load
dynamic power consumption: PD = CPD • VCC2 • fin + ICC • VCC.
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3
NLU1G07
VCC 2
50%
tPZL
Y
R1
VCC
A
tPLZ
50% VCC
A
GND
HIGH
IMPEDANCE
CL *
RL
VOL 0.3 V
*Includes jig and probe capacitance.
RL = R1 = 500 W
Figure 3. Switching Waveforms
Figure 4. Test Circuit
VCC
A
1.5 V to 7 V
OVT
RL
Figure 5. Output Voltage Mismatch Application
ORDERING INFORMATION
Package
Shipping†
NLU1G07MUTCG
UDFN6, 1.2 x 1.0, 0.4P
(Pb−Free)
3000 / Tape & Reel
NLU1G07AMUTCG
UDFN6, 1.45 x 1.0, 0.5P
(Pb−Free)
3000 / Tape & Reel
NLU1G07CMUTCG
UDFN6, 1.0 x 1.0, 0.35P
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NLU1G07
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
A
B
D
L
L
L1
PIN ONE
REFERENCE
0.10 C
ÉÉÉ
ÉÉÉ
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
DETAIL B
OPTIONAL
CONSTRUCTIONS
A
0.05 C
A1
SIDE VIEW
MOLD CMPD
DETAIL B
0.05 C
6X
DIM
A
A1
A2
b
D
E
e
L
L1
ÉÉ
ÉÉ
EXPOSED Cu
TOP VIEW
0.10 C
A2
6X
C
6X
SEATING
PLANE
0.30
PACKAGE
OUTLINE
L
1.24
3
DETAIL A
6X
0.53
4
BOTTOM VIEW
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.07 REF
0.20
0.30
1.45 BSC
1.00 BSC
0.50 BSC
0.30
0.40
−−−
0.15
MOUNTING FOOTPRINT
e
1
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
6X
0.50
PITCH
DIMENSIONS: MILLIMETERS
b
0.10 C A B
0.05 C
1
NOTE 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5
NLU1G07
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
PIN ONE
REFERENCE
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
A B
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
E
0.10 C
2X
0.10 C
DIM
A
A1
A3
b
D
E
e
L
L1
TOP VIEW
A3
0.05 C
A
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.12
0.22
1.00 BSC
1.00 BSC
0.35 BSC
0.25
0.35
0.30
0.40
0.05 C
SIDE VIEW
A1
C
RECOMMENDED
SOLDERING FOOTPRINT*
SEATING
PLANE
5X
e
5X
0.48
L
6X
0.22
3
1
L1
1.18
6
4
BOTTOM VIEW
6X
b
0.10
M
C A B
0.05
M
C
0.53
1
PKG
OUTLINE
NOTE 3
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6
NLU1G07
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
PIN ONE
REFERENCE
2X
0.10 C
L1
ÉÉ
ÉÉ
E
DETAIL A
Bottom View
(Optional)
TOP VIEW
2X
EXPOSED Cu
0.10 C
(A3)
0.10 C
A1
A
10X
0.08 C
ÉÉÉ
ÉÉÉ
MOLD CMPD
5X
DIM
A
A1
A3
b
D
E
e
L
L1
L2
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.127 REF
0.15
0.25
1.20 BSC
1.00 BSC
0.40 BSC
0.30
0.40
0.00
0.15
0.40
0.50
MOUNTING FOOTPRINT*
6X
C
A1
A3
DETAIL B
Side View
(Optional)
SEATING
PLANE
SIDE VIEW
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
B
D
6X
0.42
0.22
L
3
L2
6X
b
0.10 C A B
0.05 C
6
0.40
PITCH
4
e
NOTE 3
BOTTOM VIEW
1.07
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NLU1G07/D
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