AP2142/ AP2152 0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH Description Pin Assignments The AP2142 and AP2152 are integrated high-side power switches ( Top View ) optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and GND 1 8 NC IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. All devices are available in SO-8 and MSOP-8EP packages. SO-8 Features ( Top View ) • Dual USB port power switches • Over-current and thermal protection • 0.8A accurate current limiting GND 1 8 NC IN 2 7 OUT OUT FLG • Reverse Current Blocking IN 3 6 • 115mΩ on-resistance EN 4 • 5 Input voltage range: 2.7V – 5.5V • 0.6ms typical rise time • Very low shutdown current: 1uA (max) • Fault report (FLG) with blanking time (7ms typ) • ESD protection: 4.5KV HBM, 350V MM • Active high (AP2152) or active low (AP2142) enable • Ambient temperature range -40ºC to 85°C • MSOP-8EP Applications SO-8 and MSOP-8EP (Exposed Pad): Available in “Green” Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) UL Recognized, File Number E322375 • IEC60950-1 CB Scheme Certified Notes: Consumer electronics – LCD TV & Monitor, Game Machines Communications – Set-Top-Box, GPS, Smartphone • Molding Compound (No Br, Sb) • • • Computing – Laptop, Desktop, Servers, Printers, Docking Station, HUB 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. Typical Applications Circuit AP2152 Enable Active High Power Supply 2.7V to 5.5V IN 10k 10k 10uF OFF AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 0.1uF 68uF 0.1uF 68uF 0.1uF FLG1 FLG2 ON Load OUT1 EN1 EN2 OUT2 Load GND 1 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Available Options Part Number Channel AP2142 AP2152 2 2 Enable Pin (EN) Active Low Active High Current Limit (typ) 0.8A 0.8A Recommended Maximum Continuous Load Current 0.5A 0.5A Pin Descriptions Pin Name GND IN EN1 EN2 FLG2 OUT2 OUT1 FLG1 Pin Number SO-8 MSOP-8EP 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 Exposed Tab — Function Ground Voltage input pin Switch 1 enable input, active low (AP2142) or active high (AP2152) Switch 2 enable input, active low (AP2142) or active high (AP2152) Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered Switch 2 voltage output pin Switch 1 voltage output pin Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance. Exposed Tab It should not be used as electrical ground conduction path. Functional Block Diagram AP2142, AP2152 FLG 1 T h e rm a l S ense D e g litc h EN1 D riv e r C u rre n t L im it GND U VLO C u rre n t S ense OUT1 C u rre n t S ense OUT2 IN U VLO EN2 FLG 2 D riv e r C u rre n t L im it D e g litc h T h e rm a l S ense AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 GND 2 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage VOUT Output Voltage VEN , VFLG Enable Voltage ILOAD TJ(MAX) TST Rating 3 300 Maximum Continuous Load Current 6.5 V VIN + 0.3 V 6.5 V Internal Limited A 150 °C -65 to 150 °C Maximum Junction Temperature Storage Temperature Range (Note 4) Unit kV V Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C) Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Units 2.7 5.5 V Output Current 0 500 mA EN Input Logic Low Voltage 0 0.8 V VIH EN Input Logic High Voltage 2 VIN V TA Operating Ambient Temperature -40 85 °C VIN Input voltage IOUT VIL AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 3 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Electrical Characteristics (@TA = +25°C, VIN = +5V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max 1.6 1.9 2.5 V Disabled, IOUT = 0 0.5 1 µA Enabled, IOUT = 0 100 160 µA 1 µA 115 120 150 160 mΩ mΩ 180 mΩ VUVLO Input UVLO RLOAD = 1kΩ ISHDN Input Shutdown Current Input Quiescent Current, Dual IQ ILEAK Input Leakage Current Disabled, OUT grounded IREV Reverse Leakage Current Disabled, VIN = 0V, VOUT = 5V, IREV at VIN VIN = 5V, IOUT = 0.5A, -40°C ≤ TA ≤ +85°C 1 MSOP-8EP SO-8 µA RDS(ON) Switch on-resistance VIN = 3.3V, IOUT = 0.5A, -40°C ≤ TA ≤ 85°C 140 ISHORT Short-circuit current limit Enabled into short circuit, CL = 68µF 0.6 ILIMIT Over-Load Current Limit VIN = 5V, VOUT = 4.8V, CL = 68µF, -40°C ≤ TA ≤ +85°C ITrig Current limiting trigger threshold VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF VIL EN Input Logic Low Voltage VIN = 2.7V to 5.5V VIH EN Input Logic High Voltage VIN = 2.7V to 5.5V EN Input leakage VEN = 5V Output turn-on delay time CL=1µF, RLOAD = 10Ω 0.05 Output turn-on rise time CL=1µF, RLOAD = 10Ω 0.6 ISINK TD(ON) TR Unit 0.6 0.8 A 1.0 A 0.8 V 1 µA 1.0 A 2 V ms 1.5 ms Output turn-off delay time CL=1µF, RLOAD = 10Ω 0.01 Output turn-off fall time CL=1µF, RLOAD = 10Ω 0.05 0.1 RFLG FLG output FET on-resistance IFLG =10mA 30 50 Ω TBlank FLG blanking time CIN =10µF, CL = 68µF 7 15 ms TSHDN Thermal shutdown threshold Enabled, RLOAD = 1kΩ THYS Thermal shutdown hysteresis 25 SO-8 (Note 5) Thermal Resistance Junction-to-Ambient MSOP-8EP (Note 6) 110 60 TD(OFF) TF θJA Notes: 4 ms ms °C 140 °C o C/W o C/W 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout. 6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane. AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 4 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics VEN 50% TD(ON) 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% TF TD(ON) 90% VOUT 10% 90% 10% 90% 10% Figure 1. Voltage Waveforms: AP2142 (left), AP2152 (right) All Enable Plots are for AP2142 Active Low Channel 1 Turn-Off Delay and Fall Time Channel 1 Turn-On Delay and Rise Time Ven 1 5V/div Ven 1 5V/div CL = 1µF Vout 1 2V/div TA = +25°C Vout 1 2V/div RL = 10Ω CL = 1µF TA = +25°C RL = 10Ω 500µs/div 500µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div Vout 2 2V/div Vout 2 2V/div CL = 1µF TA = +25°C RL = 10Ω CL=1µF TA = +25°C RL = 10Ω 500µs/div 500µs/div AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 5 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Channel 1 Turn-Off Delay and Fall Time Channel 1 Turn-On Delay and Rise Time Ven 1 5V/div Ven 1 5V/div CL = 100µF Vout 1 2V/div TA = +25°C Vout 1 2V/div RL = 10Ω CL = 100µF TA = +25°C RL = 10Ω 500µs/div 500µs/div Channel 2 Turn-On Delay and Rise Time Channel 2 Turn-Off Delay and Fall Time Ven 2 5V/div Ven 2 5V/div CL = 100µF TA = +25°C Vout 2 2V/div RL = 10Ω Vout 2 2V/div CL = 100µF TA = +25°C RL = 10Ω 500µs/div 500µs/div Channel 1 Short Circuit Current, Device Enabled Into Short Channel 2 Short Circuit Current, Device Enabled Into Short Ven 1 5V/div Ven 2 5V/div Iout 1 200mA/div Iout 2 200mA/div VIN = 5V VIN = 5V TA = +25°C TA = +25°C CL = 22µF CL = 22µF 500µs/div AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 500µs/div 6 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Channel 2 Inrush Current Channel 1 Inrush Current Ven 1 5V/div Ven 2 5V/div CL = 100µF VIN = 5V TA = +25°C RL = 10Ω CL = 100µF Iout 1 200mA/div VIN = 5V TA = +25°C RL = 10Ω Iout 2 200mA/div CL = 470µF CL = 470µF CL = 220µF CL = 220µF 1ms/div 1ms/div Channel 1 2Ω Load Connected to Enabled Device Channel 1 1 Ω Load Connected to Enabled Device VIN = 5V VIN = 5V TA = +25°C CL = 22µF Vflag 1 2V/div Iout 1 1A/div TA = +25°C CL = 22µF Vflag 1 2V/div Iout 1 1A/div 2ms/div 2ms/div Channel 2 1 Ω Load Connected to Enabled Device Channel 2 2Ω Load Connected to Enabled Device VIN = 5V VIN = 5V TA = +25°C CL = 22µF Vflag 2 2V/div Iout 2 1A/div TA = +25°C CL = 22µF Vflag 2 2V/div Iout 2 1A/div 2ms/div AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 2ms/div 7 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Channel 1 Short Circuit with Blanking Time and Recovery Channel 2 Short Circuit with Blanking Time and Recovery VIN = 5V Vout 5V/div TA = +25°C VIN = 5V Vout 5V/div TA = +25°C CL = 22µF CL = 22µF Vflag 5V/div Vflag 5V/div Iout 1A/div Iout 1A/div 20ms/div 20ms/div Channel 1 Power On Channel 2 Power On Vflag 5V/div Vflag 5V/div TA = +25°C Iout 200mA/div CL = 22µF TA=25°C Iout 200mA/div CL=22uF RL=10Ω RL = 10Ω Ven 5V/div Ven 5V/div Vin 5V/div Vin 5V/div 1ms/div 1ms/div Channel 1 UVLO Increasing Channel 1 UVLO Decreasing TA = +25°C Vin 2V/div TA = +25°C CL = 22µF Vin 2V/div RL= 10Ω CL = 22µF RL = 10Ω Iout 200mA/div Iout 200mA/div 10ms/div 1ms/div AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 8 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Channel 2 UVLO Decreasing Channel 2 UVLO Increasing TA = +25°C Vin 2V/div TA = +25°C CL = 22µF Vin 2V/div RL = 10Ω CL = 22µF RL = 10Ω Iout 200mA/div Iout 200mA/div 1ms/div 10ms/div Channel 1 Enabled and Shorted with Channel 2 Disabled Channel 1 Disabled and Channel 2 Enabled Ven1 5V/div Vout 1 5V/div Vout 1 5V/div Vout 2 5V/div Ven2 5V/div Vflag 1 5V/div TA = +25°C TA = +25°C CL = 22µF CL = 22µF Iout 2 500mA/div Vout 2 5V/div 100ms/div AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 50ms/div 9 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Turn-Off Time vs Input Voltage 800 31 700 31 600 Turn-Off Time (us) Turn-On Time (us) Turn-On Time vs Input Voltage 500 400 300 CL = 1µF RL = 10Ω TA = +25°C 200 100 CL = 1µF RL = 10Ω TA = +25°C 30 30 29 29 28 28 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 4 4.5 25 500 24 400 23 Fall Time (us) 600 300 5.5 6 CL = 1µF 200 22 CL = 1µF 21 RL = 10Ω RL = 10Ω 20 TA = +25°C 100 TA = +25°C 19 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1.5 6 2 2.5 3 3.5 4 4.5 5 5.5 6 Input Voltage (V) Input Voltage (V) Supply Current, Output Disabled vs Ambient Temperature Supply Current, Output Enabled vs Ambient Temperature 1.60 60 Supply Current, Output Disabled (uA) 65 Supply Current, Output Enabled (uA) 5 Fall Time vs Input Voltage Rise Time vs Input Voltage Rise Time (us) 3.5 Input Voltage (V) Input Voltage (V) Vin=5.0V 55 Vin=5.5V 50 45 Vin=2.7V 40 Vin=3.3V 35 Vin=5.5V 1.40 1.20 Vin=5.0V 1.00 0.80 Vin=3.3V 0.60 Vin=2.7V 0.40 0.20 0.00 30 -60 -40 -20 0 20 40 60 80 100 -45 AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 -25 -5 15 35 55 75 95 Ambient Temperature (°C) Ambient Temperature (°C) 10 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Typical Performance Characteristics (cont.) Static Drain-Source On-State Resistance vs Ambient Temperature Short-Circuit Output Current vs Ambient Temperature 710 Short-Circuit Output Current (mA) 200 Static Drain-Source On-State Resistance (mΩ) 190 180 Vin=2.7V 170 Vin=3.3V 160 150 140 130 120 110 Vin=5V 100 -60 -40 -20 0 20 40 60 80 700 Vin=2.7V 690 Vin=3.3V Vin=5.0V 680 670 660 650 640 Vin=5.5V 630 100 -60 -40 -20 Ambient Temperature (°C) 0 20 40 60 80 100 Ambient Temperature (°C) Threshold Trip Current vs Input Voltage Undervoltage Lockout vs Ambient Temperature 1.15 2.05 2.03 Threshold Trip Current (A) Undervoltage Lockout (V) 2.04 UVLO Rising 2.02 2.01 2.00 1.99 UVLO Falling 1.98 1.97 1.14 1.13 1.12 TA = +25°C CL = 22µF 1.11 1.96 1.10 1.95 -60 -40 -20 0 20 40 60 80 100 2.8 3.3 3.8 4.3 4.8 5.3 Input Voltage (V) Ambient Temperature (°C) Current Limit Response vs Peak Current 45 Current Limit Response (us) 40 35 30 25 VIN = 5V 20 TA = +25°C 15 CL = 22µF 10 5 0 2 3 4 5 6 7 8 9 10 Peak Current (A) AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 11 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Application Information Power Supply Considerations A 0.01-μF to 0.1-μF X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2142/AP2152 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT. In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2142/AP2152 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at ILIMIT. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2142/AP2152 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: 2 PD = RDS(ON)× I Finally, calculate the junction temperature: TJ = PD x RθJA + TA Where: TA= Ambient temperature °C RθJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2142/AP2152 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch. AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 12 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Host/Self-Powered HUBs Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs. Figure 2. Typical Two-Port USB Host / Self-Powered Hub Generic Hot-Plug Applications In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2142/AP2152, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2142/AP2152 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion. By placing the AP2142/AP2152 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device. AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 13 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Ordering Information Part Number Package Code Packaging AP21X2SG-13 AP21X2MPG-13 S MP SO-8 MSOP-8EP Quantity 2500/Tape & Reel 2500/Tape & Reel 13” Tape and Reel Part Number Suffix -13 -13 Marking Information (1) SO-8 ( Top view ) 8 7 6 5 Logo Part Number 4 : Active Low 5 : Active High YY WW X X 2 1 (2) 2 : 2 Channel G : Green YY : Year : 08, 09,10~ WW : Week : 01~52; 52 represents 52 and 53 week X : Internal Code AP21X X 3 4 MSOP-8EP ( Top view ) 8 7 Logo AP21X X 1 Document number: DS31571 Rev. 6 - 2 5 YWXE Part Number 4 : Active Low 5 : Active High AP2142/ AP2152 6 2 3 A~Z : Green MSOP-8EP Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week 2 : 2 Channel 4 14 of 17 www.diodes.com January 2013 © Diodes Incorporated AP2142/ AP2152 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 0.254 (1) Package type: SO-8 E1 E A1 Gauge Plane Seating Plane L Detail ‘A’ h 7°~9° 45° Detail ‘A’ A2 A A3 b e D SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0° 8° θ All Dimensions in mm (2) Package type: MSOP-8EP D 4X 10 ° x E 0.25 D1 E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 c A2 A D L E1 See Detail C AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 15 of 17 www.diodes.com MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm January 2013 © Diodes Incorporated AP2142/ AP2152 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package type: SO-8 X Dimensions X Y C1 C2 C1 Value (in mm) 0.60 1.55 5.4 1.27 C2 Y (2) Package type: MSOP-8EP X C Y G Y2 Dimensions C G X X1 Y Y1 Y2 Y1 X1 AP2142/ AP2152 Document number: DS31571 Rev. 6 - 2 16 of 17 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 January 2013 © Diodes Incorporated AP2142/ AP2152 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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