AP2401/AP2411 Green 2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH WITH LATCH-OFF Description Pin Assignments The AP2401 and AP2411 are single channel current-limited (Top View) integrated high-side power switches optimized for Universal Serial 8 NC GND 1 Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and is available with both polarities of IN 2 7 OUT IN 3 6 OUT EN 4 5 FLG enable input. The devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage SO-8 capacitor. They provide a complete protection solution for applications (Top View) subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature GND 1 8 NC and short-circuit protection, as well as controlled rise time and IN 2 7 OUT IN EN 3 6 4 5 OUT FLG under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components. AP2401 and AP2411 will be MSOP-8/MSOP-8EP Note: Latter with exposed pad (dotted line) latched off after 7ms deglitch. All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6 packages. (Top View) Features GND IN IN EN Single Channel Current-Limited Power Switch Output Discharge Function Output Current Latch-Off when OCP Triggered Fast Short-Circuit Response Time: 2µs 2.5A Accurate Current Limiting Reverse Current Blocking 70mΩ On-Resistance Input Voltage Range: 2.7V - 5.5V Built-In Soft-Start with 0.6ms Typical Rise Time Over-Current and Thermal Protection Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 2kV HBM, 200V MM Active Low (AP2401) or Active High (AP2411) Enable Ambient Temperature Range: -40°C to +85°C SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6: Halogen and Antimony Free. “Green” Device (Note 3) IEC60950-1 CB Scheme Certified Notes: 6 OUT 4 5 FLG Applications Lead-Free Finish; RoHS Compliant (Notes 1 & 2) 7 OUT 3 U-DFN2020-6 UL Recognized, File Number E322375 8 NC 2 U-DFN3030-8 Available in “Green” Molding Compound (No Br, Sb) 1 LCD TVs & Monitors Set-Top-Boxes, Residential Gateways Laptops, Desktops, Servers, e-Readers Printers, Docking Stations, HUBs 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 1 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Typical Applications Circuit Enable Active High IN Power Supply 2.7V to 5.5V 0.1uF 0.1uF 10k Load OUT 120uF FLG EN ON GND OFF Available Options Part Number Channel Enable Pin (EN) AP2401 1 Active Low AP2411 1 Active High Recommended Maximum Continuous Load Current (A) Typical Output Latch-Off Current Limit (A) Package 2.5 SO-8 MSOP-8 MSOP-8EP U-DFN3030-8 U-DFN2020-6 2 Pin Descriptions Pin Name Pin Number Function MSOP-8EP, U-DFN2020-6 U-DFN3030-8 1 2 Ground 1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close 2, 3 as possible. (all IN pins must be tied together externally) GND SO-8, MSOP-8 1 IN 2, 3 EN 4 4 FLG 5 5 OUT 6, 7 6, 7 5 NC 8 8 6 Exposed Pad — Exposed Pad AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 3 4 Enable Input. Active low (AP2401) or active high (AP2411). Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain output. FLG is disabled for 7ms after turn-on. Voltage Output Pin (all OUT pins must be tied together externally) No Internal Connection. Recommend tie to OUT pins. Exposed pad. It should be externally connected to GND plane and thermal mass for Exposed Pad enhanced thermal impedance. Exposed pad should not be used as electrical ground conduction path. 2 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Functional Block Diagram Current Sense IN OUT Discharge Control UVLO Driver EN Current Limit FLG Deglitch Thermal Sense GND Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.) Symbol ESD HBM ESD MM VIN VOUT VEN , VFLG ILOAD TJ(MAX) TST Notes: Parameter Human Body Model ESD Protection Machine Model ESD Protection Input Voltage (Note 4) Output Voltage (Note 4) Enable Voltage (Note 4) Maximum Continuous Load Current Maximum Junction Temperature Storage Temperature Range (Note 4) Ratings 4 300 Unit kV V -0.3 to 6.5 -0.3 to VIN +0.3 or 6.5 -0.3 to VIN +0.3 or 6.5 Internal Limited 150 -65 to +150 V V V A °C °C 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V 5. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C). Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.) Symbol VIN IOUT VIL VIH TA Parameter Input voltage Output Current EN Input Logic Low Voltage EN Input Logic High Voltage Operating Ambient Temperature AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 Min 2.7 0 0 2 -40 3 of 18 www.diodes.com Max 5.5 2 0.8 VIN +85 Unit V A V V °C March 2013 © Diodes Incorporated AP2401/AP2411 Electrical Characteristics (@TA = +25°C, VIN = +5.0V, CIN = 0.1µF, CL= 1µF, unless otherwise specified.) Symbol Parameter VUVLO Input UVLO ΔVUVLO Input UVLO Hysteresis ISHDN Input Shutdown Current IQ ILEAK IREV RDS(ON) Input Quiescent Current Input Leakage Current Reverse Leakage Current Switch on-resistance Test Conditions (Note 5) VIN rising VIN decreasing Disabled, OUT = open Enabled, OUT = open Disabled, OUT grounded Disabled, VIN = 0V, VOUT = 5V, IREV at VIN TA = +25°C VIN = 5V, IOUT= 2.0A -40°C ≤ TA ≤ +85°C TA = +25°C VIN = 3.3V, IOUT= 2.0A -40°C ≤ TA ≤ +85°C Over-Load Current Limit (Note 6) VIN= 5V, VOUT= 4.5V Current limiting trigger threshold Short-Circuit Current Limit Short-circuit Response Time EN Input Logic Low Voltage Output Current Slew rate (< 100A/s) Enabled into short circuit VOUT = 0V to IOUT = ILIMIT (OUT shorted to ground) VIN = 2.7V to 5.5V EN Input Logic High Voltage VIN = 2.7V to 5.5V ILEAK-EN EN Input leakage VIN = 5V, VEN = 0V and 5.5V ILEAK-O TD(ON) TR TD(OFF) TF RFLG IFOH Output leakage current Output turn-on delay time Output turn-on rise time Output turn-off delay time Output turn-off fall time FLG output FET on-resistance FLG Off Current Disabled, VOUT = 0V CL = 1µF, RLOAD = 5Ω CL = 1µF, RLOAD = 5Ω CL = 1µF, RLOAD = 5Ω CL = 1µF, RLOAD = 5Ω IFLG = 10mA VFLG = 5V TBLANK FLG blanking and latch off time TDIS RDIS TSHDN Discharge time Discharge resistance (Note 7) Thermal Shutdown Threshold THYS Thermal Shutdown Hysteresis ILIMIT ITrig ISHORT TSHORT VIL VIH θJA Notes: Thermal Resistance Junction-toAmbient Min 1.6 -40°C ≤ TA ≤+85°C Assertion or deassertion due to overcurrent and overtemperature condition CL= 1µF, VIN = 5V, disabled to VOUT < 0.5V VIN = 5V, disabled, IOUT = 1mA Enabled Typ 2.0 50 0.1 Max 2.4 60 0.1 0.01 70 100 1 1 84 105 108 135 90 1 2.05 2.5 2.85 2.1 2.5 2.75 2 3.3 µA µA µA mΩ A 0.8 A A µs V 0.01 1 µA 0.5 0.1 0.6 0.1 0.05 20 0.01 1 0.1 40 1 µA ms ms ms ms Ω µA 15 ms 2 4 Unit V mV µA V 7 1.5 0.6 100 140 ms Ω °C SO-8 (Note 8) MSOP-8 (Note 8) MSOP-8EP (Note 9) U-DFN3030-8 (Note 9) 20 96 130 92 84 °C °C/W °C/W °C/W °C/W U-DFN2020-6 (Note 10) 90 °C/W 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. 7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when VIN < VUVLO. The discharge function offers a resistive discharge path for the external storage capacitor for limited time. 8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout. 9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. 10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground. AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 4 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Typical Performance Characteristics VEN 50% TD(ON) TD(ON) 90% 10% 10% TD(OFF) TR TF 90% 50% 50% TD(OFF) TR VOUT VEN 50% VOUT TF 90% 90% 10% 10% Figure 1 Voltage Waveforms: AP2401 (left), AP2411 (right) All Enable Plots are for Enable Active Low Turn-On Delay and Rise Time TA=25°C VIN=5V CL=1µF ROUT=2.5Ω Vout 2V/div Ven 5V/div Turn-Off Delay and Fall Time Vout 2V/div Ven 5V/div Device Disable Device Enable Iin 1A/div Iin 1A/div Turn-On Delay and Rise Time Vout 2V/div TA=25°C VIN=5V CL=120µF ROUT=2.5Ω Ven 5V/div Turn-Off Delay and Fall Time Inrush Current Limit AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 TA=25°C VIN=5V CL=120µF ROUT=2.5Ω Vout 2V/div Ven 5V/div Device Enable Iin 1A/div TA=25°C VIN=5V CL=1µF ROUT=2.5Ω Device Disable Iin 1A/div 5 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Typical Performance Characteristics (cont.) Device Enabled Into Short-Circuit TA=25°C VIN=5V CL=120µF ROUT=1Ω Ven 5V/div Inrush Current Ven 5V/div TA=25°C VIN=5V CL=120µF,220uF, 470µF ROUT=5Ω CL=470µF CL=220µF Iout 0.5A/div Iout 1A/div Full-Load to Short-Circuit Transient Response CL=120µF No-Load to Short-Circuit Transient Response Output Short Circuit Vout 2V/div Output Short Circuit TA=25°C VIN=5V ROUT=2.5Ω Iin 2A/div FLG 5V/div Device Turns off and Re-enables Into Current-Limit Device is latched-off AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 Vout 2V/div Iin 2A/div FLG 5V/div 6 of 18 www.diodes.com TA=25°C VIN=5V Device Turns off and Re-enables Into Current-Limit Device is latched-off March 2013 © Diodes Incorporated AP2401/AP2411 Typical Performance Characteristics (cont.) UVLO Increasing Power ON Vin 2V/div FLG 5V/div TA=25°C VIN=5V ROUT=2.5Ω CL=120µF IIout 1A/div TA=25°C VIN=5V ROUT=2.5Ω CL=120µF Vout 5V/div Iout 2A/div Vin 5V/div UVLO Decreasing Vin 2V/div TA=25°C VIN=5V ROUT=2.5Ω CL=120µF Iout 2A/div AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 7 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 260 240 220 Turn-Off Time (µs) 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 2 200 180 160 140 120 100 80 60 CL = 1µF 40 RL = 5 TA = 25°C 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Turn-On vs. Input Voltage 20 0 6 2 1000 100 900 90 800 80 700 70 Fall Time (µs) Rise Time (µs) Turn-On Time (µs) Typical Performance Characteristics (cont.) 600 500 400 3 3.5 4 4.5 5 5.5 Input Voltage (V) Turn-Off vs. Input Voltage 6 2.5 3 6 60 50 40 30 300 20 CL = 1µF 200 RL = 5 TA = 25°C 100 0 2.5 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Rise Time vs. Input Voltage AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 10 0 6 8 of 18 www.diodes.com 2 3.5 4 4.5 5 5.5 Input Voltage (V) Fall Time vs. Input Voltage March 2013 © Diodes Incorporated AP2401/AP2411 Typical Performance Characteristics (cont.) 0.30 90 Supply Current Output Disabled (µA) Supply Current Output Enabled (µA) 100 VIN = 5.5V 80 VIN = 5V 70 60 VIN = 3.3V 50 VIN = 2.7V 40 30 20 10 0 -50 - 25 25 50 75 100 125 Temperature (C) Supply Current, Output Enabled vs. Temperature 0.05 VIN = 2.7V -0.05 -0.10 -0.15 -0.20 -0.25 25 50 75 100 125 Temperature (C) Supply Current, Output Disabled vs. Temperature VIN = 2.7V -25 0 VIN = 3.3V VIN = 5V -25 0 VIN = 5.5V 25 50 75 100 Temperature (°C) RDS(ON) vs. Temperature 2.6 2.5 2.2 2.1 25 50 75 100 125 Temperature (°C) Short-Circuit, Output Current vs. Temperature UVLO Falling 1.85 1.80 1.75 Threshold Trip Current (A) 3.4 1.95 VIN = 5.5V 2.3 2.10 2.00 VIN = 5V 2.4 3.5 UVLO Rising VIN = 3.3V 2.7 2.0 -50 125 2.05 VIN = 2.7V 2.8 2.15 1.70 1.65 -50 VIN = 3.3V 0 Short-Circuit Output Current (A) RDS(ON) (m) Undervoltage Lockout (V) 0.10 2.9 120 110 1.90 VIN = 5V 0.15 3.0 150 140 130 100 90 80 70 60 50 40 -50 0.20 -0.30 -50 0 180 170 160 VIN = 5.5V 0.25 -25 0 CL = 120µF TA = 25°C 3.3 3.2 3.1 3.0 2.9 2.8 2.7 2.6 -25 2.5 0 25 50 75 100 125 Temperature (°C) Undervoltage Lockout vs. Temperature AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 9 of 18 www.diodes.com 2 2.5 3 3.5 4 4.5 5 5.5 Input Voltage (V) Turn-Off vs. Input Voltage 6 March 2013 © Diodes Incorporated AP2401/AP2411 Application Information Power Supply Considerations A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device to short circuit transients. Over-Current and Short Circuit Protection An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the devices will limit the current until the overload condition is removed or the internal deglitch time (7-ms typical) is reached and the device is turned off. The device will remain latched off even overload condition is removed until power is cycled or the device enable is toggled. Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN has been applied. The AP2401/AP2411 senses the short circuit and immediately clamps output current to a certain safe level namely ILIMIT, and turns off after deglitch time(7-ms typical). In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at ILIMIT current for deglitch time period (7-ms typical), and then turned off. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (ITRIG) is reached or until the thermal limit of the device is exceeded. The AP2401/AP2411 is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and output current is clamped at ILIMIT for deglitch time period (7-ms typical), and then turned off. FLG Response When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms deglitch timeout. When that happens, the FLG will remain low and the switch will be latched off until the fault condition is removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2401/AP2411 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses. Power Dissipation and Junction Temperature The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (TA) and RDS(ON), the power dissipation can be calculated by: PD = RDS(ON)× I 2 Finally, calculate the junction temperature: TJ = PD x RJA + TA Where: TA= Ambient temperature°C RJA = Thermal resistance PD = Total power dissipation Thermal Protection Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2401/AP2411 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately +140°C due to excessive power dissipation in an over-current condition, the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown occurs with 7-ms deglitch. When the FLG is asserted, the switch will be latched off until the temperature drops to 20°C below the thermal shutdown threshold and the power or EN pin is cycled. AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 10 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Application Information (cont.) Under-Voltage Lockout (UVLO) Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V, even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. Discharge Function The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue of the output voltage when either no external output resistance or load resistance is present at the output. Ordering Information Part Number Status AP24X1S-13 New Product S SO-8 AP24X1M8-13 AP24X1MP-13 AP24X1FGE-7 AP24X1SN-7 New Product New Product New Product Preview M8 MP FGE SN MSOP-8 MSOP-8EP U-DFN3030-8 U-DFN2020-6 Package Code Packaging 7”/13” Tape and Reel Quantity Part Number Suffix 2500/Tape & Reel -13 2500/Tape & Reel 2500/Tape & Reel 3000/Tape & Reel 3000/Tape & Reel -13 -13 -7 -7 Marking Information (1) SO-8 AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 11 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Marking Information (cont.) (2) MSOP-8 (3) MSOP-8EP (4) U-DFN3030-8 ( Top View ) XX YW X Part Number AP2401FGE-7 AP2411FGE-7 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Package U-DFN3030-8 U-DFN3030-8 Identification Code BD BF (5) U-DFN2020-6 ( Top View ) XX YW X Part Number AP2401SN-7 AP2411SN-7 AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 XX : Identification Code Y : Year : 0~9 W : Week : A~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : A~Z : Internal Code Package U-DFN2020-6 U-DFN2020-6 12 of 18 www.diodes.com Identification Code DD DF March 2013 © Diodes Incorporated AP2401/AP2411 Package Outline Dimensions (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. Package type: SO-8 0.254 1. E1 E A1 Gauge Plane Seating Plane L Detail ‘A’ h 7°~9° 45° Detail ‘A’ A2 A A3 b e D 2. SO-8 Dim Min Max A 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h 0.35 L 0.62 0.82 0 8 All Dimensions in mm Package type: MSOP-8 D 4x 10 ° 0.25 E Gauge Plane x Seating Plane a y 4x10° L Detail C 1 b E3 A3 A2 A e A1 AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 E1 c See Detail C 13 of 18 www.diodes.com MSOP-8 Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm March 2013 © Diodes Incorporated AP2401/AP2411 Package Outline Dimensions (cont.) (All dimensions in mm.) Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version. 3. Package type: MSOP-8EP D 4X 10 ° x E 0.25 D1 E2 Gauge Plane Seating Plane a y 1 4X 10 ° 8Xb e Detail C E3 A1 A3 c A2 A L D E1 See Detail C 4. Package type: U-DFN3030-8 Type E U-DFN3030-8 Type E Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.02 A3 0.15 b 0.20 0.30 0.25 D 2.95 3.05 3.00 D2 2.15 2.35 2.25 E 2.95 3.05 3.00 e 0.65 E2 1.40 1.60 1.50 L 0.30 0.60 0.45 Z 0.40 All Dimensions in mm A A3 A1 D D2 L (x8) E E2 Z (x4) 5. MSOP-8EP Dim Min Max Typ A 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39 b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00 D1 1.60 2.00 1.80 E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95 e 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x 0.750 y 0.750 All Dimensions in mm e b (x8) Package type: U-DFN2020-6 A A3 SEATING PLANE A1 Pin#1 ID D D2 D2/2 E E2 L e AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm b 14 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Suggested Pad Layout Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (1) Package type: SO-8 X Dimensions X Y C1 C2 C1 C2 Value (in mm) 0.60 1.55 5.4 1.27 Y (2) Package type: MSOP-8 X C Y Dimensions Value (in mm) C 0.650 X 0.450 Y 1.350 Y1 5.300 Y1 (3) Package type: MSOP-8EP X C Dimensions C G X X1 Y Y1 Y2 Y G Y2 Y1 X1 AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 15 of 18 www.diodes.com Value (in mm) 0.650 0.450 0.450 2.000 1.350 1.700 5.300 March 2013 © Diodes Incorporated AP2401/AP2411 Suggested Pad Layout (cont.) Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version. (4) Package type: U-DFN3030-8 Type E X (x8) C Y (x8) Y1 Dimensions C C1 X Y Y1 Y2 Y2 Value (in mm) 0.65 2.35 0.30 0.65 1.60 2.75 C1 (5) Package type: U-DFN2020-6 Y C Dimensions Z G X1 X2 Y C G X2 X1 Value (in mm) 1.67 0.15 0.90 0.45 0.37 0.65 G Y Z AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 16 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 Taping Orientation (Note 11) For U-DFN2020-6 and U-DFN3030-8 Type E Note: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 17 of 18 www.diodes.com March 2013 © Diodes Incorporated AP2401/AP2411 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. 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Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright © 2013, Diodes Incorporated www.diodes.com AP2401/AP2411 Document number: DS35113 Rev. 6 - 2 18 of 18 www.diodes.com March 2013 © Diodes Incorporated