BAV70LP DUAL SURFACE MOUNT SWITCHING DIODE Features Mechanical Data • • • • • • • • • • NEW PRODUCT Fast Switching Speed Ultra-Small Leadless Surface Mount Package (1.0 * 0.6mm) Ultra-Low Profile Package (0.5mm) Low Forward Voltage Fast Reverse Recovery Low Capacitance Lead, Halogen and Antimony Free, RoHS Compliant (Note 1) "Green" Device (Note 2) • • • • Case: X1-DFN1006-3 Case Material: Molded Plastic, "Green" Molding Compound. UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: Cathode Bar Terminals: Finish ⎯ NiPdAu over Copper Leadframe. Solderable per MIL-STD-202, Method 208 Weight: 0.0009 grams X1-DFN1006-3 Bottom View Top View Internal Schematic Ordering Information (Note 3) Part Number BAV70LP-7 Notes: Case X1-DFN1006-3 Packaging 3,000/Tape & Reel 1. No purposefully added lead. Halogen and Antimony Free. 2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com. 3. For packaging details, go to our website at http://www.diodes.com. Marking Information JA BAV70LP Document number: DS31597 Rev. 4 - 2 JA = Product Type Marking Code Bar Denotes Cathode Side 1 of 4 www.diodes.com TIME \@ "MMMM yyyy" January 2012 © Diodes Incorporated BAV70LP Maximum Ratings @TA = 25°C unless otherwise specified Characteristic Non-Repetitive Peak Reverse Voltage Symbol VRM VRRM VRWM VR VR(RMS) IFM IO IFRM NEW PRODUCT Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Forward Continuous Current (Note 4) Average Rectified Output Current (Note 4) Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current Value 100 Unit V 75 V V mA mA mA IFSM 53 300 150 450 2.0 1.0 Symbol PD RθJA TJ , TSTG Value 400 312 -65 to +150 Unit mW °C/W °C @ t = 1.0μs @ t = 1.0s A Thermal Characteristics Characteristic Power Dissipation (Note 4) Thermal Resistance Junction to Ambient Air (Note 4) Operating and Storage Temperature Range Electrical Characteristics @TA = 25°C unless otherwise specified Characteristic Reverse Breakdown Voltage (Note 5) Forward Voltage Symbol V(BR)R VF Min 75 Max ⎯ Unit V ⎯ 0.715 0.855 1.0 1.25 V Reverse Current (Note 5) IR ⎯ 2.5 50 30 25 Total Capacitance CT ⎯ 2.0 μA μA μA nA pF Reverse Recovery Time trr ⎯ 4.0 ns Notes: Test Condition IR = 2.5μA IF = 1.0mA IF = 10mA IF = 50mA IF = 150mA VR = 75V VR = 75V, TJ = 150°C VR = 25V, TJ = 150°C VR = 20V VR = 0, f = 1.0MHz IF = IR = 10mA, Irr = 0.1 x IR, RL = 100Ω 4. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com. 5. Short duration pulse test used to minimize self-heating effect. BAV70LP Document number: DS31597 Rev. 4 - 2 2 of 4 www.diodes.com January 2012 © Diodes Incorporated BAV70LP IF, INSTANTANEOUS FORWARD CURRENT (mA) PD, POWER DISSIPATION (mW) Note 4 400 300 200 100 0 0 25 50 75 100 125 TA, AMBIENT TEMPERATURE (°C) Fig. 1 Power Derating Curve 1,000 100 10 1 0.1 0.01 150 0 0.2 0.4 0.6 0.8 1.0 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Fig. 2 Typical Forward Characteristics, Per Element 1.10 100 10 TA = 150ºC CT, TOTAL CAPACITANCE (pF) IR, INSTANTANEOUS REVERSE CURRENT (µA) NEW PRODUCT 500 TA = 125ºC 1 TA = 8 5ºC 0.1 0.01 TA = 25ºC TA = -55ºC 0.001 1.00 0.90 0.80 0.70 0.0001 60 80 100 20 40 VR, INSTANTANEOUS REVERSE VOLTAGE (V) Fig. 3 Typical Reverse Characteristics, Per Element 1 10 100 VR, DC REVERSE VOLTAGE (V) Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element 0 Package Outline Dimensions A A1 D b1 E e b2 L2 BAV70LP Document number: DS31597 Rev. 4 - 2 L3 X1-DFN1006-3 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60 e 0.35 ⎯ ⎯ L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3 0.40 ⎯ ⎯ All Dimensions in mm L1 3 of 4 www.diodes.com January 2012 © Diodes Incorporated BAV70LP Suggested Pad Layout C Dimensions Z G1 G2 X X1 Y C X1 G2 NEW PRODUCT X G1 Y Value (in mm) 1.1 0.3 0.2 0.7 0.25 0.4 0.7 Z IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2012, Diodes Incorporated www.diodes.com BAV70LP Document number: DS31597 Rev. 4 - 2 4 of 4 www.diodes.com January 2012 © Diodes Incorporated