Rohm BD6722FS Multifunction single-phase full-wave fan motor driver Datasheet

Datasheet
DC Brushless Fan Motor Drivers
Multifunction Single-phase Full-wave
Fan Motor Driver
BD6722FS
●General description
BD6722FS is a half pre-driver that controls the source
side motor drive part composed of the power transistors.
Moreover, it corresponds to 800mA motor, because the
driving current and the composition parts are optimized.
●Package
SSOP-A16
●Features
„ Half pre-driver including power NDMOS FET
„ Speed controllable by DC / direct PWM input
„ PWM soft switching
„ Quick start
„ Current limit
„ Lock protection and automatic restart
„ Rotation speed pulse signal (FG) output
„ Lock alarm signal (AL) output
W (Typ.) x D (Typ.) x H (Max.)
6.60mm x 6.20mm x 1.71mm
SSOP-A16
●Application
„ Fan motors for general consumer equipment of desktop PC, and Server, etc.
●Absolute maximum ratings
Parameter
Supply voltage
Power dissipation
Operating temperature range
Storage temperature range
High side output voltage
Low side output voltage
Low side output current
Rotation speed pulse signal (FG) output voltage
Rotation speed pulse signal (FG) output current
Lock alarm signal (AL) output voltage
Lock alarm signal (AL) output current
Reference voltage (REF) output current
Input voltage (TH)
Junction temperature
*1
*2
Symbol
Vcc
Pd
Topr
Tstg
Voh
Vol
Iol
Vfg
Ifg
Val
Ial
Iref
Vin
Tj
Limit
20
812.5 *1
–40 to +100
–55 to +150
34
34
1.5 *2
20
10
20
10
8
15
150
Unit
V
mW
°C
°C
V
V
A
V
mA
V
mA
mA
V
°C
Reduce by 6.5mW/°C over Ta=25°C. (On 70.0mm×70.0mm×1.6mm glass epoxy board)
This value is not to exceed Pd.
●Recommended operating conditions
Parameter
Operating supply voltage range
Operating input voltage range (H+, H–, MIN)
(more than Vcc=9V)
Operating input voltage range (H+, H–, MIN)
(less than Vcc=9V)
○Product structure：Silicon monolithic integrated circuit
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Symbol
Vcc
Limit
4.5 to 17.0
Unit
V
0 to 7
V
0 to Vcc–2
V
Vin
○This product is not designed protection against radioactive rays
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Datasheet
BD6722FS
●Pin description
●Pin configuration
(TOP VIEW)
P/No.
1
T/Name
GND
GND
1
16
AL
2
OSC
OSC
2
15
FG
MIN
3
14
REF
TH
4
13
H–
3
4
5
6
7
MIN
TH
Vcc
A1H
A1L
Vcc
5
12
H+
8
RNF
9
10
11
12
13
14
15
16
A2L
A2H
CS
H+
H–
REF
FG
AL
A1H
6
11
CS
A1L
7
10
A2H
RNF
8
9
A2L
Fig.1 Pin configuration
Function
Ground terminal (signal ground)
Oscillating capacitor connecting
terminal
Minimum output duty setting terminal
Output duty controllable input terminal
Power supply terminal
High side output terminal 1
Low side output terminal 1
Output current detecting resistor
connecting terminal (motor ground)
Low side output terminal 2
High side output terminal 2
Output current detection terminal
Hall + input terminal
Hall – input terminal
Reference voltage output terminal
Speed pulse signal output terminal
Lock alarm signal output terminal
●Block diagram
1
2
3
4
GND
OSC
PWM SOFT
SWITCHING
TSD
OSC
PWM
COMP
TH
6
Vcc
8
SIGNAL
OUTPUT
FG
REF
CONTROL
LOGIC
REF
16
15
14
HALL
AMP
H–
13
HALL
COMP
QUICK
START
LOCK
PROTECT
A1H
H+
12
Vcl
CS
PREDRIVER
7
AL
PWM
COMP
MIN
Vcc
5
SIGNAL
OUTPUT
CURRENT
LIMIT COMP
11
A2H
A1L
10
RNF
A2L
9
Fig.2 Block diagram
●I/O truth table
Hall input
H+
H–
H
L
L
H
A1H
Hi-Z
L
A1L
L
Hi-Z
Driver output
A2H
L
Hi-Z
A2L
Hi-Z
L
FG
Hi-Z
L
H; High, L; Low, Hi-Z; High impedance
FG output is open-drain type.
Motor state
Rotating
Locking
AL
L
Hi-Z
L; Low, Hi-Z; High impedance
AL output is open-drain type.
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Datasheet
BD6722FS
●Electrical characteristics(Unless otherwise specified Ta=25°C, Vcc=12V)
Circuit current
Hall input hysteresis voltage
High side output current
High side output leak current
Low side output low voltage
Lock detection ON time
Lock detection OFF time
FG output low voltage
FG output leak current
AL output low voltage
AL output leak current
OSC high voltage
OSC low voltage
OSC charge current
OSC discharge current
Icc
Vhys
Ioh
Iohl
Voll
Ton
Toff
Vfgl
Ifgl
Vall
Iall
Vosch
Voscl
Icosc
Idosc
Min.
5
±5
5
018
3.6
2.24
0.8
–50
26
Limit
Typ.
8
±10
10
0.30
0.30
6.0
0.15
0.15
2.44
1.0
–32
32
Output ON duty 1
Poh1
75
80
85
%
Output ON duty 2
Poh2
45
50
55
%
Output ON duty 3
Poh3
15
20
25
%
Reference voltage
Current limit setting voltage
TH input bias current
MIN input bias current
Vref
Vcl
Ith
Imin
2.8
320
-
3.0
350
-
3.2
380
–0.2
–0.2
V
mV
µA
µA
Parameter
Symbol
Max.
11
±15
15
10
0.45
0.42
8.4
0.30
10
0.30
10
2.64
1.2
–26
50
Unit
mA
mV
mA
µA
V
s
s
V
µA
V
µA
V
V
µA
µA
Ref.
data
Conditions
Voh=12V
Voh=34V
Iol=600mA
Ifg=5mA
Vfg=17V
Ial=5mA
Val=17V
Vth=Vref x 0.429
Pull up resistance 1kΩ,
OSC=470pF
Vth=Vref x 0.573
Pull up resistance 1kΩ,
OSC=470pF
Vth=Vref x 0.717
Pull up resistance 1kΩ,
OSC=470pF
Iref=–2mA
Vth=0V
Vmin=0V
Fig.3
Fig.4
Fig.5
Fig.6
Fig.7, 8
Fig.9
Fig.10
Fig.11, 12
Fig.13
Fig.11, 12
Fig.13
Fig.14
Fig.14
Fig.15
Fig.15
-
-
Fig.16, 17
Fig.18
Fig.19
Fig.20
About a current item, define the inflow current to IC as a positive notation, and the outflow current from IC as a negative notation.
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Datasheet
BD6722FS
●Typical performance curves(Reference data)
10
25°C
–40°C
100°C
8
Circuit current: Icc[mA]
Hall input hysteresis voltage: Vhys[mV]
20
6
4
2
Operating range
100°C
25°C
10
–40°C
0
Operating range
–40°C
25°C
100°C
-10
-20
0
0
5
10
15
0
20
5
15
20
Supply voltage: Vcc[V]
Supply voltage: Vcc[V]
Fig.3 Circuit current
Fig.4 Hall input hysteresis voltage
8
High side output leak current: Iohl[uA]
17
High side output current: Ioh[mA]
10
14
25°C
–40°C
100°C
11
8
5
Operating range
2
6
4
2
100°C
25°C
–40°C
0
Operating range
-2
0
5
10
15
20
Supply voltage: Vcc[V]
10
20
30
40
Supply voltage: Voh[V]
Fig.5 High side output current
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Fig.6 High side output leak current
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Datasheet
BD6722FS
●Typical performance curves(Reference data)
1.0
1.0
5V
Low side output low voltage: Vol[V]
Low side output low voltage: Vol[V]
100°C
0.8
25°C
0.6
–40°C
0.4
0.2
0.0
17V
0.8
12V
0.6
0.4
0.2
0.0
0.0
0.3
0.6
0.9
1.2
1.5
0.0
0.3
0.6
Output sink current: Io[A]
1.2
1.5
Output sink current: Io[A]
Fig.7 Low side output low voltage (Vcc=12V)
Fig.8 Low side output low voltage (Ta=25°C)
8.0
0.35
Lock detection OFF time: Toff[s]
0.40
Lock detection ON time: Ton[s]
0.9
100°C
–40°C
25°C
0.30
0.25
7.0
100°C
–40°C
25°C
6.0
5.0
Operating range
Operating range
0.20
4.0
0
5
10
15
20
Supply voltage: Vcc[V]
5
10
15
20
Supply voltage: Vcc[V]
Fig.9 Lock detection ON time
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Fig.10 Lock detection OFF time
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Datasheet
BD6722FS
●Typical performance curves(Reference data)
0.8
FG/AL output low voltage: Vfgl/Vall[V]
FG/AL output low voltage: Vfgl/Vall[V]
0.8
0.6
0.4
100°C
25°C
–40°C
0.2
0.0
0.6
0.4
5V
12V
17V
0.2
0.0
0
2
4
6
8
10
0
Output sink current: Ifg/Ial[mA]
4
6
8
10
Output sink current: Ifg/Ial[mA]
Fig.11 FG/AL output low voltage (Vcc=12V)
Fig.12 FG/AL output low voltage (Ta=25°C)
3.0
OSC high/low voltage: Vosch/Voscl [V]
8
FG/AL output leak current: Ifgl/Iall[uA]
2
6
4
2
100°C
25°C
–40°C
0
Operating range
-2
100°C
25°C
–40°C
2.5
2.0
Operating range
1.5
100°C
25°C
–40°C
1.0
0.5
0
5
10
15
20
Supply voltage: Vcc[V]
5
10
15
20
Supply voltage: Vcc[V]
Fig.13 FG/AL output leak current
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Fig.14 OSC high/low voltage
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Datasheet
BD6722FS
●Typical performance curves(Reference data)
3.2
40
–40°C
25°C
100°C
20
Reference voltage: Vref[V]
OSC charge/discharge current: Icosc/Idosc [uA]
60
0
Operating range
-20
100°C
25°C
–40°C
-40
3.1
3.0
100°C
25°C
–40°C
2.9
Operating range
-60
2.8
0
5
10
15
20
0
5
Supply voltage: Vcc[V]
15
20
Supply voltage: Vcc[V]
Fig.15 OSC charge/discharge current
Fig.16 Reference voltage
3.2
380
3.1
3.0
100°C
25°C
2.9
–40°C
Current limit setting voltage: Vcl[mV]
Reference voltage: Vref[V]
10
365
100°C
25°C
350
–40°C
335
Operating range
320
2.8
0
2
4
6
0
8
10
15
20
Supply voltage: Vcc[V]
Output source current: Iref[mA]
Fig.17 Reference voltage current ability (Vcc=12V)
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Fig.18 Current limit setting voltage
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Datasheet
BD6722FS
●Typical performance curves(Reference data)
0.05
0.05
0.00
100°C
25°C
–40°C
MIN bias current: Imin[uA]
TH bias current: Ith[uA]
0.00
-0.05
-0.10
-0.15
100°C
25°C
-0.05
–40°C
-0.10
-0.15
Operating range
Operating range
-0.20
-0.20
0
5
10
15
20
Supply voltage: Vcc[V]
5
10
15
20
Supply voltage: Vcc[V]
Fig.19 TH bias current
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Fig.20 MIN bias current
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Datasheet
BD6722FS
●Application circuit example(Constant values are for reference)
Output PWM frequency setting
1
GND
PWM SOFT
SWITCHING
TSD
SIGNAL
OUTPUT
AL
SIGNAL
OUTPUT
FG
Protection of FG open-drain
16
Minimum output duty setting
330pF
to 1000pF
2
Circuit that converts PWM duty
into DC voltage
3
4
PWM
OSC
MIN
PWM
COMP
TH
PWM
COMP
CONTROL
LOGIC
Vcc
14
H–
13
7
Maximum output voltage and
current are 34V and 1.5A.
8
Hall bias is set according to the
amplitude of hall element
output and hall input voltage
range.
H
HALL
COMP
QUICK
START
LOCK
PROTECT
H+
12
Noise measures of substrate
Vcl
CS
A1H
PREDRIVER
So bypass capacitor,
arrangement near to Vcc
terminal as much as possible
Stabilization of REF voltage
0.1µF to
HALL
AMP
1µF to
6
SIG
15
0Ω to
REF
REF
Vcc
5
Reverse-connected prevention
of the FAN connector
OSC
CURRENT
LIMIT COMP
100pF
to 0.1µF
11
200Ω
to 20kΩ
A2H
A1L
10
RNF
A2L
Low-pass filter for RNF voltage
smoothing
9
Drive the PMOS FET gate by
constant current flowing to IC
＋
470Ω to 1kΩ
Reverse-connected prevention
of the FAN connector
So bypass capacitor,
arrangement near to FETs as
much as possible
1µF to
0Ω to 2kΩ
Adjustment the PMOS FET
slew rate
M
0.24Ω to
To limit motor current, the
current is detected.
Note the power consumption of
detection resistance.
－
Fig.21 PWM controllable 4 wires type (FG) motor application circuit
Substrate design note
a) Motor power and ground lines are made as fat as possible.
b) IC power line is made as fat as possible.
c) IC ground line is common with the application ground except motor ground (i.e. hall ground etc.), and arranged
near to (–) land.
d) The bypass capacitors (Vcc side and Vm side) are arrangement near to Vcc terminal and FETs, respectively.
e) H+ and H– lines are arranged side by side and made from the hall element to IC as shorter as possible,
because it is easy for the noise to influence the hall lines.
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Datasheet
BD6722FS
●Power dissipation
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is
heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The
temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, etc, and consumable
power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature)
and thermal resistance of package (heat dissipation capability). The maximum junction temperature is in general equal to
the maximum value in the storage temperature range.
Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter which
indicates this heat dissipation capability (hardness of heat release) is called heat resistance, represented by the symbol
θja[°C/W]. This heat resistance can estimate the temperature of IC inside the package. Fig.22 shows the model of heat
resistance of the package. Heat resistance θja, ambient temperature Ta, junction temperature Tj, and power consumption P
can be calculated by the equation below:
θja = (Tj – Ta) / P [°C/W]
Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal
resistance θja. Thermal resistance θja depends on chip size, power consumption, package ambient temperature, packaging
condition, wind velocity, etc., even when the same package is used. Thermal de-rating curve indicates a reference value
measured at a specified condition. Fig.23 shows a thermal de-rating curve (Value when mounting FR4 glass epoxy board
70[mm] x 70[mm] x 1.6[mm] (copper foil area below 3[%])). Thermal resistance θjc from IC chip joint part to the package
surface part of mounting the above-mentioned same substrate is shown in the following as a reference value.
θjc = 43 [°C/W] (reference value)
Pd[mW]
θja = (Tj – Ta) / P [°C/W]
θjc = (Tj – Tc) / P [°C/W]
812.5
750
θja=153.8 [°C/W]
Ambient temperature Ta[°C]
Package surface temperature Tc[°C]
500
250
0
25
50
75
100
125
150
Ta[°C]
＊Reduce by 6.5mW/°C over 25°C
(On 70.0mm x 70.0mm x 1.6mm glass epoxy board)
Chip surface temperature Tj[°C]
Power consumption P[W]
Fig.22 Thermal resistance
Fig.23 Thermal de-rating curve
●I/O equivalence circuit(Resistance values are typical)
1) Power supply terminal,
and Ground terminal
2) Hall input terminals,
3) Minimum output duty setting
Output duty controllable input
terminal
terminal, and
Output current detection
terminal
Vcc
4) High side output 1, 2
terminals,
Speed pulse signal output
terminal, and
Lock alarm signal output
terminal
Vcc
Vcc
MIN
H+
H–
TH
CS
1kΩ
30Ω
1kΩ
20Ω
A1H
A2H
FG
AL
GND
5) Low side output 1, 2
terminals, and
Output current detecting
resistor connecting terminal
6) Reference voltage output
terminal
A1L
A2L
Vcc
Vcc
Vcc
Vcc
REF
RNF
1kΩ
31kΩ
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7) Oscillating capacitor
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1kΩ
OSC
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Datasheet
BD6722FS
●Operational Notes
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection
devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a
capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (When applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
It is possible that the motor output terminal may deflect below GND terminal because of influence by back
electromotive force of motor. The potential of GND terminal must be minimum potential in all operating conditions,
except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor
coil. Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including
transient characteristics. Malfunction may possibly occur depending on use condition, environment, and property of
individual motor. Please make fully confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175°C (typ.) and has a
hysteresis width of 25°C (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an
open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the
IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an environment
where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps
as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is
possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor
between output and GND below 100µF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not
use in a manner where parasitic element is actuated.
14) In use
We are sure that the example of application circuit is preferable, but please check the character further more in
application to a part that requires high precision. In using the unit with external circuit constant changed, consider the
variation of externally equipped parts and our IC including not only static character but also transient character and
allow sufficient margin in determining.
●Status of this document
The Japanese version of this document is formal specification. A customer may use this translation version only for a
reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
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Datasheet
BD6722FS
●Physical dimension tape and reel information
SSOP-A16
<Tape and Reel information>
6.6 ± 0.2
(MAX 6.95 include BURR)
Tape
Embossed carrier tape
Quantity
2500pcs
9
Direction
of feed
0.3MIN
4.4±0.2
6.2±0.3
16 15 14 13 12 11 10
1
2
3
4
6
5
7
E2
The direction is the 1pin of product is at the upper left when you hold
( reel on the left hand and you pull out the tape on the right hand
)
8
0.11
1.5±0.1
0.15 ± 0.1
0.1
0.8
0.36 ± 0.1
Direction of feed
1pin
Reel
(Unit : mm)
∗ Order quantity needs to be multiple of the minimum quantity.
●Marking diagram
SSOP-A16
(TOP VIEW)
B D 6 7 2 2 F
Part Number
LOT Number
1PIN Mark
●Revision history
Date
Revision
07.JUL.2012
28.JUL.2012
001
002
Comments
New Release
Color appearance change (There is no change in the content.)
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
12/12
TSZ02201-0H1H0B100180-1-2
28.JUL.2012 Rev.002
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3.
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4.
The Products are not subject to radiation-proof design.
5.
Please verify and confirm characteristics of the final or mounted products in using the Products.
6.
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8.
Confirm that operation temperature is within the specified range described in the product specification.
9.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2.
In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
Precautions Regarding Application Examples and External Circuits
1.
If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2.
You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1.
Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2.
Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3.
Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4.
Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1.
All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2.
No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1.
This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2.
The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3.
In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4.
The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.002
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3.
The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
© 2014 ROHM Co., Ltd. All rights reserved.
Rev.001
Datasheet
BD6722FS - Web Page
Buy
Distribution Inventory
Part Number
Package
Unit Quantity
Minimum Package Quantity
Packing Type
Constitution Materials List
RoHS
BD6722FS
SSOP-A16
2500
2500
Taping
inquiry
Yes