AP2552/ AP2553/ AP2552A/ AP2553A PRECISION ADJUSTABLE CURRENT-LIMITED POWER SWITCHES Description Pin Assignments The AP2552/53and AP2552A/53A are single channel precision (Top View) adjustable current-limited switches optimized for the applications require precision current limiting or to provide up to 2.1A of continuous load current during heavy loads/short circuits. These OUT 1 devices offer a programmable current-limit threshold between 75mA ILIM 2 and 2.35A (typ) via an external resistor. Current limit accuracy ±6% FAULT 3 NEW PRODUCT can be achieved at high current-limit settings. The rise and fall times PAD 6 5 IN GND 4 EN are controlled to minimize current surges during turn on/off. U-DFN2020C-6 The devices have fast short-circuit response timefor improved overall (Top View) system robustness. They provide a complete protection solution for applications subject to heavy capacitive loads and the prospect of short circuit, offering reverse current blocking and limiting, over- IN GND EN current, over-temperature and short-circuit protection, as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false 1 2 3 6 5 4 OUT ILIM FAULT over-current reporting and does not require any external components. SOT26 AP2552/53 limits the output current to a safe level when the output current exceeds current-limit threshold. Features AP2552A/53A provides latch-off function during over-current or • Up to 2.1A maximum load current reverse-voltage conditions. • Accurate adjustable current limit, 75mA - 2350mA All devices are available in SOT26 and U-DFN2020C-6 packages. Applications • • ±6% accurate adjustable current limit, 1.61A with RLIM = 15kΩ • Constant-current (AP2552/53) during over-current • Output latch-off (AP2552A/53A) at over-current • Fast short-circuit response time: 2µs (typ) • Reverse current blocking during shutdown and reverse current limiting during enable Set-Top-Boxes • LCD TVs & Monitors • Operating range: 2.7V – 5.5V • Residential Gateways • Built-in soft-start with 3ms typical rise time • Laptops, Desktops, Servers, e-Readers, Printers, Docking • Over-current , output over-voltage and thermal protection Stations, HUBs • Fault report (FAULT) with blanking time • ESD protection: 2kV HBM, 500V CDM • Active low (AP2552/52A) or active high (AP2553/53A) enable • Ambient temperature range: -40ºC to +85°C • SOT26 and DFN2020-6 package: Available in “Green”Molding Compound (No Br, Sb) • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • 15kV ESD Protection per IEC 61000-4-2 (with external capacitance) Notes: • UL Recognized, File Number (to be completed) • IEC60950-1 CB Scheme Certified (to be completed) 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 1 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A NEW PRODUCT Typical Applications Circuit 120µF Output Capacitance is a Requirement of USB Available Options Part Number Channel Enable Pin (EN) AP2552 AP2553 AP2552A AP2553A 1 1 1 1 Active Low Active High Active Low Active High Recommended Maximum Continuous Load Current (A) Current-Limit Protection Package 2.1 Constant-Current U-DFN2020C-6 SOT26 2.1 Latch-Off U-DFN2020C-6 SOT26 Pin Descriptions Pin Name Pin Number AP2552W6-7 AP2553W6-7 AP2552FDCG-7 AP2553FDCG-7 I/O Function Input, connect a 0.1µF or greater ceramic capacitor from IN to GND as close to IC as possible. Ground, connect to external exposed pad. IN 1 1 6 6 I GND 2 2 5 5 — EN 3 — 4 — I Enable input, logic low turns on power switch. EN — 3 — 4 I FAULT 4 4 3 3 O ILIM 5 5 2 2 O Enable input, logic high turns on power switch. Active-low open-drain output, asserted during overcurrent, over-temperature, or reverse-voltage conditions. Use external resistor to set current-limit threshold; recommended 10kΩ≦RLIM≦232kΩ. OUT Exposed Pad 6 6 1 1 O — — Pad Pad — AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 2 of 16 www.diodes.com Output No internal connection; recommend to connect to GND externally for improved power dissipation. December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A NEW PRODUCT Functional Block Diagram AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 3 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A NEW PRODUCT Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD CDM VIN, Vout, V FAULT , Parameter Human Body Model ESD Protection Charged Device Model ESD Protection VILIM, VEN, V EN Voltage on IN, OUT, FAULT , ILIM, EN, EN Iload TJmax TST Ratings 2 500 Unit kV V -0.3 to +6.5 V Continuous FAULT sink current 25 mA ILIM source current 1 mA Internal Limited A Maximum Junction Temperature -40 to +150 °C Storage Temperature Range (Note 4) -65 to +150 °C Maximum Continuous Load Current Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Dissipation Rating Table Board Package High-K (Note 5) High-K (Note 5) W6 FDC Note: Thermal Resistance θJA 160°C/W 120°C/W Thermal Resistance θJC 55°C/W 34°C/W TA ≤ +25°C Power Rating 625mW 833mW Derating Factor Above TA = +25°C 6.25mW/°C 8.33mW/°C TA = +70°C Power Rating TA = +85°C Power Rating 340mW 450mW 250mW 330mW 5. The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground planes with 2-ounce copper traces on top and bottom of the board. Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max 2.7 5.5 V Continuous Output Current (-40°C ≤ TA ≤ +85°C) 0 2.1 A Enable Voltage 0 5.5 V 2.0 VIN V 0 0.8 V 10 210 kΩ 0 10 mA VIN Input Voltage IOUT VEN, VEN VIH High-Level Input Voltage on EN or EN VIL Low-Level Input Voltage on EN or EN Current-Limit Threshold Resistor Range (1% initial tolerance) RLIM IO Continuous FAULT Sink Current Unit Input De-Coupling Capacitance, IN to GND 0.1 TA Operating Ambient Temperature -40 +85 °C TJ Operating Junction Temperature -40 +125 °C AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 4 of 16 www.diodes.com µF December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Electrical Characteristics (@TA = +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, RFAULT = 10kΩ, unless otherwise specified.) Symbol Supply Test Conditions (Note 6) Min Typ Max 2.65 Unit Input UVLO VIN rising 2.4 ΔVUVLO Input UVLO Hysteresis VIN decreasing 25 ISHDN Input Shutdown Current VIN = 5.5V, disabled, OUT = open 0.1 1 µA VIN = 5.5V, enabled, OUT = open, RLIM = 20kΩ 100 140 µA VUVLO NEW PRODUCT Parameter Input Quiescent Current IQ Reverse Leakage Current IREV Power Switch VIN = 5.5V, enabled, OUT = open, RLIM = 210kΩ Disabled, VIN = 0V, VOUT = 6V, IREV at VIN SOT26 package, RDS(ON) Switch On-Resistance U-DFN2020-6 package tR Output Turn-On Rise Time tF Output Turn-Off Fall Time TJ = +25°C, VIN = 5.0V 80 120 µA 0.01 1 µA 70 95 o -40 C ≤ TA ≤ +85°C 135 80 TJ = +25°C, VIN = 5.0V V mV o -40 C ≤ TA ≤ +85°C 105 mΩ 150 VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 1.1 1.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. 0.7 1 ms VIN = 5.5V, CL = 1µF, RLOAD = 100Ω. See Figure 1 0.1 0.5 ms VIN = 2.7V, CL = 1µF, RLOAD = 100Ω. 0.1 0.5 ms Current Limit Current-Limit Threshold (maximum DC output current), VOUT = VIN -0.5V ILIMIT Short-Circuit Current Limit, OUT connected to GND ISHORT tSHORT Short-Circuit Response Time RLIM = 10kΩ -40°C ≤ TA ≤ +85°C 2200 2365 2542 RLIM = 15kΩ -40°C ≤ TA ≤ +85°C 1540 1632 1730 TJ = +25°C 1180 1251 1326 RLIM = 20kΩ RLIM = 49.9kΩ -40°C ≤ TA ≤ +85°C 1160 1251 1340 TJ = +25°C 500 530 562 -40°C ≤ TA ≤ +85°C 573 485 529 RLIM = 210kΩ 121 142 162 ILIM shorted to IN or GND 50 75 100 RLIM = 10kΩ 2620 RLIM = 15kΩ 1820 RLIM = 20kΩ 1380 RLIM = 49.9kΩ 570 RLIM = 210kΩ 150 ILIM shorted to IN or GND 75 VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) See Figure 2 2 mA mA µs Enable Pin EN Input Leakage Current VIN = 5V, VEN = 0V and 6V 0.5 µA Turnon Time CL = 1µF, RL = 100Ω. See Figure 1 3 ms Turnoff Time tOFF Output Discharge CL = 1µF, RL = 100Ω. See Figure 1 1 ms ILEAK-EN tON RDIS RDIS_LATCH Notes: -0.5 Discharge Resistance (Note 7) VIN = 5V, disabled, IOUT =1mA 600 Ω Discharge Resistance During Latch-Off VIN = 5V, latch-off, AP2552A/53A only 1000 Ω 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN< VUVLO). The discharge function offers a resistive discharge path for the external storage capacitor for limited time. AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 5 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Electrical Characteristics (cont.) (@TA = +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, RFAULT = 10kΩ, unless otherwise specified.) Symbol Parameter Reverse Voltage Protection Reverse-Voltage Comparator Trip Point VOUT – VIN Reverse Current Limit VOUT – VIN = 200mV Time from Reverse-Voltage Condition to MOSFET Turn Off (AP2552A/AP2553A) VIN = 5V VOL FAULT Output Low Voltage IFOH FAULT Off Current VRVP IROCP NEW PRODUCT Test Conditions (Note 6) tTRIG Min 95 Typ Max Unit 135 190 mV 0.72 3 4.75 A 7 ms IFAULT = 1mA 180 mV VFAULT = 6V 1 µA Fault Flag FAULT Blanking and Latch Off Time (Over-Current) FAULT Blanking Time tBlank_RV (Reverse-Voltage) Thermal Shutdown tBlank_OC TSHDN TSHDN_OCP THYS Note: Assertion or deassertion due to overcurrent 5 7.5 10 ms Assertion or deassertion due to reverse-voltage 2 3.75 6 ms Thermal Shutdown Threshold Enabled, RLOAD = 1kΩ 160 °C Thermal Shutdown Threshold under Current Limit Enabled, RLOAD = 1kΩ 140 °C 20 °C Thermal Shutdown Hysteresis 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. Typical Performance Characteristics VEN 50% TD(ON) TD(ON) 90% 10% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT TF 90% 10% 90% 10% Figure 1. Voltage Waveforms: AP2552/52A (left), AP2553/53A (right) Figure 2. Response Time to Short Circuit Waveform AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 6 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Typical Performance Characteristics VIN= 5V RLIM = 20kΩ ROUT = 5Ω NEW PRODUCT VIN = 5V RLIM = 20kΩ ROUT = 5Ω 2ms/div Figure 3. Turn-On Delay and Rise Time 2ms/div Figure 4. Turn-Off Delay and Fall Time VIN = 5V RLIM = 20kΩ ROUT = 0Ω 500µs/div Figure 5. Device Enabled into Short-circuit 2ms/div Figure 6. No Load to 1Ω Transient Response 2ms/div Figure 7. Short-Circuit Current Limit Response 2ms/div Figure 8. Extended Short-Circuit into Thermal Cycles AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 7 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A NEW PRODUCT Typical Performance Characteristics (cont.) 1ms/div Figure 9. Reverse Current Limit Response(AP2552A/AP2553A) Figure 10. Reverse Current Limit vs. Ambient Temperature Figure 12. Quiescent Current vs. Ambient Temperature Figure 11. Quiescent Current vs. Ambient Temperature Figure 13. Switch On-Resistance vs. Ambient Temperature AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 Figure 14. Under-Voltage Lock Out vs. Ambient Temperature 8 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Application Note The AP2552/53 AND AP2552A/53A are integrated high-side power switches optimized for Universal Serial Bus (USB) that requires protection functions. The power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection features and special functions, makes these power switches ideal for hot-swap or hot-plug applications. Protection Features: Under-Voltage Lockout (UVLO) NEW PRODUCT Whenever the input voltage falls below UVLO threshold (~2.5V), the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Over-Current and Short-Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. The different overload conditions and the corresponding response of the AP2552/53 AND AP2552A/53A are outlined below: S.NO 1 Conditions Short-circuit condition at start-up Explanation Output is shorted before input voltage is applied or before the part is enabled Behavior of the AP2552/53 AND AP2552A/53A The IC senses the short circuit and immediately clamps output current to a certain safe level namely ISHORT. • At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. • After the current limit function has tripped (reached the overcurrent trip threshold), the device switches into current limiting mode and the current is clamped at ISHORT /ILIMIT. The current rises until ILIMIT or thermal limit. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. 2 Short-circuit or overcurrent condition Short-Circuit or Overload condition that occurs when the part is enabled. 3 Gradual increase from nominal operating current to ILIMIT Load increases gradually until the current-limit threshold.(ITRIG) Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-μF electrolytic capacitor on the output pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series. Current-Limit Threshold Programming The current-limit threshold can be programmed using an external resistor. The current-limit threshold is proportional to the current sourced out of ILIM. The recommended 1% resistor range for RLIM is 10kΩ ≤RLIM≤210kΩ. Figure 15 includes current-limit tolerance due to variations caused by temperature and process. This graph does not include the external resistor tolerance. The traces routing the RLIM resistor to the AP2552/53 and AP2552A/53A should be as short as possible to reduce parasitic effects on the current-limit accuracy. To design below a maximum current-limit threshold, find the intersection of RLIM and the maximum desired load current on the IOS(max) (ILIM) curve and choose a value of RLIM above this value. Programming the current limit below a maximum threshold is important to avoid current limiting upstream power supplies causing the input voltage bus to droop. The resulting minimum current-limit threshold is the intersection of the selected value of RLIM and the IOS(min) (ILIM) curve. AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 9 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Application Note (cont.) Current-Limit Threshold Programming (cont.) Current-Limit Threshold Equations (ILIMIT): 20200 RLIM 0.91 kΩ ILIM( TYP) (mA ) = 20620 RLIM 0.94 kΩ ILIM(MIN) (mA ) = 20211 RLIM 0.96 kΩ NEW PRODUCT ILIM(MAX) (mA ) = Figure 15. Current-Limit Threshold vs RLIM Thermal Protection Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or short-circuit faults are present for extended periods of time. The AP2552/53 AND AP2552A/53A implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +160°C (140°C in case the part is under current limit), the thermal protection feature gets activated as follows: The internal thermal sense circuitry turns the power switch off and the FAULT output is asserted thus preventing the power switch from damage. Hysteresis in the thermal sense circuit allows the device to cool down by approximately +20°C before the output is turned back on. This built-in thermal hysteresis feature is an excellent feature, as it avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the load fault is removed, resulting in a pulsed output. Reverse-Current and Reverse-Voltage Protection The USB specification does not allow an output device to source current back into the USB port. In a normal MOSFET switch, current will flow in reverse direction (from the output side to the input side) when the output side voltage is higher than the input side. A reverse-current limit (ROCP) feature is implemented in the AP2552/53 AND AP2552A/53A to limit such back currents. The ROCP circuit is activated when the output voltage is higher than the input voltage. After the reverse current circuit has tripped (reached the reverse current trip threshold), the current is clamped at this IROCP level. In addition to ROCP, reverse over-voltage protection (ROVP) is also implemented. The ROVP circuit is activated by the reverse voltage comparator trip point ie; the difference between the output voltage and the input voltage. For AP2552/53, once ROVP is activated, FAULT assertion occurs at a de-glitch time of 4ms. Recovery from ROVP is automatic when the fault is removed. FAULT de-assertion de-glitch time is same as the de-assertion time. AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 10 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Application Note (cont.) Reverse-Current and Reverse-Voltage Protection (cont.) For AP2552A/53A, once ROVP is activated and when the condition exists for more than 5ms (TYP), output device is disabled and shutdown. This is called the "Time from Reverse-Voltage Condition to MOSFET Turn Off”. FAULT assertion occurs at a de-glitch time of 4ms after ROVP is reached. Recovery from this fault is achieved by recycling power or toggling EN. FAULT de-assertion de-glitch time is same as the de-assertion time. NEW PRODUCT Special Functions: Discharge Function When enable is de-asserted, or when the input voltage is under UVLO level, the discharge function is active. The output capacitor is discharged through an internal NMOS that has a discharge resistance of 100Ω. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of the resistance and the output capacitor. FAULT Response The FAULT open-drain output goes active low for any of following faults: Current limit threshold, short- circuit current limit, reverse-voltage condition or thermal shutdown. The time from when a fault condition is encountered to when the FAULT output goes low is 7ms (TYP). The FAULT output remains low until over-current, short-circuit current limit and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current condition, which does not trigger the FAULT due to the 7ms deglitch timeout. This 7-ms timeout is also applicable for over-current recovery and over-temperature recovery. The AP2552/53 and AP2552-2/53A are designed to eliminate erroneous over-current reporting without the need for external components, such as an RC delay network. For the AP2552/53 and AP2552A/53A when the reverse voltage condition is triggered, FAULT output goes low after 4ms (TYP). This 4ms (TYP) timeout is also applicable for the recovery from reverse voltage fault. When the ILIM pin is shorted to IN or GND, current-limit threshold and short-circuit current limit will be clamped at typically 75mA.When the ILIM pin is shorted to IN or GND the AP2552/53 and AP2552A/53A FAULT pin will not assert during current limiting conditions; The FAULT pin will assert during short circuit conditions. Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage drop during line transients. Placing a high-value electrolytic capacitor on the input (10μF minimum) and output pin(120µF) is recommended when the output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing thedeviceoutput with a 0.1μF to 4.7μF ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents output from going negative during turn-off due to parasiticinductance. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x θJA + TA Where: TA= Ambient temperature °C θJA = Thermal resistance PD = Total power dissipation Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2552/53 AND AP2552A/53A, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2552/53 AND AP2552A/53A also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 11 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Application Note (cont.) Generic Hot-Plug Applications By placing the AP2552/53 AND AP2552A/53A between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. NEW PRODUCT Ordering Information AP 255X X XXX - 7 Latch-off Enable 2 : Active Low 3 : Active High Part Number AP2552W6-7 AP2552FDC-7 AP2553W6-7 AP2553FDC-7 AP2552AW6-7 AP2552AFDC-7 AP2553AW6-7 AP2553AFDC-7 Enable Active Output Current Limits High Low High Packing Blank : Non Latch-off W6 : SOT26 A : Latch-off FDC : U-DFN2020C-6 Output Fault Condition Low Package Output Latches Off Package Code Packaging W6 FDC W6 FDC W6 FDC W6 FDC SOT26 U-DFN2020C-6 SOT26 U-DFN2020C-6 SOT26 U-DFN2020C-6 SOT26 U-DFN2020C-6 7 : Tape & Reel 7” Tape and Reel Quantity Part Number Suffix 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 3000/Tape & Reel -7 Marking Information (1) SOT26 ( Top View ) 5 4 7 6 XX Y W X 1 Device AP2552W6 AP2553W6 AP2552AW6 AP2553AW6 AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 2 3 XX : Identification Code Y : Year 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code Package SOT26 SOT26 SOT26 SOT26 12 of 16 www.diodes.com Identification Code BJ BK BM BN December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Marking Information (cont.) (2) U-DFN2020C-6 ( Top View ) XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : Internal Code XX NEW PRODUCT YWX Device AP2552FDC AP2553FDC AP2552AFDC AP2553AFDC Package U-DFN2020C-6 U-DFN2020C-6 U-DFN2020C-6 U-DFN2020C-6 Identification Code BJ BK BM BN Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. (1) Package Type: SOT26 A B C H K M J (2) L D SOT26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ⎯ ⎯ 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 0° 8° α ⎯ All Dimensions in mm Package Type: U-DFN2020-6 A A3 SEATING PLANE A1 Pin#1 ID D D2 D2/2 E E2 L e b AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 ⎯ ⎯ b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e 0.65 ⎯ ⎯ E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm 13 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package Type: SOT26 C2 NEW PRODUCT C2 Z Dimensions Value (in mm) Z 3.20 G 1.60 X 0.55 Y 0.80 C1 G C1 C2 2.40 0.95 Y X (2) Package Type: U-DFN2020-6 Y C G X2 X1 Dimensions Z G X1 X2 Y C Value (in mm) 1.67 0.15 0.90 0.45 0.37 0.65 G Y Z AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 14 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A Taping Orientation (Note 11) NEW PRODUCT (1) Package Type: SOT26 (2) Package Type: U-DFN2020-6 Notes: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 15 of 16 www.diodes.com December 2012 © Diodes Incorporated AP2552/ AP2553/ AP2552A/ AP2553A IMPORTANT NOTICE NEW PRODUCT DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com AP2552/AP2553/AP2552A/AP2553A Document number: DS35404 Rev. 5 - 2 16 of 16 www.diodes.com December 2012 © Diodes Incorporated